Table 2-7 describes the initial BGA decoupling and power filtering required for the ZCZ package of the AM263x, AM263Px. and AM261x microcontrollers. These decoupling capacitor quantities and sizes were based on the initial simulation feedback of the Control Card EVM PCB and AM263x package with the transient use-cases shown in Table 2-12. Table 2-8 describes the BGA decoupling and power filtering required for the ZFG, ZNC, and ZEJ packages of the AM261x MCU. These packages support 3.3V and 1.8V flash IO on the OSPI/QSPI peripherals, and thus have slightly different device power rails compared to the ZCZ package devices, which only support 3.3V flash IO on the OSPI peripherals. Variation in overall power pin counts also account for differences in decoupling on the AM261x ZFG/ZNC/ZEJ packages.

The decoupling network presented in the sections below and in the AM263x EVM schematics and layouts are reasonable starting points for any AM263x, AM263Px, or AM261x PCB design. However, due to specific PCB routing differences and the resulting plane capacitance and decoupling mounting inductances and other parasitics, TI highly recommends that designers simulate and measure the specific power distribution network performance. Simulations and measurements are usually done with target application software active, and intended operating environment conditions applied to the system.