OMAP-L138

활성

저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 최대 456MHz

제품 상세 정보

Arm CPU 1 Arm9 Arm (max) (MHz) 456 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot Rating Catalog Power supply solution TPS65910 Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm9 Arm (max) (MHz) 456 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot Rating Catalog Power supply solution TPS65910 Operating temperature range (°C) -40 to 105
NFBGA (ZCE) 361 169 mm² 13 x 13 NFBGA (ZWT) 361 256 mm² 16 x 16
  • Dual-Core SoC
    • 375- and 456-MHz ARM926EJ-S RISC MPU
    • 375- and 456-MHz C674x Fixed- and Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32- and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single-Cycle MAC
    • ARM Jazelle Technology
    • Embedded ICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648 MIPS and 2746 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 128KB of RAM Shared Memory
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPIs) Each With Multiple Chip Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interfaces With Secure Data I/O (SDIO) Interfaces
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address and Data Bus For High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM Per Core
      • 512 Bytes of Data RAM Per Core
      • PRUSS can be Disabled Through Software to Save Power
      • Register 30 of Each PRU is Exported From the Subsystem in Addition to the Normal R31 Output of the PRU Cores.
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media-Independent Interface
    • RMII Reduced Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Video Port Interface (VPIF):
    • Two 8-Bit SD (BT.656), Single 16-Bit or Single Raw (8-, 10-, and 12-Bit) Video Capture Channels
    • Two 8-Bit SD (BT.656), Single 16-Bit Video Display Channels
  • Universal Parallel Port (uPP):
    • High-Speed Parallel Interface to FPGAs and Data Converters
    • Data Width on Both Channels is 8- to 16-Bit Inclusive
    • Single-Data Rate or Dual-Data Rate Transfers
    • Supports Multiple Interfaces With START, ENABLE, and WAIT Controls
  • Serial ATA (SATA) Controller:
    • Supports SATA I (1.5 Gbps) and SATA II
      (3.0 Gbps)
    • Supports All SATA Power-Management Features
    • Hardware-Assisted Native Command Queueing (NCQ) for up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZCE Suffix], 0.65-mm Ball Pitch
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial, Extended, or Industrial Temperature

All trademarks are the property of their respective owners.

  • Dual-Core SoC
    • 375- and 456-MHz ARM926EJ-S RISC MPU
    • 375- and 456-MHz C674x Fixed- and Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32- and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single-Cycle MAC
    • ARM Jazelle Technology
    • Embedded ICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648 MIPS and 2746 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 128KB of RAM Shared Memory
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPIs) Each With Multiple Chip Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interfaces With Secure Data I/O (SDIO) Interfaces
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address and Data Bus For High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM Per Core
      • 512 Bytes of Data RAM Per Core
      • PRUSS can be Disabled Through Software to Save Power
      • Register 30 of Each PRU is Exported From the Subsystem in Addition to the Normal R31 Output of the PRU Cores.
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media-Independent Interface
    • RMII Reduced Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Video Port Interface (VPIF):
    • Two 8-Bit SD (BT.656), Single 16-Bit or Single Raw (8-, 10-, and 12-Bit) Video Capture Channels
    • Two 8-Bit SD (BT.656), Single 16-Bit Video Display Channels
  • Universal Parallel Port (uPP):
    • High-Speed Parallel Interface to FPGAs and Data Converters
    • Data Width on Both Channels is 8- to 16-Bit Inclusive
    • Single-Data Rate or Dual-Data Rate Transfers
    • Supports Multiple Interfaces With START, ENABLE, and WAIT Controls
  • Serial ATA (SATA) Controller:
    • Supports SATA I (1.5 Gbps) and SATA II
      (3.0 Gbps)
    • Supports All SATA Power-Management Features
    • Hardware-Assisted Native Command Queueing (NCQ) for up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZCE Suffix], 0.65-mm Ball Pitch
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial, Extended, or Industrial Temperature

All trademarks are the property of their respective owners.

