SPRSP14D May   2019  – February 2021 TMS320F28384D , TMS320F28384D-Q1 , TMS320F28384S , TMS320F28384S-Q1 , TMS320F28386D , TMS320F28386D-Q1 , TMS320F28386S , TMS320F28386S-Q1 , TMS320F28388D , TMS320F28388S

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1 Analog Signals
      2. 6.3.2 Digital Signals
      3. 6.3.3 Power and Ground
      4. 6.3.4 Test, JTAG, and Reset
    4. 6.4 Pins With Internal Pullup and Pulldown
    5. 6.5 Pin Multiplexing
      1. 6.5.1 GPIO Muxed Pins Table
      2. 6.5.2 Input X-BAR
      3. 6.5.3 Output X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR
      4. 6.5.4 USB Pin Muxing
      5. 6.5.5 High-Speed SPI Pin Muxing
      6. 6.5.6 High-Speed SSI Pin Muxing
    6. 6.6 Connections for Unused Pins
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Commercial
    3. 7.3  ESD Ratings – Automotive
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 System Current Consumption (External Supply)
      2. 7.5.2 Operating Mode Test Description
      3. 7.5.3 Current Consumption Graphs
      4. 7.5.4 Reducing Current Consumption
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics for ZWT Package
    8. 7.8  Thermal Resistance Characteristics for PTP Package
    9. 7.9  Thermal Design Considerations
    10. 7.10 System
      1. 7.10.1 Power Sequencing
      2. 7.10.2 Reset Timing
        1. 7.10.2.1 Reset Sources
        2. 7.10.2.2 Reset Electrical Data and Timing
          1. 7.10.2.2.1 Reset (XRSn) Timing Requirements
          2. 7.10.2.2.2 Reset (XRSn) Switching Characteristics
          3. 7.10.2.2.3 Reset Timing Diagrams
      3. 7.10.3 Clock Specifications
        1. 7.10.3.1 Clock Sources
        2. 7.10.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 7.10.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 7.10.3.2.1.1 Input Clock Frequency
            2. 7.10.3.2.1.2 XTAL Oscillator Characteristics
            3. 7.10.3.2.1.3 X1 Timing Requirements
            4. 7.10.3.2.1.4 AUXCLKIN Timing Requirements
            5. 7.10.3.2.1.5 APLL Characteristics
          2. 7.10.3.2.2 Internal Clock Frequencies
            1. 7.10.3.2.2.1 Internal Clock Frequencies
          3. 7.10.3.2.3 Output Clock Frequency and Switching Characteristics
            1. 7.10.3.2.3.1 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        3. 7.10.3.3 Input Clocks
        4. 7.10.3.4 Crystal Oscillator
          1. 7.10.3.4.1 Crystal Oscillator Parameters
          2. 7.10.3.4.2 Crystal Equivalent Series Resistance (ESR) Requirements Table
          3. 7.10.3.4.3 Crystal Oscillator Electrical Characteristics
        5. 7.10.3.5 Internal Oscillators
          1. 7.10.3.5.1 INTOSC Characteristics
      4. 7.10.4 Flash Parameters
      5. 7.10.5 Emulation/JTAG
        1. 7.10.5.1 JTAG Electrical Data and Timing
          1. 7.10.5.1.1 JTAG Timing Requirements
          2. 7.10.5.1.2 JTAG Switching Characteristics
          3. 7.10.5.1.3 JTAG Timing
      6. 7.10.6 GPIO Electrical Data and Timing
        1. 7.10.6.1 GPIO - Output Timing
          1. 7.10.6.1.1 General-Purpose Output Switching Characteristics
          2. 7.10.6.1.2 General-Purpose Output Timing
        2. 7.10.6.2 GPIO - Input Timing
          1. 7.10.6.2.1 General-Purpose Input Timing Requirements
          2. 7.10.6.2.2 Sampling Mode
        3. 7.10.6.3 Sampling Window Width for Input Signals
      7. 7.10.7 Interrupts
