SCPS286 July   2025 TPLD2001

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 I2C Bus Timing Requirements
    9. 5.9 SPI Timing Requirements
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I/O Pins
        1. 7.3.1.1 Input Modes
        2. 7.3.1.2 Output Modes
        3. 7.3.1.3 Pull-Up or Pull-Down Resistors
      2. 7.3.2  Connection Mux
      3. 7.3.3  Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT or D Flip-Flop/Latch macro-cell
          1. 7.3.3.1.1 2-Bit LUT
          2. 7.3.3.1.2 D Flip-Flop/Latch
        2. 7.3.3.2 2-Bit LUT or Pattern Generator macro-cell
          1. 7.3.3.2.1 2-Bit LUT
          2. 7.3.3.2.2 Pattern Generator
        3. 7.3.3.3 3-Bit LUT or D Flip-Flop/Latch with Reset/Set macro-cell
          1. 7.3.3.3.1 3-Bit LUT
          2. 7.3.3.3.2 D Flip-Flop/Latch with Reset/Set
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop/Latch or Shift Register macro-cell
          1. 7.3.3.4.1 3-Bit LUT
          2. 7.3.3.4.2 D Flip-Flop/Latch with Reset/Set
          3. 7.3.3.4.3 8-Bit Shift Register
        5. 7.3.3.5 4-Bit LUT or D Flip-Flop/Latch with Reset/Set macro-cell
          1. 7.3.3.5.1 4-Bit LUT
          2. 7.3.3.5.2 D Flip-Flop/Latch with Reset/Set
      4. 7.3.4  Configurable Logic and Timing blocks
        1. 7.3.4.1 3-Bit LUT
        2. 7.3.4.2 D Flip-Flop/Latch with Reset/Set
        3. 7.3.4.3 Counters/Delay Generators (CNT/DLY)
          1. 7.3.4.3.1 Delay Mode
          2. 7.3.4.3.2 Reset Counter Mode
          3. 7.3.4.3.3 One-Shot Mode
          4. 7.3.4.3.4 Frequency Comparator Mode
          5. 7.3.4.3.5 Edge Detector Mode
          6. 7.3.4.3.6 Delayed Edge Detector Mode
        4. 7.3.4.4 LUT/DFF + CNT modes
      5. 7.3.5  Programmable Deglitch Filter or Edge Detector
      6. 7.3.6  Deglitch Filter or Edge Detector
      7. 7.3.7  State Machine (SM)
        1. 7.3.7.1 State Machine Inputs
        2. 7.3.7.2 State Machine Outputs
        3. 7.3.7.3 Configuring the State Machine
        4. 7.3.7.4 State Machine Timing Considerations
      8. 7.3.8  8-Bit Counters/Delay Generators/Finite State Machines
      9. 7.3.9  PWM Generators
      10. 7.3.10 Watchdog Timer
      11. 7.3.11 Analog Comparators
        1. 7.3.11.1 Discrete Analog Comparator (ACMP)
        2. 7.3.11.2 Multi-channel Analog Comparator (McACMP)
      12. 7.3.12 Voltage Reference (VREF)
      13. 7.3.13 Analog Temperature Sensor (TS)
      14. 7.3.14 Analog Multiplexer (AMUX)
      15. 7.3.15 Oscillators
        1. 7.3.15.1 2kHz Fixed Frequency Oscillator
        2. 7.3.15.2 2MHz Fixed Frequency Oscillator
        3. 7.3.15.3 25MHz Fixed Frequency Oscillator
        4. 7.3.15.4 Oscillator Power Modes
      16. 7.3.16 Serial Communications
        1. 7.3.16.1 I2C Mode
        2. 7.3.16.2 SPI Mode
        3. 7.3.16.3 Virtual I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
      2. 7.4.2 Power Supply Control Modes
      3. 7.4.3 Protection Features
        1. 7.4.3.1 Device Read/Write Lock
        2. 7.4.3.2 OTP Cyclic Redundancy Check (CRC)
      4. 7.4.4 Programming
        1. 7.4.4.1 Selectable I2C/SPI Interface
        2. 7.4.4.2 One-Time Programmable Memory (OTP)
        3. 7.4.4.3 Intel HEX File Format
        4. 7.4.4.4 TPLD2001 Registers
          1. 7.4.4.4.1 TPLD2001_User Registers
          2. 7.4.4.4.2 TPLD2001_Cfg_0 Registers
          3. 7.4.4.4.3 TPLD2001_Cfg_1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

SPI Timing Requirements

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITION MIN NOM MAX UNIT
fSCLK SCLK, SPI clock frequency 4 MHz
tSCLK SCLK, SPI clock period 250 ns
tR SDI, nCS, and SCLK signals rise time 40 ns
tF SDI, nCS, and SCLK signals fall time 40 ns
tSCLKH SCLK High time 125 ns
tSCLKL SCLK Low time 125 ns
tNCS_SU nCS setup time before rising edge of SCLK 100 ns
tNCS_HOLD nCS hold time after falling edge of SCLK 100 ns
tNCS_DIS nCS disable time 50 ns
tSDI_SU SDI setup time before rising edge of SCLK 50 ns
tSDI_HOLD SDI hold time after rising edge of SCLK 50 ns
tSDO_VALID Time from falling edge of SCLK to next SDO data 80 ns
tSDOR SDO rise time 40 ns
tSDOF SDO fall time 40 ns