THS4062
- High Speed
- 180 MHz Bandwidth (G = 1, 3 dB)
- 400 V/µs Slew Rate
- 40-ns Settling Time (0.1%)
- High Output Drive, IO = 115 mA (typ)
- Excellent Video Performance
- 75 MHz 0.1 dB Bandwidth (G = 1)
- 0.02% Differential Gain
- 0.02° Differential Phase
- Very Low Distortion
- THD = 72 dBc at f = 1 MHz
- Wide Range of Power Supplies
- VCC = ±5 V to ±15 V
- Available in Standard SOIC, MSOP PowerPAD, JG, or FK Package
- Evaluation Module Available
PowerPAD is a trademark of Texas Insruments Incorporated.
The THS4061 and THS4062 are general-purpose, single/dual, high-speed voltage feed-back amplifiers ideal for a wide range of applications including video, communication, and imaging. The devices offer very good ac performance with 180-MHz bandwidth, 400-V/µs slew rate, and 40-ns settling time (0.1% ). The THS4061/2 are stable at all gains for both inverting and noninverting configurations. These amplifiers have a high output drive capability of 115 mA and draw only 7.8 mA supply current per channel. Excellent professional video results can be obtained with the low differential gain/phase errors of 0.02%/0.02° and wide 0.1 db flatness to 75 MHz. For applications requiring low distortion, the THS4061/2 is ideally suited with total harmonic distortion of 72 dBc at f = 1 MHz.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | 180-MHz High-Speed Amplifiers datasheet (Rev. E) | 2003. 12. 3 | ||
| e북 | The Signal e-book: A compendium of blog posts on op amp design topics | PDF | HTML | 2017. 3. 28 | ||
| 사용 설명서 | THS4062 Dual High-Speed Operational Amplifier EVM User's Guide | 1999. 3. 31 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
THS4062EVM — THS4062 고속 증폭기 평가 모듈
The THS4062 dual high-speed amplifier evaluation module (EVM) is a complete dual high-speed amplifier circuit. It consists of the THS4062 dual high-speed amplifier IC, along with a small number of passive parts, mounted on a small circuit boad measuring approximately 1.9 inch by 2.2 inch. The EVM (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |