UCC27834
- Dual independent inputs for high-side and low-side drivers with interlock (UCC27834) or no interlock (UCC27884)
- Maximum bootstrap voltage: +230V (HB pin)
- VDD bias recommended range: 8.5V to 20V
- Peak output current: 3.5A source, 4A sink
- Fast propagation delay: 29ns typical
- Tight propagation delay matching between HO/LO: <5ns maximum
- dV/dt immunity: 100V/ns
- Low quiescent supply current draw
- 150µA (typical) on VDD
- 90µA (typical) on HB
- Built-in UVLO protection for both high and low side channels: 8V
- Floating channel designed for bootstrap operation
- Available in standard SOIC-8 package
- All parameters specified over temperature range: –40°C to +150°C
The UCC278X4 is a 230V half-bridge gate driver with 3.5A source, 4A sink current, targeted to drive power MOSFETs. The device consists of one ground-referenced channel (LO) and one floating channel (HO) which is designed to drive half-bridge configured MOSFETs operating with bootstrap power supplies. The device features fast propagation delays and excellent delay matching between both channels. The UCC278X4 allows a wide VDD operating voltage of 8.5V to 20V to support a wider range of gate voltage drive, as well as UVLO protection for both the low-side (VDD) and the high-side (HB) bias supplies. The UCC27834 includes an interlock function option to prevent both outputs from being turned on simultaneously
The device features robust drive with excellent noise and transient immunity including high dV/dt tolerance (100V/ns), and wide negative transient safe operating area (NTSOA) on the switch node (HS). The UCC278X4 is available in the SOIC-8 pin package and is rated to operate from –40°C to 150°C.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
UCC27288EVM — UCC27288 100-V、3-A、8-V UVLO 半橋閘極驅動器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。