SLVSF07 July   2021 TPS7H5001-SP

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and VLDO
      2. 7.3.2  Startup
      3. 7.3.3  Enable and Undervoltage Lockout (UVLO)
      4. 7.3.4  Voltage Reference
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Output Voltage Programming
      7. 7.3.7  Soft-Start (SS)
      8. 7.3.8  Switching Frequency and External Synchronization
        1. 7.3.8.1 Internal Oscillator Mode
        2. 7.3.8.2 External Synchronization Mode
        3. 7.3.8.3 Primary-Secondary Mode
      9. 7.3.9  Primary Switching Outputs (OUTA and OUTB)
      10. 7.3.10 Synchronous Rectifier Outputs (SRA and SRB)
      11. 7.3.11 Dead Time and Leading Edge Blank Time Programmability (PS, SP, and LEB)
      12. 7.3.12 Pulse Skipping
      13. 7.3.13 Duty Cycle Programmability
      14. 7.3.14 Current Sense and PWM Generation (CS_ILIM)
      15. 7.3.15 Hiccup Mode Operation (HICC)
      16. 7.3.16 External Fault Protection (FAULT)
      17. 7.3.17 Slope Compensation (RSC)
      18. 7.3.18 Frequency Compensation
      19. 7.3.19 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  Output Voltage Programming Resistors
        3. 8.2.2.3  Dead Time
        4. 8.2.2.4  Leading Edge Blank Time
        5. 8.2.2.5  Soft-Start Capacitor
        6. 8.2.2.6  Transformer
        7. 8.2.2.7  Main Switching FETs
        8. 8.2.2.8  Synchronous Rectificier FETs
        9. 8.2.2.9  RCD Clamp
        10. 8.2.2.10 Output Inductor
        11. 8.2.2.11 Output Capacitance and Filter
        12. 8.2.2.12 Sense Resistor
        13. 8.2.2.13 Hiccup Capacitor
        14. 8.2.2.14 Frequency Compensation Components
        15. 8.2.2.15 Slope Compensation Resistor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • HFT|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Voltage Reference

The device generates an internal 1.23-V bandgap reference that is utilized throughout the various control logic blocks. This is the voltage present on the REFCAP pin during steady state operation. This voltage is divided down to 0.613 V to produce the reference for the error amplifier. The error amplifier reference is measured at the COMP pin to account for offsets in the error amplifier and maintains regulation within ±1% across line, load, temperature, and TID as shown in Section 6. This tight reference tolerance allows for the user to design a highly accurate power converter. A 470-nF capacitor to ground is required at the REFCAP pin for proper electrical operation as well as to ensure robust SET performance of the device.