TIDUE53J March   2018  – February 2025 TMS320F28P550SG , TMS320F28P550SJ , TMS320F28P559SG-Q1 , TMS320F28P559SJ-Q1

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1  UCC21710
      2. 2.2.2  UCC5350
      3. 2.2.3  TMS320F28379D
      4. 2.2.4  AMC3306M05
      5. 2.2.5  OPA4388
      6. 2.2.6  TMCS1123
      7. 2.2.7  AMC0330R
      8. 2.2.8  AMC0381D
      9. 2.2.9  UCC14341
      10. 2.2.10 UCC33421
    3. 2.3 System Design Theory
      1. 2.3.1 Three-Phase T-Type Inverter
        1. 2.3.1.1 Architecture Overview
        2. 2.3.1.2 LCL Filter Design
        3. 2.3.1.3 Inductor Design
        4. 2.3.1.4 SiC MOSFETs Selection
        5. 2.3.1.5 Loss Estimations
      2. 2.3.2 Voltage Sensing
      3. 2.3.3 Current Sensing
      4. 2.3.4 System Auxiliary Power Supply
      5. 2.3.5 Gate Drivers
        1. 2.3.5.1 1200-V SiC MOSFETs
        2. 2.3.5.2 650-V SiC MOSFETs
        3. 2.3.5.3 Gate Driver Bias Supply
      6. 2.3.6 Control Design
        1. 2.3.6.1 Current Loop Design
        2. 2.3.6.2 PFC DC Bus Voltage Regulation Loop Design
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
        1. 3.1.1.1 Test Hardware Required
        2. 3.1.1.2 Microcontroller Resources Used on the Design (TMS320F28379D)
        3. 3.1.1.3 F28377D, F28379D Control-Card Settings
        4. 3.1.1.4 Microcontroller Resources Used on the Design (TMS320F280039C)
      2. 3.1.2 Software
        1. 3.1.2.1 Getting Started With Firmware
          1. 3.1.2.1.1 Opening the CCS project
          2. 3.1.2.1.2 Digital Power SDK Software Architecture
          3. 3.1.2.1.3 Interrupts and Lab Structure
          4. 3.1.2.1.4 Building, Loading, and Debugging the Firmware
          5. 3.1.2.1.5 CPU Loading
        2. 3.1.2.2 Protection Scheme
        3. 3.1.2.3 PWM Switching Scheme
        4. 3.1.2.4 ADC Loading
    2. 3.2 Testing and Results
      1. 3.2.1 Lab 1
      2. 3.2.2 Testing Inverter Operation
        1. 3.2.2.1 Lab 2
        2. 3.2.2.2 Lab 3
        3. 3.2.2.3 Lab 4
      3. 3.2.3 Testing PFC Operation
        1. 3.2.3.1 Lab 5
        2. 3.2.3.2 Lab 6
        3. 3.2.3.3 Lab 7
      4. 3.2.4 Test Setup for Efficiency
      5. 3.2.5 Test Results
        1. 3.2.5.1 PFC Mode
          1. 3.2.5.1.1 PFC Start-Up – 230 VRMS, 400 VL-L AC Voltage
          2. 3.2.5.1.2 Steady State Results - PFC Mode
          3. 3.2.5.1.3 Efficiency, THD, and Power Factor Results, 60 Hz – PFC Mode
          4. 3.2.5.1.4 Transient Test With Step Load Change
        2. 3.2.5.2 Inverter Mode
  10. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
      1. 4.3.1 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
  11. 5Trademarks
  12. 6About the Authors
  13. 7Revision History

1 System Description

Modern commercial scale solar inverters are seeing innovation on two fronts, which lead to smaller, higher efficiency products on the market:

  • The move to higher voltage solar arrays
  • Reducing the size of the onboard magnetics

By increasing the voltage to 1000-V or 1500-V DC from the array, the current can be reduced to maintain the same power levels. This reduction in current results in less copper and smaller power conducting devices required in the design. The reduction in di/dt also reduces the stress on electrical components. However, sustained DC voltages of > 1 kV can be difficult to design to, or even find components that can survive.

To compensate for the voltage stresses generated by high-voltage solar arrays, new topologies of solar inverters have been designed. Traditional half bridges block the full input voltage on each switching device. By adding additional switched blocking and conduction components, the overall stress on the device can be significantly reduced. This reference design shows how to implement a three-level converter. Higher level converters are also possible, further increasing the voltage handling capability.

Additional power density in solar electronics is also being enabled by moving to higher switching speeds in the power converters. As this design shows, even a modestly higher switching speed reduces the overall size requirement of the output filter stage—a primary contributor to the design size.

Traditional switching devices have a limit in how quickly these devices can switch high voltages, or more appropriately, the dV/dt ability of the device. This slow ramp up and down increases conduction loss because the device spends more time in a switching state. This increased switch time also increases the amount of dead time required in the control system to prevent shoot-through and shorts. The answer to this was developed in newer switching semiconductor technology like SiC and GaN devices with high electron mobility. This reference design uses SiC MOSFETs alongside TI's SiC gate driver technology to demonstrate the potential increase in power density.

Similarly for Onboard Chargers (OBC) higher power chargers (11 kW and 22 kW) are increasingly required. For which three phase PFC is necessary, this design shows implementation of three phase PFC using DQ control and presents the complete control loop model.