AM62L

ACTIVO

SoC Arm® Cortex®-A53 de baja potencia con pantalla para aplicaciones IOT, HMI y de uso general

Detalles del producto

CPU 1 Arm Cortex-A53, 2 Arm Cortex-A53 Frequency (MHz) 1250 Display type 1 DSI, MIPI DPI Protocols Ethernet, TSN Hardware accelerators CPU only Features General purpose Operating system Linux Security Secure boot Rating Catalog Power supply solution TPS65214 Operating temperature range (°C) -40 to 125 Edge AI enabled Yes
CPU 1 Arm Cortex-A53, 2 Arm Cortex-A53 Frequency (MHz) 1250 Display type 1 DSI, MIPI DPI Protocols Ethernet, TSN Hardware accelerators CPU only Features General purpose Operating system Linux Security Secure boot Rating Catalog Power supply solution TPS65214 Operating temperature range (°C) -40 to 125 Edge AI enabled Yes
FCCSP (ANB) 373 141.6 mm² 11.8 x 12

Processor Cores:

  • Dual 64-bit Arm Cortex-A53 microprocessor subsystem up to 1.25GHz
    • Dual-core Cortex-A53 with 256KB L2 Cache
    • Each A53 core has 32KB L1 DCache and 32KB L1 ICache

Memory Subsystem:

  • 160KB of Shared On-Chip SRAM (OCSRAM)
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4, DDR4 memory types
    • 16-bit data bus
    • Supports speeds up to 1600MT/s
    • Max DDR4 addressing range of 4GB
    • Max LPDDR4 addressing range of 2GB

Multimedia:

  • Display Subsystem
    • Single display support
    • Up to 1920x1080 @ 60fps
    • Supported with independent PLL
    • MIPI DSI (4 lanes DPHY) or DPI (24-bit RGB LVCMOS)

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
      • AES – 128-/192-/256-bit key sizes
      • SHA2 – 224-/256-/384-/512-bit key sizes
      • DRBG with true random number generator
      • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Priority based flow control
    • Packet Classifier based on ALE engine with 64 classifiers
    • Time sensitive networking (TSN) support
    • H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • 2× USB 2.0 Dual-Role Device (DRD) Subsystems (USBSS)
    • Port configurable as USB host or USB device
    • USB device: High-speed (480Mbps), and Full-speed (12Mbps)
    • USB host: High-speed (480Mbps), Full-speed (12Mbps), and Low-speed (1.5Mbps)
    • xHCI 1.1 compatible

General Connectivity:

  • 8x Universal Asynchronous Receiver-Transmitters (UARTs)
    • All instances Support RTS and CTS Flow Control
    • Supports RS-485 external transceiver auto flow control
  • 4x Serial Peripheral Interface (SPI) controllers
  • 5x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASPs)
    • Transmit and Receive clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASPs with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and similar formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 formats)
    • FIFO buffers for Transmit and Receive (256Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), most LVCMOS I/O can be configured as GPIO
    • 4 banks supported for dual-voltage (1.8V/3.3V) and the rest single-voltage (1.8V) LVCMOS I/O banks
  • 3x Controller Area Network (CAN) with optional CAN-FD support
    • Conforms with CAN Protocol 2.0 A, B, and ISO 11898-1
    • Full CAN-FD support (up to 64 data bytes)
    • Speed up to 8Mbps
  • 1x 12-bit Analog-to-Digital Converter (ADC)
    • 10 bits of effective resolution (ENOB ≅ 10)
    • Up to 2MSPS
    • 4x analog inputs (time-multiplexed)

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.01, and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-Bit Synchronous or Asynchronous Memory Interfaces with up to four Chip Selects
    • Supports 16-bit Muxed Address/Data schemes (AD, AAD)
    • Uses BCH code to support 4-, 8-, or 16-bit ECC
    • Uses Hamming code to support 1-bit ECC
    • Error Locator Module (ELM)
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR Flash devices
    • 4GBytes memory address support

Power Management:

  • Active power management features such as auto clock gating, power gating, and dynamic frequency scaling
  • Several low-power features supported
  • Low-Power Modes
    • RTC Only
    • RTC + IO + DDR
    • DeepSleep
    • Standby

Boot Options:

  • UART
  • OSPI/QSPI Flash
  • GPMC NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass storage
  • USB (device) boot from external host (DFU mode)

Technology / Package:

  • 16-nm Technology
  • 11.9mm × 11.9mm, 0.5mm VCA, 373-pin FCCSP BGA package (ANB)