        1. 7.10.7.1 External Interrupt (XINT) Electrical Data and Timing
          1. 7.10.7.1.1 External Interrupt Timing Requirements
          2. 7.10.7.1.2 External Interrupt Switching Characteristics
          3. 7.10.7.1.3 External Interrupt Timing
      8. 7.10.8 Low-Power Modes
        1. 7.10.8.1 Clock-Gating Low-Power Modes
        2. 7.10.8.2 Low-Power Mode Wakeup Timing
          1. 7.10.8.2.1 IDLE Mode Timing Requirements
          2. 7.10.8.2.2 IDLE Mode Switching Characteristics
          3. 7.10.8.2.3 IDLE Entry and Exit Timing Diagram
          4. 7.10.8.2.4 STANDBY Mode Timing Requirements
          5. 7.10.8.2.5 STANDBY Mode Switching Characteristics
          6. 7.10.8.2.6 STANDBY Entry and Exit Timing Diagram
      9. 7.10.9 External Memory Interface (EMIF)
        1. 7.10.9.1 Asynchronous Memory Support
        2. 7.10.9.2 Synchronous DRAM Support
        3. 7.10.9.3 EMIF Electrical Data and Timing
          1. 7.10.9.3.1 Asynchronous RAM
            1. 7.10.9.3.1.1 EMIF Asynchronous Memory Timing Requirements
            2. 7.10.9.3.1.2 EMIF Asynchronous Memory Switching Characteristics
            3. 7.10.9.3.1.3 EMIF Asynchronous Memory Timing Diagrams
          2. 7.10.9.3.2 Synchronous RAM
            1. 7.10.9.3.2.1 EMIF Synchronous Memory Timing Requirements
            2. 7.10.9.3.2.2 EMIF Synchronous Memory Switching Characteristics
            3. 7.10.9.3.2.3 EMIF Synchronous Memory Timing Diagrams
    11. 7.11 C28x Analog Peripherals
      1. 7.11.1 Analog Subsystem
      2. 7.11.2 Analog-to-Digital Converter (ADC)
        1. 7.11.2.1 Result Register Mapping
        2. 7.11.2.2 ADC Configurability
          1. 7.11.2.2.1 Signal Mode
        3. 7.11.2.3 ADC Electrical Data and Timing
          1. 7.11.2.3.1 ADC Operating Conditions (16-bit Differential)
            1. 7.11.2.3.1.1 ADC Operating Conditions (16-bit Differential) Notes
          2. 7.11.2.3.2 ADC Characteristics (16-bit Differential)
          3. 7.11.2.3.3 ADC Operating Conditions (16-bit Single-Ended)
            1. 7.11.2.3.3.1 ADC Operating Conditions (16-bit Single-Ended) Notes
          4. 7.11.2.3.4 ADC Characteristics (16-bit Single-Ended)
          5. 7.11.2.3.5 ADC Operating Conditions (12-bit Single-Ended)
            1. 7.11.2.3.5.1 ADC Operating Conditions (12-bit Single-Ended) Notes
          6. 7.11.2.3.6 ADC Characteristics (12-bit Single-Ended)
          7. 7.11.2.3.7 ADCEXTSOC Timing Requirements
          8. 7.11.2.3.8 ADC Input Models
            1. 7.11.2.3.8.1 Single-Ended Input Model Parameters (12-bit Resolution)
            2. 7.11.2.3.8.2 Single-Ended Input Model Parameters (16-bit Resolution)
            3. 7.11.2.3.8.3 Single-Ended Input Model
            4. 7.11.2.3.8.4 Differential Input Model Parameters (16-bit Resolution)
            5. 7.11.2.3.8.5 Differential Input Model
          9. 7.11.2.3.9 ADC Timing Diagrams
            1. 7.11.2.3.9.1 ADC Timings in 12-Bit Mode (SYSCLK Cycles)
            2. 7.11.2.3.9.2 ADC Timings in 16-Bit Mode
        4. 7.11.2.4 Temperature Sensor Electrical Data and Timing
          1. 7.11.2.4.1 Temperature Sensor Characteristics
      3. 7.11.3 Comparator Subsystem (CMPSS)
        1. 7.11.3.1 CMPSS Electrical Data and Timing
          1. 7.11.3.1.1 Comparator Electrical Characteristics
          2. 7.11.3.1.2 CMPSS Comparator Input Referred Offset and Hysteresis
