SBASB89 May   2025 ADS117L14 , ADS117L18

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Clock Dividers
        2. 7.3.3.2 Internal Oscillator
        3. 7.3.3.3 External Clock
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 VCM Output Voltage
      6. 7.3.6 GPIO
      7. 7.3.7 Modulator
      8. 7.3.8 Digital Filter
        1. 7.3.8.1 Wideband Filter
        2. 7.3.8.2 Low-Latency Filter (Sinc)
          1. 7.3.8.2.1 Sinc4 Filter
          2. 7.3.8.2.2 Sinc4 + Sinc1 Cascade Filter
          3. 7.3.8.2.3 Sinc3 Filter
          4. 7.3.8.2.4 Sinc3 + Sinc1 Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
        1. 7.4.1.1 RESET Pin
        2. 7.4.1.2 Reset by SPI Register
        3. 7.4.1.3 Reset by SPI Input Pattern
      2. 7.4.2 Idle and Standby Modes
      3. 7.4.3 Power-Down
      4. 7.4.4 Speed Modes
      5. 7.4.5 Synchronization
        1. 7.4.5.1 Synchronized Control Mode
        2. 7.4.5.2 Start/Stop Control Mode
      6. 7.4.6 Conversion-Start Delay Time
      7. 7.4.7 Calibration
        1. 7.4.7.1 Offset Calibration Registers
        2. 7.4.7.2 Gain Calibration Registers
        3. 7.4.7.3 Calibration Procedure
      8. 7.4.8 Diagnostics
        1. 7.4.8.1 ERROR Pin and ERR_FLAG Bit
        2. 7.4.8.2 SPI CRC
        3. 7.4.8.3 Register Map CRC
        4. 7.4.8.4 ADC Error
        5. 7.4.8.5 SPI Address Range
        6. 7.4.8.6 SCLK Counter
        7. 7.4.8.7 Clock Counter
        8. 7.4.8.8 Frame-Sync CRC
        9. 7.4.8.9 Self Test
      9. 7.4.9 Frame-Sync Data Port
        1. 7.4.9.1  Data Packet
        2. 7.4.9.2  Data Format
        3. 7.4.9.3  STATUS_DP Header Byte
        4. 7.4.9.4  FSYNC Pin
        5. 7.4.9.5  DCLK Pin
        6. 7.4.9.6  DOUTx Pins
        7. 7.4.9.7  DINx Pins
        8. 7.4.9.8  Time Division Multiplexing
        9. 7.4.9.9  Daisy Chain
        10. 7.4.9.10 DOUTx Timing
    5. 7.5 Programming
      1. 7.5.1 Hardware Programming
      2. 7.5.2 SPI Programming
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output (SDO)
      3. 7.5.3 SPI Frame
      4. 7.5.4 Commands
        1. 7.5.4.1 Write Register Command
        2. 7.5.4.2 Read Register Command
      5. 7.5.5 SPI Daisy-Chain
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Anti-alias Filter
      3. 9.1.3 Reference Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 AVDD1 and AVSS
      2. 9.3.2 AVDD2
      3. 9.3.3 IOVDD
      4. 9.3.4 CAPA and CAPD
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The ADS117L14 (quad) and ADS117L18 (octal) are 16-bit, delta-sigma (ΔΣ), analog-to-digital converters (ADCs). The devices provide simultaneous sampling of four or eight channels with data rates up to 512kSPS (wideband filter mode) and 1365kSPS (low-latency filter mode). The 24-bit ADS127L14 (quad) and ADS127L18 (octal) ADCs are pin-compatible devices for increased resolution.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE
ADS117L1xRSH (VQFN, 56)7mm × 7mm
(1) For more information, see the Mechanical, Packaging, and Orderable Information.
ADS117L14 ADS117L18 Functional Block Diagrams Functional Block Diagrams

Power-scalable speed modes allow user-optimized tradeoffs between data rate, bandwidth and power consumption. The wideband and low-latency filters optimize ac-signal performance or dc-signal data throughput, all from one device.

Programmable over-sampling ratio (OSR) determines the data rate and signal bandwidth. The linear-phase wideband filter provides a usable bandwidth of 80% of the Nyquist frequency with ±0.0004dB pass-band ripple. The low-latency filter provides data with 3.9µs conversion latency.

Precharge buffers for each input channel reduce analog input current and sampling noise to improve accuracy. Reference input buffers reduce reference loading for improved accuracy.

The low-drift modulator achieves excellent dc precision with low noise for outstanding 16-bit performance. Low crosstalk error reduces signal coupling between channels for improved data isolation.

The devices are programmed by simple pin connections or by the SPI port. The frame-sync data port with selectable number of data lanes provides the conversion data in parallel or time division multiplexed formats. Daisy chain operation expands the system channel count of multiple devices to reduce the number of data lanes.

The devices are offered in identical 7mm × 7mm VQFN packages, permitting drop-in expandability, and are fully specified for operation over the –40°C to +125°C temperature range.