Processor Cores:

  • Dual 64-bit Arm Cortex-A53 microprocessor subsystem up to 1.25GHz
    • Dual-core Cortex-A53 with 256KB L2 Cache
    • Each A53 core has 32KB L1 DCache and 32KB L1 ICache

Memory Subsystem:

  • 160KB of Shared On-Chip SRAM (OCSRAM)
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4, DDR4 memory types
    • 16-bit data bus
    • Supports speeds up to 1600MT/s
    • Max DDR4 addressing range of 4GB
    • Max LPDDR4 addressing range of 2GB

Multimedia:

  • Display Subsystem
    • Single display support
    • Up to 1920x1080 @ 60fps
    • Supported with independent PLL
    • MIPI DSI (4 lanes DPHY) or DPI (24-bit RGB LVCMOS)

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
      • AES – 128-/192-/256-bit key sizes
      • SHA2 – 224-/256-/384-/512-bit key sizes
      • DRBG with true random number generator
      • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Priority based flow control
    • Packet Classifier based on ALE engine with 64 classifiers
    • Time sensitive networking (TSN) support
    • H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • 2× USB 2.0 Dual-Role Device (DRD) Subsystems (USBSS)
    • Port configurable as USB host or USB device
    • USB device: High-speed (480Mbps), and Full-speed (12Mbps)
    • USB host: High-speed (480Mbps), Full-speed (12Mbps), and Low-speed (1.5Mbps)
    • xHCI 1.1 compatible

General Connectivity:

  • 8x Universal Asynchronous Receiver-Transmitters (UARTs)
    • All instances Support RTS and CTS Flow Control
    • Supports RS-485 external transceiver auto flow control
  • 4x Serial Peripheral Interface (SPI) controllers
  • 5x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASPs)
    • Transmit and Receive clocks up to 50MHz
    • Up to 4/6/16 Serial Data Pins across 3x McASPs with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and similar formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 formats)
    • FIFO buffers for Transmit and Receive (256Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), most LVCMOS I/O can be configured as GPIO
    • 4 banks supported for dual-voltage (1.8V/3.3V) and the rest single-voltage (1.8V) LVCMOS I/O banks
  • 3x Controller Area Network (CAN) with optional CAN-FD support
    • Conforms with CAN Protocol 2.0 A, B, and ISO 11898-1
    • Full CAN-FD support (up to 64 data bytes)
    • Speed up to 8Mbps
  • 1x 12-bit Analog-to-Digital Converter (ADC)
    • 10 bits of effective resolution (ENOB ≅ 10)
    • Up to 2MSPS
    • 4x analog inputs (time-multiplexed)

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital (MMC/SD) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.01, and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133MHz
    • Flexible 8- and 16-Bit Synchronous or Asynchronous Memory Interfaces with up to four Chip Selects
    • Supports 16-bit Muxed Address/Data schemes (AD, AAD)
    • Uses BCH code to support 4-, 8-, or 16-bit ECC
    • Uses Hamming code to support 1-bit ECC
    • Error Locator Module (ELM)
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR Flash devices
    • 4GBytes memory address support

Power Management:

  • Active power management features such as auto clock gating, power gating, and dynamic frequency scaling
  • Several low-power features supported
  • Low-Power Modes
    • RTC Only
    • RTC + IO + DDR
    • DeepSleep
    • Standby

Boot Options:

  • UART
  • OSPI/QSPI Flash
  • GPMC NAND Flash
  • SD Card
  • eMMC
  • USB (host) Mass storage
  • USB (device) boot from external host (DFU mode)

Technology / Package:

  • 16-nm Technology
  • 11.9mm × 11.9mm, 0.5mm VCA, 373-pin FCCSP BGA package (ANB)

The low-cost & performance optimized AM62L family of application processors are built for Linux application development. With scalable Arm Cortex-A53 core performance and embedded features such as: Multimedia DSI/DPI support, integrated ADC on chip, advanced lower power management modes, and extensive security options for IP protection with the built-in security features.

The AM62Lx devices includes an extensive set of peripherals that make it a well-suited general-purpose device for a broad range of industrial applications while offering intelligent features and optimized power architecture as well. In addition, the extensive set of peripherals included in AM62Lx enables system-level connectivity, such as: USB, MMC/SD, OSPI, CAN-FD and an ADC.

The low-cost & performance optimized AM62L family of application processors are built for Linux application development. With scalable Arm Cortex-A53 core performance and embedded features such as: Multimedia DSI/DPI support, integrated ADC on chip, advanced lower power management modes, and extensive security options for IP protection with the built-in security features.

The AM62Lx devices includes an extensive set of peripherals that make it a well-suited general-purpose device for a broad range of industrial applications while offering intelligent features and optimized power architecture as well. In addition, the extensive set of peripherals included in AM62Lx enables system-level connectivity, such as: USB, MMC/SD, OSPI, CAN-FD and an ADC.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet AM62Lx Sitara™ Processors datasheet (Rev. B) PDF | HTML 30 nov 2025
* Errata AM62Lx Sitara Processors Silicon Errata (Rev. B) PDF | HTML 07 oct 2025
* User guide AM62L Technical Reference Manual (Rev. A) 30 sep 2025
Application note Throughput Characterization of OSPI and QSPI Serial NOR/NAND Flash Operations PDF | HTML 17 feb 2026
User guide Hardware Design Considerations for Custom Board Design Using AM62L (AM62L32, AM62L31) Family of Processors (Rev. B) PDF | HTML 27 ene 2026
User guide AM62L Power Visualizer User's Guide PDF | HTML 05 dic 2025
Application note Convert Sitara MPU HS-FS Silicon to HS-SE with No Boot Mode Switch PDF | HTML 05 dic 2025
Application note Enabling Matter on Sitara MPU (Rev. A) PDF | HTML 24 nov 2025
Application note Thermal Management of TDA4x and AM6x PDF | HTML 30 oct 2025
Application note AM62L Power Consumption Summary PDF | HTML 20 oct 2025
Application note Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. H) PDF | HTML 17 oct 2025
Application note AM62Lx Power Supply Implementation (Rev. B) PDF | HTML 10 oct 2025
Application note AM625x/AM623x and AM62Lx Hardware Migration Guide PDF | HTML 06 oct 2025
Application note AM62L Power Estimation Tool PDF | HTML 22 sep 2025
Application note AM62x, AM62Ax, AM62Px, AM62Lx Spread-Spectrum Clocking PDF | HTML 08 sep 2025
Application note Custom Board Design and Simulation Guidelines for Processor High Speed Parallel Interfaces (Rev. A) PDF | HTML 05 sep 2025
Application note Processors Tools Overview PDF | HTML 16 jun 2025
Application note Sitara™AM62Lx Benchmarks PDF | HTML 10 mar 2025
Application note AM62x, AM62Lx DDR Board Design and Layout Guidelines (Rev. C) PDF | HTML 05 mar 2025
Application brief AM62L Maximum Current Ratings PDF | HTML 04 mar 2025
User guide AM62L (AM62L32, AM62L31) Processor Family Schematic Design Guidelines and Schematic Review Checklist PDF | HTML 03 mar 2025
Product overview AM62L - Low Power Cortex A53 SoC for Cost Optimized IOT, HMI, and General-Purpose Applications PDF | HTML 03 mar 2025
White paper Securing Arm-Based Application Processors (Rev. F) PDF | HTML 26 feb 2025
Application brief Growing Need of Processing Technologies in Smart E - Meters PDF | HTML 21 feb 2025
Application note AM62Lx Escape Routing Guidelines PDF | HTML 26 mar 2024

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMDS62LEVM — Módulo de evaluación AM62L

El módulo de evaluación (EVM) TMDS62LEVM está diseñado para la familia de procesadores de aplicaciones AM62L de bajo costo y rendimiento optimizado. El AM62L tiene un rendimiento básico Arm® Cortex®-A53 escalable y funciones integradas como las siguientes: Compatibilidad con DSI multimedia, ADC (...)
Guía del usuario: PDF
Placa de evaluación

IWAVE-3P-OSM-LF-AM62LX — iWave Global TI AM62Lx OSM Size-S System on Module

iWave’s iG-RainboW-G69M OSM Size-SF System on Module integrates the TI AM62Lx SoC featuring dual 64-bit Arm® Cortex®-A53 cores running up to 1.25GHz. Built on the OSM v1.2 standard with a compact 30mm x 30mm LGA form factor, it supports 1GB LPDDR4 (expandable to 2GB), 8GB eMMC (expandable), and (...)

Tarjeta secundaria

AM62L-EVSE-DEV-EVM — Módulo de evaluación AM62L EVSE

El AM62L-EVSE-DEV-EVM forma parte de la plataforma de desarrollo TI-EVSE para AM62L y representa un controlador de carga universal para las estaciones de carga de CA y CC con pila de programas de código abierto. La plataforma completa consta de tres piezas independientes, el EVM AM62L (TMDS62LEVM), (...)

Guía del usuario: PDF | HTML
Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. Para la mayoría de los dispositivos, se recomienda utilizar el XDS110 (www.ti.com/tool/TMDSEMU110-U), que es más nuevo y de menor costo. El XDS200 es compatible con una amplia variedad de (...)

Sonda de depuración

LB-3P-TRACE32-ARM — Sistema de depuración y seguimiento Lauterbach TRACE32 para microcontroladores y procesadores basado

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of Arm®-based microcontrollers and processors. The globally renowned debug and trace solutions for embedded systems and SoCs are the perfect (...)

Kit de desarrollo de software (SDK)

AM62L-FREERTOS-SDK FreeRTOS SDK for AM62L family of devices

The AM62L processor Linux® and TI FreeRTOS software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across TI's broad portfolio for which they are (...)

Productos y hardware compatibles

Productos y hardware compatibles

Examinar Opciones de descarga
Kit de desarrollo de software (SDK)

AM62L-LINUX-RT-SDK Linux RT SDK for AM62L family of devices

The AM62L processor Linux® and TI FreeRTOS software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across TI's broad portfolio for which they are (...)

Productos y hardware compatibles

Productos y hardware compatibles

Opciones de descarga
Kit de desarrollo de software (SDK)

AM62L-LINUX-SDK Linux SDK for AM62L family of devices

The AM62L processor Linux® and TI FreeRTOS software development kits (SDKs) are unified software platforms for embedded processors providing easy setup and fast out-of-box access to benchmarks and demonstrations.

All releases of this SDK are consistent across TI's broad portfolio for which they are (...)

Productos y hardware compatibles

Productos y hardware compatibles

Opciones de descarga
Primeros pasos

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
Productos y hardware compatibles

Productos y hardware compatibles

IDE, configuración, compilador o depurador

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles

Iniciar Opciones de descarga
IDE, configuración, compilador o depurador

CLOCKTREE-AM62L Clock tree configuration for AM62L


The Clock Tree Tool (CTT) for ARM Processors & Digital Signal Processors is an interactive configuration software tool that provides information about device clock tree architecture. This tool allows visualization of the device clock tree. It can also be used to determine the exact register (...)

Productos y hardware compatibles

Productos y hardware compatibles

IDE, configuración, compilador o depurador

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

Productos y hardware compatibles

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Iniciar Opciones de descarga
Capacitación en línea

AM62L-ACADEMY AM62Lx Academy

AM62Lx Academy is designed to simplify and accelerate custom AM62Lx development.
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Sistema operativo (SO)

TRZN-3P-TORIZON-OS — Torizon OS ready-to-use industrial embedded Linux distribution

Torizon OS is a free and open-source Industrial Embedded Linux OS focusing on simplifying the development and maintenance of products requiring high reliability and security. It features, among other essential services, an optimal container runtime and components for secure offline and remote (...)
Desde: Torizon
Sistema operativo (SO)

WHIS-3P-SAFERTOS — RTOS de seguridad precertificado SAFERTOS de WITTENSTEIN

SAFERTOS® es un sistema operativo único en tiempo real diseñado para procesadores integrados. Está precertificado según las normas IEC 61508 SIL3 e ISO 26262 ASILD por TÜV SÜD. SAFERTOS® se diseñó específicamente para la seguridad por el equipo de expertos de WHIS y se usa globalmente en (...)
Modelo de simulación

AM62L IBIS Model

SPRM861.ZIP (2037 KB) - IBIS Model
Modelo de simulación

AM62L IBIS-AMI Model

SPRM868.ZIP (39973 KB) - IBIS-AMI Model
Modelo de simulación

AM62Lx BSDL Model

SPRM858.ZIP (8 KB) - BSDL Model
Modelo de simulación

AM62Lx Thermal Model

SPRM859.ZIP (1 KB) - Thermal Model
Herramienta de cálculo

AM62L-PET-CALC AM62L Power Estimation Tool

AM62L PET provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not guaranteed within a specified precision.
Productos y hardware compatibles

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Diseños de referencia

TIDA-010939 — Diseño de referencia del controlador frontal del equipo de alimentación del vehículo eléctrico

Este diseño de referencia es un controlador frontal para equipo de suministro de vehículos eléctricos (EVSE) que actúa como módulo central de comunicación para el proceso de carga de EV. El diseño admite CA y un rango amplio de estándares globales de carga de CC, incluidos el sistema de carga (...)
Design guide: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCCSP (ANB) 373 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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