          3. 7.11.3.1.3 CMPSS DAC Static Electrical Characteristics
          4. 7.11.3.1.4 CMPSS Illustrative Graphs
      4. 7.11.4 Buffered Digital-to-Analog Converter (DAC)
        1. 7.11.4.1 Buffered DAC Electrical Data and Timing
          1. 7.11.4.1.1 Buffered DAC Operating Conditions
          2. 7.11.4.1.2 Buffered DAC Electrical Characteristics
          3. 7.11.4.1.3 Buffered DAC Notes and Illustrative Graphs
    12. 7.12 C28x Control Peripherals
      1. 7.12.1 Enhanced Capture and High-Resolution Capture (eCAP, HRCAP)
        1. 7.12.1.1 eCAP Synchronization
        2. 7.12.1.2 eCAP Electrical Data and Timing
          1. 7.12.1.2.1 eCAP Timing Requirements
          2. 7.12.1.2.2 eCAP Switching Charcteristics
        3. 7.12.1.3 HRCAP Electrical Data and Timing
          1. 7.12.1.3.1 HRCAP Switching Characteristics
          2. 7.12.1.3.2 HRCAP Graphs
      2. 7.12.2 Enhanced Pulse Width Modulator (ePWM)
        1. 7.12.2.1 Control Peripherals Synchronization
        2. 7.12.2.2 ePWM Electrical Data and Timing
          1. 7.12.2.2.1 ePWM Timing Requirements
          2. 7.12.2.2.2 ePWM Switching Characteristics
          3. 7.12.2.2.3 Trip-Zone Input Timing
            1. 7.12.2.2.3.1 Trip-Zone Input Timing Requirements
        3. 7.12.2.3 External ADC Start-of-Conversion Electrical Data and Timing
          1. 7.12.2.3.1 External ADC Start-of-Conversion Switching Characteristics
      3. 7.12.3 High-Resolution Pulse Width Modulator (HRPWM)
        1. 7.12.3.1 HRPWM Electrical Data and Timing
          1. 7.12.3.1.1 High-Resolution PWM Characteristics
      4. 7.12.4 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 7.12.4.1 eQEP Electrical Data and Timing
          1. 7.12.4.1.1 eQEP Timing Requirements
          2. 7.12.4.1.2 eQEP Switching Characteristics
      5. 7.12.5 Sigma-Delta Filter Module (SDFM)
        1. 7.12.5.1 SDFM Electrical Data and Timing (Using ASYNC)
          1. 7.12.5.1.1 SDFM Timing Requirements When Using Asynchronous GPIO (ASYNC) Option
          2. 7.12.5.1.2 SDFM Timing Diagram
    13. 7.13 C28x Communications Peripherals
      1. 7.13.1 Controller Area Network (CAN)
      2. 7.13.2 Fast Serial Interface (FSI)
        1. 7.13.2.1 FSI Transmitter
          1. 7.13.2.1.1 FSITX Electrical Data and Timing
            1. 7.13.2.1.1.1 FSITX Switching Characteristics
            2. 7.13.2.1.1.2 FSITX Timings
        2. 7.13.2.2 FSI Receiver
          1. 7.13.2.2.1 FSIRX Electrical Data and Timing
            1. 7.13.2.2.1.1 FSIRX Timing Requirements
            2. 7.13.2.2.1.2 FSIRX Switching Characteristics
            3. 7.13.2.2.1.3 FSIRX Timing Diagram
        3. 7.13.2.3 SPI Signaling Mode
          1. 7.13.2.3.1 FSITX SPI Signaling Mode Electrical Data and Timing
            1. 7.13.2.3.1.1 FSITX SPI Signaling Mode Switching Characteristics
            2. 7.13.2.3.1.2 FSITX SPI Signaling Mode Timings
      3. 7.13.3 Inter-Integrated Circuit (I2C)
        1. 7.13.3.1 I2C Electrical Data and Timing
          1. 7.13.3.1.1 I2C Timing Requirements
          2. 7.13.3.1.2 I2C Switching Characteristics
          3. 7.13.3.1.3 I2C Timing Diagram
      4. 7.13.4 Multichannel Buffered Serial Port (McBSP)
        1. 7.13.4.1 McBSP Electrical Data and Timing
          1. 7.13.4.1.1 McBSP Transmit and Receive Timing
            1. 7.13.4.1.1.1 McBSP Timing Requirements
