CD4071B-MIL

AKTIV

4-Kanal-OR-Gatter mit 2 Eingängen, 3 V bis 18 V (Militär)

Produktdetails

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 1.5 IOH (max) (mA) -1.5 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Military Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 1.5 IOH (max) (mA) -1.5 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 8 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Standardized, symmetrical output characteristics
  • Noise margin (full package-temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

  • Medium-Speed Operation - tPLH, tPHL = 60 ns (typ.) at VDD = 10 V
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Standardized, symmetrical output characteristics
  • Noise margin (full package-temperature range):
         1 V at VDD = 5 V
         2 V at VDD = 10 V
      2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor

CD4071B, CD4072B and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates.

The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes) and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4071B, CD4072B and CD4075B OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates.

The CD4071B, CD4072B, and CD4075B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes) and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 7
Typ Titel Datum
* Data sheet CD4071B, CD4072B, CD4075B TYPES datasheet (Rev. D) 21 Aug 2003
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dez 2001

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
CDIP (J) 14 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos