The TPS54622 device in thermally enhanced 3.5-mm × 3.5-mm VQFN package is a full-featured
17-V, 6-A synchronous step-down converter optimized for small designs through high efficiency and
integrating the high-side and low-side MOSFETs. Further space savings are achieved through current
mode control, which reduces component count, and by selecting a high switching frequency, reducing
the footprint of the inductor.
The output voltage start-up ramp is controlled by the SS/TR pin, which allows operation
as either a stand-alone power supply or in tracking situations. Power sequencing is also possible
by correctly configuring the enable and the open-drain power good pins.
Cycle-by-cycle current limiting on the high-side FET protects the device in overload
situations and is enhanced by a low-side sourcing current limit that prevents current runaway.
There is also a low-side sinking current limit that turns off the low-side MOSFET to prevent
excessive reverse current. Hiccup protection is triggered if the overcurrent condition has
persisted for longer than the preset time. Thermal hiccup protection disables the device when the
die temperature exceeds the thermal shutdown temperature and enables the part again after the
built-in thermal shutdown hiccup time.
The TPS54622 device in thermally enhanced 3.5-mm × 3.5-mm VQFN package is a full-featured
17-V, 6-A synchronous step-down converter optimized for small designs through high efficiency and
integrating the high-side and low-side MOSFETs. Further space savings are achieved through current
mode control, which reduces component count, and by selecting a high switching frequency, reducing
the footprint of the inductor.
The output voltage start-up ramp is controlled by the SS/TR pin, which allows operation
as either a stand-alone power supply or in tracking situations. Power sequencing is also possible
by correctly configuring the enable and the open-drain power good pins.
Cycle-by-cycle current limiting on the high-side FET protects the device in overload
situations and is enhanced by a low-side sourcing current limit that prevents current runaway.
There is also a low-side sinking current limit that turns off the low-side MOSFET to prevent
excessive reverse current. Hiccup protection is triggered if the overcurrent condition has
persisted for longer than the preset time. Thermal hiccup protection disables the device when the
die temperature exceeds the thermal shutdown temperature and enables the part again after the
built-in thermal shutdown hiccup time.