            2. 7.13.4.1.1.2 McBSP Switching Characteristics
            3. 7.13.4.1.1.3 McBSP Receive and Transmit Timing Diagrams
          2. 7.13.4.1.2 McBSP as SPI Master or Slave Timing
            1. 7.13.4.1.2.1 McBSP as SPI Master Timing Requirements
            2. 7.13.4.1.2.2 McBSP as SPI Master Switching Characteristics
            3. 7.13.4.1.2.3 McBSP as SPI Slave Timing Requirements
            4. 7.13.4.1.2.4 McBSP as SPI Slave Switching Characteristics
            5. 7.13.4.1.2.5 McBSP as SPI Master or Slave Timing Diagrams
      5. 7.13.5 Power Management Bus (PMBus)
        1. 7.13.5.1 PMBus Electrical Data and Timing
          1. 7.13.5.1.1 PMBus Electrical Characteristics
          2. 7.13.5.1.2 PMBus Fast Mode Switching Characteristics
          3. 7.13.5.1.3 PMBus Standard Mode Switching Characteristics
      6. 7.13.6 Serial Communications Interface (SCI)
      7. 7.13.7 Serial Peripheral Interface (SPI)
        1. 7.13.7.1 SPI Electrical Data and Timing
          1. 7.13.7.1.1 SPI Master Mode Timings
            1. 7.13.7.1.1.1 SPI Master Mode Timing Requirements
            2. 7.13.7.1.1.2 SPI Master Mode Switching Characteristics (Clock Phase = 0)
            3. 7.13.7.1.1.3 SPI Master Mode Switching Characteristics (Clock Phase = 1)
            4. 7.13.7.1.1.4 SPI Master Mode External Timing
          2. 7.13.7.1.2 SPI Slave Mode Timings
            1. 7.13.7.1.2.1 SPI Slave Mode Timing Requirements
            2. 7.13.7.1.2.2 SPI Slave Mode Switching Characteristics
            3. 7.13.7.1.2.3 SPI Slave Mode External Timing
      8. 7.13.8 EtherCAT Slave Controller (ESC)
        1. 7.13.8.1 ESC Features
        2. 7.13.8.2 ESC Subsystem Integrated Features
        3. 7.13.8.3 EtherCAT IP Block Diagram
        4. 7.13.8.4 EtherCAT Electrical Data and Timing
          1. 7.13.8.4.1 EtherCAT Timing Requirements
          2. 7.13.8.4.2 EtherCAT Switching Characteristics
          3. 7.13.8.4.3 EtherCAT Timing Diagrams
      9. 7.13.9 Universal Serial Bus (USB) Controller
        1. 7.13.9.1 USB Electrical Data and Timing
          1. 7.13.9.1.1 USB Input Ports DP and DM Timing Requirements
          2. 7.13.9.1.2 USB Output Ports DP and DM Switching Characteristics
    14. 7.14 Connectivity Manager (CM) Peripherals
      1. 7.14.1 Modular Controller Area Network (MCAN) [CAN FD]
      2. 7.14.2 Ethernet Media Access Controller (EMAC)
        1. 7.14.2.1 MAC Features
          1. 7.14.2.1.1 MAC Tx and Rx Features
          2. 7.14.2.1.2 MAC Tx Features
          3. 7.14.2.1.3 MAC Rx Features
        2. 7.14.2.2 Ethernet Electrical Data and Timing
          1. 7.14.2.2.1 Ethernet Timing Requirements
          2. 7.14.2.2.2 Ethernet Switching Characteristics
          3. 7.14.2.2.3 Ethernet Timing Diagrams
        3. 7.14.2.3 Ethernet REVMII Electrical Data and Timing
          1. 7.14.2.3.1 Ethernet REVMII Timing Requirements
          2. 7.14.2.3.2 Ethernet REVMII Switching Characteristics
      3. 7.14.3 Inter-Integrated Circuit (CM-I2C)
        1. 7.14.3.1 CM-I2C Electrical Data and Timing
          1. 7.14.3.1.1 CM-I2C Timing Requirements
          2. 7.14.3.1.2 CM-I2C Switching Characteristics
          3. 7.14.3.1.3 CM-I2C Timing Diagram
      4. 7.14.4 Synchronous Serial Interface (SSI)
        1. 7.14.4.1 SSI Electrical Data and Timing
          1. 7.14.4.1.1 SSI Timing Requirements
          2. 7.14.4.1.2 SSI Characteristics
          3. 7.14.4.1.3 SSI Timing Diagrams
      5. 7.14.5 Universal Asynchronous Receiver/Transmitter (CM-UART)
      6. 7.14.6 Trace Port Interface Unit (TPIU)
        1. 7.14.6.1 TPIU Electrical Data and Timing
          1. 7.14.6.1.1 Trace Port Switching Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Memory
      1. 8.3.1 C28x Memory Map
      2. 8.3.2 C28x Flash Memory Map
      3. 8.3.3 EMIF Chip Select Memory Map
      4. 8.3.4 CM Memory Map
      5. 8.3.5 CM Flash Memory Map
      6. 8.3.6 Memory Types
        1. 8.3.6.1 Dedicated RAM (Mx and Dx RAM)
        2. 8.3.6.2 Local Shared RAM (LSx RAM)
        3. 8.3.6.3 Global Shared RAM (GSx RAM)
        4. 8.3.6.4 CPU Message RAM (CPU MSGRAM)
        5. 8.3.6.5 CLA Message RAM (CLA MSGRAM)
        6. 8.3.6.6 CLA - DMA Message RAM (CLA-DMA MSGRAM)
        7. 8.3.6.7 CPUx - CM Message RAM (CPUx-CM MSGRAM)
        8. 8.3.6.8 Dedicated RAM (C0/C1 RAM)
        9. 8.3.6.9 Shared RAM (E0 and Sx RAM)
    4. 8.4 Identification
    5. 8.5 Bus Architecture – Peripheral Connectivity
    6. 8.6 Boot ROM and Peripheral Booting
      1. 8.6.1 Device Boot
      2. 8.6.2 Device Boot Modes
      3. 8.6.3 Device Boot Configurations
      4. 8.6.4 GPIO Assignments for CPU1
    7. 8.7 Dual Code Security Module (DCSM)
    8. 8.8 C28x (CPU1/CPU2) Subsystem
      1. 8.8.1  C28x Processor
        1. 8.8.1.1 Floating-Point Unit
        2. 8.8.1.2 Trigonometric Math Unit
        3. 8.8.1.3 Fast Integer Division Unit
        4. 8.8.1.4 VCRC Unit
      2. 8.8.2  Embedded Real-Time Analysis and Diagnostic (ERAD)
      3. 8.8.3  Background CRC-32 (BGCRC)
      4. 8.8.4  Control Law Accelerator (CLA)
      5. 8.8.5  Direct Memory Access (DMA)
      6. 8.8.6  Interprocessor Communication (IPC) Module
      7. 8.8.7  C28x Timers
      8. 8.8.8  Dual-Clock Comparator (DCC)
        1. 8.8.8.1 Features
        2. 8.8.8.2 Mapping of DCCx (DCC0, DCC1, and DCC2) Clock Source Inputs
      9. 8.8.9  Nonmaskable Interrupt With Watchdog Timer (NMIWD)
      10. 8.8.10 Watchdog
      11. 8.8.11 Configurable Logic Block (CLB)
    9. 8.9 Connectivity Manager (CM) Subsystem
      1. 8.9.1  Arm Cortex-M4 Processor
      2. 8.9.2  Nested Vectored Interrupt Controller (NVIC)
      3. 8.9.3  Advance Encryption Standard (AES) Accelerator
      4. 8.9.4  Generic Cyclic Redundancy Check (GCRC) Module
      5. 8.9.5  CM Nonmaskable Interrupt (CMNMI) Module
      6. 8.9.6  Memory Protection Unit (MPU)
      7. 8.9.7  Micro Direct Memory Access (µDMA)
      8. 8.9.8  Watchdog
      9. 8.9.9  CM Clocking
        1. 8.9.9.1 CM Clock Sources
      10. 8.9.10 CM Timers
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Device and Development Support Tool Nomenclature
    2. 10.2 Markings
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWT|337
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Dual-core C28x architecture
    • Two TMS320C28x 32-bit CPUs
      • 200 MHz
      • IEEE 754 double-precision (64-bit) Floating-Point Unit (FPU)
      • Trigonometric Math Unit (TMU)
      • CRC engine and instructions (VCRC)
      • Fast Integer Division (FINTDIV)
    • 512KB (256KW) of flash on each CPU
      (ECC-protected)
    • 44KB (22KW) of local RAM on each CPU
    • 128KB (64KW) of global RAM shared between the two CPUs (parity-protected)
  • Two Control Law Accelerators (CLAs)
    • 200 MHz
    • IEEE 754 single-precision floating-point
    • Executes code independently of C28x CPU
  • System peripherals
    • Two External Memory Interfaces (EMIFs) with ASRAM and SDRAM support
    • Two 6-channel Direct Memory Access (DMA) controllers
    • Up to 169 General-Purpose Input/Output (GPIO) pins with input filtering
    • Expanded Peripheral Interrupt controller (ePIE)
    • Low-power mode (LPM) support
    • Dual-zone security for third-party development
    • Unique Identification (UID) number
    • Embedded Real-time Analysis and Diagnostic (ERAD)
    • Background CRC (BGCRC)
  • Connectivity Manager (CM)
    • Arm®Cortex®-M4 processor
    • 125 MHz
    • 512KB of flash (ECC-protected)
    • 96KB of RAM (ECC-protected or parity-protected)
    • Advanced Encryption Standard (AES) accelerator
    • Generic CRC (GCRC)
    • 32-channel Micro Direct Memory Access (µDMA) controller
    • Universal Asynchronous Receiver/Transmitter (CM-UART)
    • Inter-integrated Circuit (CM-I2C)
    • Synchronous Serial Interface (SSI)
    • 10/100 Ethernet 1588 MII/RMII
    • MCAN (CAN-FD)
  • C28x communications peripherals
    • Fast Serial Interface (FSI) with two transmitters and eight receivers
    • Four high-speed (up to 50-MHz) SPI ports (pin-bootable)
    • Four Serial Communications Interfaces (SCI/UART) (pin-bootable)
    • Two I2C interfaces (pin-bootable)
    • Power-Management Bus (PMBus) interface
    • Two Multichannel Buffered Serial Ports (McBSPs)
  • CM-C28x shared communications peripherals
    • EtherCAT® Slave Controller (ESC)
    • USB 2.0 (MAC + PHY)
    • Two Controller Area Network (CAN) modules (pin-bootable)
  • Analog subsystem
    • Four Analog-to-Digital Converters (ADCs)
      • 16-bit mode
        • 1.1 MSPS each
        • 12 differential or 24 single-ended inputs
      • 12-bit mode
        • 3.5 MSPS each
        • 24 single-ended inputs
      • Single sample-and-hold (S/H) on each ADC
      • Hardware post-processing of conversions
    • Eight windowed comparators with 12-bit Digital-to-Analog Converter (DAC) references
    • Three 12-bit buffered DAC outputs
  • Control peripherals
    • 32 Pulse Width Modulator (PWM) channels
      • High resolution on both A and B channels of 8 PWM modules (16 channels)
      • Dead-band support (on both standard and high resolution)
    • Seven Enhanced Capture (eCAP) modules
      • High-resolution Capture (HRCAP) available on two of the seven eCAP modules
    • Three Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Eight Sigma-Delta Filter Module (SDFM) input channels, 2 independent filters per channel
  • Configurable Logic Block (CLB)
    • Augments existing peripheral capability
    • Supports position manager solutions
  • Clock and system control
    • Two internal zero-pin 10-MHz oscillators
    • On-chip crystal oscillator
    • Windowed watchdog timer module
    • Missing clock detection circuitry
    • Dual-clock Comparator (DCC)
  • 1.2-V core, 3.3-V I/O design
  • Package options:
    • Lead-free, green packaging
    • 337-ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT suffix]
    • 176-pin PowerPAD™ Thermally Enhanced Low-profile Quad Flatpack (HLQFP) [PTP suffix]
  • Temperature options:
    • S: –40°C to 125°C junction
    • Q: –40°C to 125°C ambient
      (AEC Q100 qualification for automotive applications)