TLIN1028-Q1

HSOIC (DDA)

8

19 mm² 4.9 x 3.9

SOIC (D)

8

19 mm² 4.9 x 3.9

VSON (DRB)

8

9 mm² 3 x 3

AEC-Q100 (Grade 1): Qualified for automotive applications
Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN
Functional Safety-Capable
- Documentation available to aid functional safety system design
Supports 12-V applications
Wide operating ranges
- ±58 V LIN bus fault protection
- LDO output supporting 3.3 V or 5 V
- Sleep mode: Ultra-low current consumption allows wake-up event from:
  - LIN bus or local wake through EN pin
- Power-up and down glitch-free operation
Protection features:
- ESD protection, V_SUP under-voltage protection
- TXD dominant time out (DTO) protection, Thermal shutdown
- Unpowered node or ground disconnection fail-safe at system level
V_CC sources up to 125 mA with DRB and DDA package
Available in SOIC (8) and HSOIC (8) packages, and leadless VSON (8) package with improved automated optical inspection (AOI) capability

AEC-Q100 (Grade 1): Qualified for automotive applications
Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN
Functional Safety-Capable
- Documentation available to aid functional safety system design
Supports 12-V applications
Wide operating ranges
- ±58 V LIN bus fault protection
- LDO output supporting 3.3 V or 5 V
- Sleep mode: Ultra-low current consumption allows wake-up event from:
  - LIN bus or local wake through EN pin
- Power-up and down glitch-free operation
Protection features:
- ESD protection, V_SUP under-voltage protection
- TXD dominant time out (DTO) protection, Thermal shutdown
- Unpowered node or ground disconnection fail-safe at system level
V_CC sources up to 125 mA with DRB and DDA package
Available in SOIC (8) and HSOIC (8) packages, and leadless VSON (8) package with improved automated optical inspection (AOI) capability

The TLIN1028-Q1 is a local interconnect network (LIN) physical layer transceiver, compliant to LIN 2.2A ISO/DIS 17987–4 standards, with an integrated low dropout (LDO) voltage regulator.

This LIN system basis chip (SBC) reduces system complexity by providing a 3.3 V or 5 V rail with up to 70 mA (D) or 125 mA (DRB and DDA) of current to power microprocessors, sensors or other devices. The TLIN1028-Q1 has an optimized current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The TLIN1028-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal. The receiver converts the data stream to logic-level signals that are sent to the microprocessor through the open-drain RXD pin.

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The TLIN1028-Q1 is a local interconnect network (LIN) physical layer transceiver, compliant to LIN 2.2A ISO/DIS 17987–4 standards, with an integrated low dropout (LDO) voltage regulator.

This LIN system basis chip (SBC) reduces system complexity by providing a 3.3 V or 5 V rail with up to 70 mA (D) or 125 mA (DRB and DDA) of current to power microprocessors, sensors or other devices. The TLIN1028-Q1 has an optimized current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The TLIN1028-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal. The receiver converts the data stream to logic-level signals that are sent to the microprocessor through the open-drain RXD pin.

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Technical documentation

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	Type	Title	Date
*	Data sheet	TLIN1028-Q1 Automotive Local Interconnect Network (LIN) Transceiver with Integra datasheet (Rev. A)	30 Oct 2019
	Functional safety information	TLIN1028x-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA	26 Mar 2020
	User guide	TLIN1028x EVM User's Guide	24 Apr 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TLIN1028EVM — TLIN1028 LIN system basis chip with integrated LDO and MCU reset evaluation module

This EVM can be used to evaluate the TLIN1028x family of devices. The LIN bus is easily accessed via the J6 and J9 connectors, along with VBAT and GND to make easy connections to real LIN systems. All logic signals are available through headers and test points, and modes are easily transitioned (...)

User guide

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Simulation model

TLIN1028-Q1 IBIS Model

SLLM440.ZIP (73 KB) - IBIS Model

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Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)

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Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)

User guide

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Reference designs

TIDA-020027 — Automotive full-featured side mirror module reference design

The modern luxury side mirror includes many convenient features that allow for a better and safer experience for the driver beyond simple X-Y directional control of the mirror. This includes automatically dimming mirrors for glare reduction; mirror assembly folding to prevent damage in tight (...)

Schematic

Reference designs

TIDA-020026 — Stepper-motor driver reference design for adaptive front lights and dynamic headlight leveling

This reference design details a solution to drive and control two stepper motors for dynamic headlight leveling and swiveling in automotive headlight applications such as an adaptive LED driving module or a high-resolution DLP module. It uses a local interconnect network (LIN) system basic chip (...)