DS92LV040A
- Bus LVDS Signaling
- Propagation Delay: Driver 2.3 ns Max, Receiver 3.2 ns Max
- Low power CMOS Design
- 100% Transition Time 1 ns Driver Typical, 1.3 ns Receiver Typical
- High Signaling Rate Capability (above 155 Mbps)
- 0.1 V to 2.3 V Common Mode Range for
VID = 200 mV - 70 mV Receiver Sensitivity
- Supports Open and Terminated Failsafe on Port Pins
- 3.3-V Operation
- Glitch Free Power up/down (Driver & Receiver Disabled)
- Light Bus Loading (5 pF Typical) per Bus LVDS Load
- Balanced Output Impedance
- Product Offered in 44 Pin WQFN Package
- High Impedance Bus Pins on Power Off
(VCC = 0 V)
The DS92LV040A is one in a series of Bus LVDS transceivers designed specifically for high speed, low power backplane or cable interfaces. The device operates from a single 3.3-V power supply and includes four differential line drivers and four receivers. To minimize bus loading, the driver outputs and receiver inputs are internally connected. The device also features a flow through pin out which allows easy PCB routing for short stubs between its pins and the connector.
The driver translates 3-V LVTTL levels (single-ended) to differential Bus LVDS (BLVDS) output levels. This allows for high speed operation while consuming minimal power and reducing EMI. In addition, the differential signaling provides common mode noise rejection greater than ±1 V.
The receiver threshold is less than +0/−70 mV. The receiver translates the differential Bus LVDS to standard (LVTTL/LVCMOS) levels. (See the Application Information Section for more details.)
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS92LV040A 4 Channel Bus LVDS Transceiver datasheet (Rev. E) | PDF | HTML | 2018年 1月 9日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (NJN) | 44 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。