The OMAP-L138 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a 32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust,” the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects the users’ IP and lets them securely set up the system and begin device operation with known, trusted code.

Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect user encryption keys. When an update is needed, the customer uses the encryption keys to create a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The Serial ATA (SATA) controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs, or other parallel devices. The uPP supports programmable data widths between 8- to 16-bits on both channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE, and WAIT signals to provide control for a variety of data converters.

A video port interface (VPIF) provides a flexible video I/O port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

The OMAP-L138 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a 32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust,” the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects the users’ IP and lets them securely set up the system and begin device operation with known, trusted code.

Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect user encryption keys. When an update is needed, the customer uses the encryption keys to create a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The Serial ATA (SATA) controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs, or other parallel devices. The uPP supports programmable data widths between 8- to 16-bits on both channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE, and WAIT signals to provide control for a variety of data converters.

A video port interface (VPIF) provides a flexible video I/O port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

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* Data sheet OMAP-L138 C6000 DSP+ARM Processor datasheet (Rev. J) PDF | HTML 2017/01/31
* Errata OMAP-L138 C6000 DSP+ARM Processor (Revs 2.3, 2.1, 2.0, 1.1, & 1.0) Errata (Rev. M) 2014/03/21
* User guide OMAP-L138 C6000 DSP+ARM Processor Technical Reference Manual (Rev. C) 2016/09/09
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 2023/03/30
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 2023/03/30
Application note OMAPL138/C6748 ROM Bootloader Resources and FAQ (Rev. A) PDF | HTML 2021/01/21
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 2020/06/01
Application note Programming mDDR/DDR2 EMIF on OMAP-L1x/C674x 2019/12/20
User guide L138/C6748 development kit (LCDK) (Rev. A) PDF | HTML 2019/09/18
Application note Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 2019/06/11
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019/06/10
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 2019/06/03
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 2019/06/03
Application note Programming PLL Controllers on OMAP-L1x8/C674x/AM18xx 2019/04/25
Application note OMAP-L132/L138 Power Consumption Summary 2019/04/01
Application note General Hardware Design/BGA PCB Design/BGA 2019/02/22
Application note OMAP-L13x / C674x / AM1x schematic review guidelines PDF | HTML 2019/02/14
Application note Using the OMAP-L132/L138 Bootloader Application Report (Rev. F) 2019/01/22
Application note McASP Design Guide - Tips, Tricks, and Practical Examples 2019/01/10
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 2018/11/19
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 2018/11/19
White paper Designing professional audio mixers for every scenario 2018/06/28
User guide PRU Assembly Instruction User Guide 2018/02/16
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 2018/01/16
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 2018/01/16
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 2017/09/30
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 2017/09/30
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 2017/06/21
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 2017/06/21
Application note Processor SDK RTOS Audio Benchmark Starter Kit 2017/04/12
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 2016/04/30
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 2016/04/30
Technical article Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016/04/13
Technical article Reversing the voice quality gap PDF | HTML 2016/01/21
Application note TI DSP Benchmarking 2016/01/13
White paper TI’s processors leading the way in embedded analytics 2015/03/03
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 2014/11/05
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 2014/11/05
Application note OMAP-L132/L138, TMS320C6742/6/8 Pin Multiplexing Utility (Rev. B) 2013/09/27
White paper An architecture for compute-intensive, custom machine vision 2013/03/14
Application note Powering the OMAP-L132/OMAP-L137/OMAP-L138 Processor with the TPS650061 2012/04/13
White paper MityDSP®-L138F Software Defined Radio Using uPP Data Transfer (Rev. A) 2012/02/02
Application note Powering the TMS320C6742, TMS320C6746, and TMS320C6748 With the TPS650061 2011/12/19
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
User guide TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F) 2011/09/14
Application note High-Vin, High-Efficiency Power Solution Using DC/DC Converter With DVFS (Rev. C) 2011/08/29
Application note Medium Integrated Power Solution Using a Dual DC/DC Converter and an LDO (Rev. B) 2011/08/29
Application note Powering OMAP-L132/L138, C6742/4/6, and AM18x with TPS65070 (Rev. B) 2011/08/29
Application note Simple Power Solution Using LDOs (Rev. B) 2011/08/29
White paper OpenCV on TI’s DSP+ARM® 2011/07/27
Application note TMS320C674x/OMAP-L1x Processor Security 2011/06/08
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011/05/19
Product overview OMAP-L1x C6000 DSP+ARM Processors Product Bulletin (Rev. A) 2011/03/10
User guide TMS320C674x DSP Megamodule Reference Guide (Rev. A) 2010/08/03
User guide TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 2010/07/30
Application note High-Efficiency Power Solution Using DC/DC Converters With DVFS (Rev. A) 2010/05/05
Application note High-Integration, High-Efficiency Power Solution Using DC/DC Converters w/DVFS (Rev. A) 2010/05/05
Application note Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 2009/11/25
Application note TMS320C6748/46/42 & OMAP-L132/L138 USB Downstream Host Compliance Testing 2009/08/17
Application note TMS320C6748/46/42 & OMAP-L1x8 USB Upstream Device Compliance Testing 2009/08/17
White paper Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core 2009/06/24
Application note TMS320C674x/OMAP-L1x USB Compliance Checklist 2009/03/12
User guide TMS320C674x DSP Cache User's Guide (Rev. A) 2009/02/11
Application note Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A) 2008/07/17

