FDC2214-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following
results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- EMI-resistant architecture
- Maximum output rates (one active
channel):
- 13.3kSPS (FDC2112-Q1, FDC2114-Q1)
- 4.08kSPS (FDC2212-Q1, FDC2214-Q1)
- Maximum input capacitance: 250nF (at 10kHz with 1mH inductor)
- Sensor excitation frequency: 10kHz to 10MHz
- Number of channels: 2, 4
- Resolution: up to 28 bits
- RMS noise: 0.3fF at 100SPS and fSENSOR = 5MHz
- Supply voltage: 2.7V to 3.6V
- power consumption: active: 2.1mA
- Low-power sleep mode: 35µA
- Shutdown: 200nA
- Interface: I2C
- Temperature range: –40°C to +125°C
Capacitive sensing is a low-power, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 resonant sensing architecture, performance can be maintained even in presence of fluorescent light.
The FDC2x1x-Q1 is a multi-channel family of high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 | |
|---|---|---|---|---|---|---|
| * | 데이터 시트 | FDC2x1x-Q1 Multi-Channel, High Resolution Capacitance-to-Digital Converter for Capacitive Sensing Applications datasheet (Rev. A) | PDF | HTML | 2024. 10. 10 | ||
| 애플리케이션 노트 | Common Inductive and Capacitive Sensing Applications (Rev. B) | PDF | HTML | 2021. 6. 22 | |||
| 애플리케이션 노트 | Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) | PDF | HTML | 2021. 6. 16 | |||
| 애플리케이션 노트 | Capacitive Proximity Sensing Using FDC2x1y (Rev. A) | 2017. 10. 20 | ||||
| 애플리케이션 노트 | Ground Shifting in Capacitive Sensing Applications | PDF | HTML | 2016. 5. 27 | |||
| 애플리케이션 노트 | Power Consumption Analysis for Low Power Capacitive Sensing Applications | PDF | HTML | 2016. 1. 18 | |||
| 추가 자료 | A Guide to Capacitive Sensing Infographic (Rev. A) | 2015. 10. 19 | ||||
| 애플리케이션 노트 | Derivative Integration Algorithm for Proximity Sensing | 2015. 9. 29 | ||||
| 애플리케이션 노트 | Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) | 2015. 7. 24 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
FDC2214EVM — 2개의 커패시티브 센서 평가 모듈이 포함된 FDC2214
The FDC2214 evaluation module demonstrates capacitive sensing technology to detect the presence of a conductive or non-conductive target. The evaluation module includes two PCB capacitive sensors that connect to two of the four channels of the FDC2214. An MSP430 microcontroller is used to interface (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WQFN (RGH) | 16 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.