SN65DSI83-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 2: –40°C to +105°C Ambient Operating Temperature
- Device HBM ESD Classification Level 3A
- Device CDM ESD Classification Level C6
- Implements MIPI® D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
- Single-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
- Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
- Maximum Resolution up to 60 fps WUXGA 1920 × 1200 at 18 bpp and 24 bpp Color With Reduced Blanking. Suitable for 60 fps 1366 × 768 / 1280 × 800 at 18 bpp and 24 bpp
- Output for Single-Link LVDS
- Supports Single Channel DSI to Single-Link LVDS Operating Mode
- LVDS Output Clock Range of 25 MHz to 154 MHz
- LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
- 1.8-V Main VCC Power Supply
- Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
- LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
- Packaged in 64-pin 10-mm × 10-mm HTQFP (PAP) PowerPAD™ IC Package
The SN65DSI83-Q1 DSI-to-LVDS bridge features a single-channel MIPI D-PHY receiver front-end
configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 4 Gbps. The bridge decodes MIPI DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a Single-Link LVDS with four data lanes per link.
The SN65DSI83-Q1 device can support up to WUXGA 1920 × 1200 at 60 frames per second, at 24 bpp with reduced blanking. The SN65DSI83-Q1 device is also suitable for applications using 60 fps 1366 × 768/1280 × 800 at 18 bpp and 24 bpp. Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.
The SN65DSI83-Q1 device is implemented in a small outline 10-mm × 10-mm HTQFP package with a
0.5-mm pitch, and operates across a temperature range from –40°C to +105°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65DSI83-Q1 Automotive Single-Channel MIPI® DSI to Single-Link LVDS Bridge datasheet (Rev. A) | PDF | HTML | 2018年 6月 28日 |
Application note | Troubleshooting SN65DSI8x - Tips and Tricks | 2018年 8月 27日 | ||
EVM User's guide | SN65DSI83, SN65DSI84, and SN65DSI85 EVM User’s Manual and Implementation Guide | 2015年 11月 17日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
SN65DSI83Q1-EVM — MIPI® DSI 轉 LVDS 橋接和 FlatLink™ 積體電路評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTQFP (PAP) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。