설계 및 개발

전원 공급 솔루션

OMAP-L138에 사용 가능한 전원 공급 솔루션을 찾아보세요. TI는 칩(SoC), 프로세서, 마이크로컨트롤러, 센서 또는 FPGA(Field Programmable Gate Array)의 TI와 비TI 시스템을 위한 전원 공급 솔루션을 제공합니다.

디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

TI.com에서 구매 불가
개발 키트

TMDSLCDK138 — OMAP-L138 개발 키트(LCDK)

The OMAP-L138 DSP+Arm9™ development kit will enable fast and easy Linux software and hardware development. This scalable platform will ease and accelerate software and hardware development of everyday applications that require real-time signal processing and control functional, including (...)

사용 설명서: PDF | HTML
TI.com에서 구매 불가
개발 키트

TMDSLCDK6748 — TMS320C6748 DSP 개발 키트(LCDK)

The TMS320C6748 DSP development kit (LCDK) is a scalable platform that breaks down development barriers for applications that require embedded analytics and real-time signal processing, including biometric analytics, communications and audio. The low-cost LCDK will also speed and ease your hardware (...)

사용 설명서: PDF | HTML
TI.com에서 구매 불가
소프트웨어 개발 키트(SDK)

BIOSLINUXMCSDK-OMAPL13X MCSDK supporting SYS/BIOS RTOS and Linux OS for OMAP-L132 and OMAP-L138

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAP-L138 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 최대 456MHz
다운로드 옵션
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-LINUX-OMAPL138 Linux Processor SDK for OMAP-L138

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAP-L138 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 최대 456MHz
하드웨어 개발
개발 키트
TMDSLCDK138 OMAP-L138 개발 키트(LCDK)
다운로드 옵션
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-RTOS-OMAPL138 TI-RTOS Processor SDK for OMAP-L138, OMAP-L132 and C6748, C6746, C6742 (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAP-L138 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 최대 456MHz
DSP(디지털 신호 프로세서)
TMS320C6742 저전력 C674x 부동 소수점 DSP-200MHz TMS320C6746 저전력 C674x 부동 소수점 DSP - 456MHz TMS320C6748 저전력 C674x 부동 소수점 DSP - 456MHz, SATA
하드웨어 개발
개발 키트
TMDSLCDK138 OMAP-L138 개발 키트(LCDK) TMDSLCDK6748 TMS320C6748 DSP 개발 키트(LCDK)
다운로드 옵션
드라이버 또는 라이브러리

