SCPS286 July   2025 TPLD2001

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 I2C Bus Timing Requirements
    9. 5.9 SPI Timing Requirements
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I/O Pins
        1. 7.3.1.1 Input Modes
        2. 7.3.1.2 Output Modes
        3. 7.3.1.3 Pull-Up or Pull-Down Resistors
      2. 7.3.2  Connection Mux
      3. 7.3.3  Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT or D Flip-Flop/Latch macro-cell
          1. 7.3.3.1.1 2-Bit LUT
          2. 7.3.3.1.2 D Flip-Flop/Latch
        2. 7.3.3.2 2-Bit LUT or Pattern Generator macro-cell
          1. 7.3.3.2.1 2-Bit LUT
          2. 7.3.3.2.2 Pattern Generator
        3. 7.3.3.3 3-Bit LUT or D Flip-Flop/Latch with Reset/Set macro-cell
          1. 7.3.3.3.1 3-Bit LUT
          2. 7.3.3.3.2 D Flip-Flop/Latch with Reset/Set
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop/Latch or Shift Register macro-cell
          1. 7.3.3.4.1 3-Bit LUT
          2. 7.3.3.4.2 D Flip-Flop/Latch with Reset/Set
          3. 7.3.3.4.3 8-Bit Shift Register
        5. 7.3.3.5 4-Bit LUT or D Flip-Flop/Latch with Reset/Set macro-cell
          1. 7.3.3.5.1 4-Bit LUT
          2. 7.3.3.5.2 D Flip-Flop/Latch with Reset/Set
      4. 7.3.4  Configurable Logic and Timing blocks
        1. 7.3.4.1 3-Bit LUT
        2. 7.3.4.2 D Flip-Flop/Latch with Reset/Set
        3. 7.3.4.3 Counters/Delay Generators (CNT/DLY)
          1. 7.3.4.3.1 Delay Mode
          2. 7.3.4.3.2 Reset Counter Mode
          3. 7.3.4.3.3 One-Shot Mode
          4. 7.3.4.3.4 Frequency Comparator Mode
          5. 7.3.4.3.5 Edge Detector Mode
          6. 7.3.4.3.6 Delayed Edge Detector Mode
        4. 7.3.4.4 LUT/DFF + CNT modes
      5. 7.3.5  Programmable Deglitch Filter or Edge Detector
      6. 7.3.6  Deglitch Filter or Edge Detector
      7. 7.3.7  State Machine (SM)
        1. 7.3.7.1 State Machine Inputs
        2. 7.3.7.2 State Machine Outputs
        3. 7.3.7.3 Configuring the State Machine
        4. 7.3.7.4 State Machine Timing Considerations
      8. 7.3.8  8-Bit Counters/Delay Generators/Finite State Machines
      9. 7.3.9  PWM Generators
      10. 7.3.10 Watchdog Timer
      11. 7.3.11 Analog Comparators
        1. 7.3.11.1 Discrete Analog Comparator (ACMP)
        2. 7.3.11.2 Multi-channel Analog Comparator (McACMP)
      12. 7.3.12 Voltage Reference (VREF)
      13. 7.3.13 Analog Temperature Sensor (TS)
      14. 7.3.14 Analog Multiplexer (AMUX)
      15. 7.3.15 Oscillators
        1. 7.3.15.1 2kHz Fixed Frequency Oscillator
        2. 7.3.15.2 2MHz Fixed Frequency Oscillator
        3. 7.3.15.3 25MHz Fixed Frequency Oscillator
        4. 7.3.15.4 Oscillator Power Modes
      16. 7.3.16 Serial Communications
        1. 7.3.16.1 I2C Mode
        2. 7.3.16.2 SPI Mode
        3. 7.3.16.3 Virtual I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
      2. 7.4.2 Power Supply Control Modes
      3. 7.4.3 Protection Features
        1. 7.4.3.1 Device Read/Write Lock
        2. 7.4.3.2 OTP Cyclic Redundancy Check (CRC)
      4. 7.4.4 Programming
        1. 7.4.4.1 Selectable I2C/SPI Interface
        2. 7.4.4.2 One-Time Programmable Memory (OTP)
        3. 7.4.4.3 Intel HEX File Format
        4. 7.4.4.4 TPLD2001 Registers
          1. 7.4.4.4.1 TPLD2001_User Registers
          2. 7.4.4.4.2 TPLD2001_Cfg_0 Registers
          3. 7.4.4.4.3 TPLD2001_Cfg_1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Discrete Analog Comparator (ACMP)

In order for the ACMP macro-cell to be used in a TPLD design, the power up (PWR UP) port needs to be connected to a logic High signal. By connecting to signals coming from the connection mux, it is possible to have the ACMP always on, always off, or switched on dynamically based on a digital signal coming from the connection mux.

  • PWR UP = 1 => ACMP is powered up.
  • PWR UP = 0 => ACMP is powered down.
When powered down, the output of the ACMP is a static logic Low. Upon power up, the output will remain Low, and then become valid 110 μs (max) after the PWR UP signal goes high, during which time, ensure OSC1 is not powered down.

The ACMP macro-cell has a positive input signal that can be provided by a variety of external sources with a selectable gain stage before going into the analog comparator. The negative input signal can either come from the internal VREF or an external source, which is shared between all comparator channels.

Table 7-20 ACMP Input Sources
Parameters

Source

IN+ source

ACMP IN0

ACMP IN1

ACMP IN2
ACMP IN3

IN+ gain: The McACMP positive input can be provided by a variety of external sources, and can also have a selectable gain stage (1X, 0.5X, 0.33X, 0.25X) before connecting to the analog comparator.

IN- voltage range: 32 mV to 2.016 V through the internal VREF or up to 2.016 V external source.

The VREF selection per discrete analog comparator may be updated in-system using the User Registers. For glitch-free measurements, it is recommended to disable/power down all analog comparators when changing the VREF. If the analog comparator is not disabled while the VREF selection is being updated, it may take up to 10µs for valid data to be output from the analog comparators.

Hysteresis: If the internal VREF is used, corresponding ACMP channels have four selectable hysteresis options 0 mV, 32 mV, 64 mV and 192 mV.

  • 0 mV: will disable the input signal hysteresis.
  • 64 mV: is a +32 mV and -32 mV hysteresis. For VREF = 1.024 V, the trigger points will be 1.056 V and 0.992 V.
  • 128 mV: is a +64 mV and -64 mV hysteresis. For VREF = 1.024 V, the trigger points will be 1.088 V and 0.960 V.
  • 192 mV: is a +96 mV and -96 mV hysteresis. For VREF = 1.024 V, the trigger points will be 1.120 V and 0.928 V.
If hysteresis is desired, the internal VREF must be used. Further, hysteresis values that would otherwise extend beyond the range of the VREF will be limited to the minimum and maximum values available in the device. For example, if IN- = 1.984 V and VHYS = ±64 mV, the lower trigger point will be 1.920 V and the upper trigger point will be 2.016 V.

Low bandwidth: The ACMP cell has a selection for the bandwidth of the input signal, which can be used to save power and reduce noise impact when lower bandwidth signals are being compared.