SBASB89 May   2025 ADS117L14 , ADS117L18

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Clock Dividers
        2. 7.3.3.2 Internal Oscillator
        3. 7.3.3.3 External Clock
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 VCM Output Voltage
      6. 7.3.6 GPIO
      7. 7.3.7 Modulator
      8. 7.3.8 Digital Filter
        1. 7.3.8.1 Wideband Filter
        2. 7.3.8.2 Low-Latency Filter (Sinc)
          1. 7.3.8.2.1 Sinc4 Filter
          2. 7.3.8.2.2 Sinc4 + Sinc1 Cascade Filter
          3. 7.3.8.2.3 Sinc3 Filter
          4. 7.3.8.2.4 Sinc3 + Sinc1 Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
        1. 7.4.1.1 RESET Pin
        2. 7.4.1.2 Reset by SPI Register
        3. 7.4.1.3 Reset by SPI Input Pattern
      2. 7.4.2 Idle and Standby Modes
      3. 7.4.3 Power-Down
      4. 7.4.4 Speed Modes
      5. 7.4.5 Synchronization
        1. 7.4.5.1 Synchronized Control Mode
        2. 7.4.5.2 Start/Stop Control Mode
      6. 7.4.6 Conversion-Start Delay Time
      7. 7.4.7 Calibration
        1. 7.4.7.1 Offset Calibration Registers
        2. 7.4.7.2 Gain Calibration Registers
        3. 7.4.7.3 Calibration Procedure
      8. 7.4.8 Diagnostics
        1. 7.4.8.1 ERROR Pin and ERR_FLAG Bit
        2. 7.4.8.2 SPI CRC
        3. 7.4.8.3 Register Map CRC
        4. 7.4.8.4 ADC Error
        5. 7.4.8.5 SPI Address Range
        6. 7.4.8.6 SCLK Counter
        7. 7.4.8.7 Clock Counter
        8. 7.4.8.8 Frame-Sync CRC
        9. 7.4.8.9 Self Test
      9. 7.4.9 Frame-Sync Data Port
        1. 7.4.9.1  Data Packet
        2. 7.4.9.2  Data Format
        3. 7.4.9.3  STATUS_DP Header Byte
        4. 7.4.9.4  FSYNC Pin
        5. 7.4.9.5  DCLK Pin
        6. 7.4.9.6  DOUTx Pins
        7. 7.4.9.7  DINx Pins
        8. 7.4.9.8  Time Division Multiplexing
        9. 7.4.9.9  Daisy Chain
        10. 7.4.9.10 DOUTx Timing
    5. 7.5 Programming
      1. 7.5.1 Hardware Programming
      2. 7.5.2 SPI Programming
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output (SDO)
      3. 7.5.3 SPI Frame
      4. 7.5.4 Commands
        1. 7.5.4.1 Write Register Command
        2. 7.5.4.2 Read Register Command
      5. 7.5.5 SPI Daisy-Chain
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Anti-alias Filter
      3. 9.1.3 Reference Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 AVDD1 and AVSS
      2. 9.3.2 AVDD2
      3. 9.3.3 IOVDD
      4. 9.3.4 CAPA and CAPD
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Switching Characteristics

1.65V ≤ IOVDD ≤ 1.9V, over operating ambient temperature range, OUT_DRV = 0b, CLOAD = 20pF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CLOCK
tC(CLK) ADC clock period (programmable) (1) 1, 2, 3, 4 or 8 / fCLKIN or / fOSC
FRAME-SYNC (DATA PORT)
tc(FSYNC) FSYNC period 1 / fDATA ns
tw(FSYNCH) Pulse duration, FSYNC high 0.5 / fDATA ns
tw(FSYNCL) Pulse duration, FSYNC low 0.5 / fDATA ns
tp(FSDC) Propagation delay time, FSYNC rising edge to DCLK falling edge –1 1 ns
tc(DCLK) DCLK period (programmable) (1) 1, 2, 4, or 8 / fCLKIN or / fOSC
tw(DCLKH) Pulse duration, DCLK low 0.5 ∙ tC(DCLK) ns
tw(DCLKL) Pulse duration, DCLK high 0.5 ∙ tC(DCLK) ns
th(DCDO) Hold time, DCLK falling edge to previous DOUT invalid –2 ns
tp(DCDO) Propagation delay time, DCLK falling edge to new DOUT valid 7 ns
SPI (CONFIGURATION PORT)
tp(CSDO) Propagation delay time, CS falling edge to SDO driven state 16 ns
tp(CSDOZ) Propagation delay time, CS rising edge to SDO tri-state 16 ns
tp(SCDO) Propagation delay time, SCLK rising edge to valid SDO 20 ns
START PIN
tp(STFS1) Propagation delay time, START falling edge to FSYNC signal stop (Start/stop mode) 11 tCLK
tp(STDC) Propagation delay time, START falling edge to DCLK signal stop (Start/stop mode) 7 tCLK
tp(STFS2) Propagation delay time, START rising edge to FSYNC rising edge (first conversion ready) See the Digital Filter section
RESET PIN
tp(RSFS) Propagation delay time, RESET rising edge to FSYNC falling edge (ADC ready) 104  tCLK
(1) Daisy-chaining requires external clock operation and CLK_DIV[2:0], DCLK_DIV[1:0] = divide by 1.