MATHLIB — 부동 소수점 디바이스용 DSP 수학 라이브러리

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
드라이버 또는 라이브러리

SPRC264 — TMS320C5000/6000 이미지 라이브러리(IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
드라이버 또는 라이브러리

SPRC265 — TMS320C6000 DSP 라이브러리(DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
드라이버 또는 라이브러리

TELECOMLIB — 텔레콤 및 미디어 라이브러리 - TMS320C64x+ 및 TMS320C55x 프로세서를 위한 FAXLIB, VoLIB 및 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
드라이버 또는 라이브러리

WIND-3P-VXWORKS-LINUX-OS — Wind River 프로세서 VxWorks 및 Linux 운영 체제

Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.

시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SECDEVTOOL-OMAPL138C6748 Basic Secure Boot Development Tools for OMAP-L138 / C6748

OMAP-L138 C6000 DSP+ARM® processor and TMS320C6748 digital signal processor (DSP) product families offer secure-boot enabled devices which add protection of encrypted application code on the external flash devices and the ability to upgrade boot code and application code remotely while allowing (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
OMAP-L138 저전력 C674x 부동 소수점 DSP + Arm9 프로세서 - 최대 456MHz
DSP(디지털 신호 프로세서)
TMS320C6748 저전력 C674x 부동 소수점 DSP - 456MHz, SATA
다운로드 옵션
운영 체제(OS)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
소프트웨어 코덱

ADT-3P-DSPVOIPCODECS — Adaptive Digital Technologies DSP VoIP, 음성 및 오디오 코덱

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
소프트웨어 코덱

VOCAL-3P-DSPVOIPCODECS — Vocal technologies DSP VoIP 코덱

With over 25 years of assembly and C code development, VOCAL modular software suite is available for a wide variety of TI DSPs. Products include ATAs, VoIP servers and gateways, HPNA-based IPBXs, video surveillance, voice and video conferencing, voice and data RF devices, RoIP gateways, secure (...)
시뮬레이션 모델

OMAP-L138 ZCE BSDL Model (Rev. B)

SPRM377B.ZIP (18 KB) - BSDL Model
시뮬레이션 모델

OMAP-L138 ZCE IBIS Model (Rev. B)

SPRM379B.ZIP (120 KB) - IBIS Model
시뮬레이션 모델

OMAP-L138 ZWT BSDL Model (Rev. B)

SPRM376B.ZIP (18 KB) - BSDL Model
시뮬레이션 모델

OMAP-L138 ZWT IBIS Model (Rev. C)

SPRM378C.ZIP (121 KB) - IBIS Model
레퍼런스 디자인

TIDEP0040 — SDR(소프트웨어 정의 라디오) OMAPL-138 기반 하드웨어/소프트웨어 레퍼런스 디자인

Software Defined Radio (SDR) is a popular application within the wireless infrastructure market.  This hardware reference design, leveraging the real time signal processing of the TI DSP and its Universal Parallel Port (uPP), along with TI ADC and DAC, offers SDR algorithm developers a quick (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDEP0038 — 비전 분석 OMAPL-138 기반 하드웨어/소프트웨어 레퍼런스 디자인

Vision analytics is a critical function for many industrial automated applications including machine vision, inspection automation, surveillance and image processing.  This hardware/software design kit is optimized for vision analytic based applications and provides the all of hardware design (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

PR2084 — TPS650061을 사용하여 OMAP-L132/OMAP-L137/OMAP-L138에 전원 공급

This reference design presents a complete power solution and low-cost, discrete sequencing circuit for the OMAP-L132, OMAP-L137, and OMAP-L138 processors.
Test report: PDF
패키지 CAD 기호, 풋프린트 및 3D 모델
NFBGA (ZCE) 361 Ultra Librarian
NFBGA (ZWT) 361 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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