SCPS286 July   2025 TPLD2001

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 I2C Bus Timing Requirements
    9. 5.9 SPI Timing Requirements
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I/O Pins
        1. 7.3.1.1 Input Modes
        2. 7.3.1.2 Output Modes
        3. 7.3.1.3 Pull-Up or Pull-Down Resistors
      2. 7.3.2  Connection Mux
      3. 7.3.3  Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT or D Flip-Flop/Latch macro-cell
          1. 7.3.3.1.1 2-Bit LUT
          2. 7.3.3.1.2 D Flip-Flop/Latch
        2. 7.3.3.2 2-Bit LUT or Pattern Generator macro-cell
          1. 7.3.3.2.1 2-Bit LUT
          2. 7.3.3.2.2 Pattern Generator
        3. 7.3.3.3 3-Bit LUT or D Flip-Flop/Latch with Reset/Set macro-cell
          1. 7.3.3.3.1 3-Bit LUT
          2. 7.3.3.3.2 D Flip-Flop/Latch with Reset/Set
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop/Latch or Shift Register macro-cell
          1. 7.3.3.4.1 3-Bit LUT
          2. 7.3.3.4.2 D Flip-Flop/Latch with Reset/Set
          3. 7.3.3.4.3 8-Bit Shift Register
        5. 7.3.3.5 4-Bit LUT or D Flip-Flop/Latch with Reset/Set macro-cell
          1. 7.3.3.5.1 4-Bit LUT
          2. 7.3.3.5.2 D Flip-Flop/Latch with Reset/Set
      4. 7.3.4  Configurable Logic and Timing blocks
        1. 7.3.4.1 3-Bit LUT
        2. 7.3.4.2 D Flip-Flop/Latch with Reset/Set
        3. 7.3.4.3 Counters/Delay Generators (CNT/DLY)
          1. 7.3.4.3.1 Delay Mode
          2. 7.3.4.3.2 Reset Counter Mode
          3. 7.3.4.3.3 One-Shot Mode
          4. 7.3.4.3.4 Frequency Comparator Mode
          5. 7.3.4.3.5 Edge Detector Mode
          6. 7.3.4.3.6 Delayed Edge Detector Mode
        4. 7.3.4.4 LUT/DFF + CNT modes
      5. 7.3.5  Programmable Deglitch Filter or Edge Detector
      6. 7.3.6  Deglitch Filter or Edge Detector
      7. 7.3.7  State Machine (SM)
        1. 7.3.7.1 State Machine Inputs
        2. 7.3.7.2 State Machine Outputs
        3. 7.3.7.3 Configuring the State Machine
        4. 7.3.7.4 State Machine Timing Considerations
      8. 7.3.8  8-Bit Counters/Delay Generators/Finite State Machines
      9. 7.3.9  PWM Generators
      10. 7.3.10 Watchdog Timer
      11. 7.3.11 Analog Comparators
        1. 7.3.11.1 Discrete Analog Comparator (ACMP)
        2. 7.3.11.2 Multi-channel Analog Comparator (McACMP)
      12. 7.3.12 Voltage Reference (VREF)
      13. 7.3.13 Analog Temperature Sensor (TS)
      14. 7.3.14 Analog Multiplexer (AMUX)
      15. 7.3.15 Oscillators
        1. 7.3.15.1 2kHz Fixed Frequency Oscillator
        2. 7.3.15.2 2MHz Fixed Frequency Oscillator
        3. 7.3.15.3 25MHz Fixed Frequency Oscillator
        4. 7.3.15.4 Oscillator Power Modes
      16. 7.3.16 Serial Communications
        1. 7.3.16.1 I2C Mode
        2. 7.3.16.2 SPI Mode
        3. 7.3.16.3 Virtual I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
      2. 7.4.2 Power Supply Control Modes
      3. 7.4.3 Protection Features
        1. 7.4.3.1 Device Read/Write Lock
        2. 7.4.3.2 OTP Cyclic Redundancy Check (CRC)
      4. 7.4.4 Programming
        1. 7.4.4.1 Selectable I2C/SPI Interface
        2. 7.4.4.2 One-Time Programmable Memory (OTP)
        3. 7.4.4.3 Intel HEX File Format
        4. 7.4.4.4 TPLD2001 Registers
          1. 7.4.4.4.1 TPLD2001_User Registers
          2. 7.4.4.4.2 TPLD2001_Cfg_0 Registers
          3. 7.4.4.4.3 TPLD2001_Cfg_1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage on VCC relative to GND -0.5 7 V
VI Input voltage -0.5 7 V
VO Output voltage -0.5 7 V
IIOK Input-output clamp current VIO < 0 -50 mA
IO Continuous output current VO = 0 to VCC -50 50 mA
IDC Maximum average or DC current (through each pin)   Push-pull 1X 12 mA
Push-pull 2X 17
Open-drain NMOS 1X 18
Open-drain NMOS 2X 28
Open-drain NMOS 4X 45
TJ Junction temperature 150 °C
Tstg Storage temperature -65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.