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TS3A5018

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3.3-V, 2:1 (SPDT), 4-channel general-purpose analog switch

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3.3-V, 2:1 (SPDT), 4-channel general-purpose analog switch

TS3A5018

ACTIVE
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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 4 Power supply voltage - single (V) 1.8, 2.5, 3.3 Ron (Typ) (Ohms) 5.5 ON-state leakage current (Max) (µA) 2 Bandwidth (MHz) 300 Operating temperature range (C) -40 to 85 Features Supports SPI signals, Supports JTAG signals Input/output continuous current (Max) (mA) 64 Rating Catalog CON (Typ) (pF) 16 Supply current (Typ) (uA) 0.7 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 UQFN (RSV) 16 5 mm² 2.6 x 1.8 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches & muxes

Features

  • Low ON-State Resistance (10 Ω)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.8-V to 3.6-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Mode (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

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Description

The TS3A5018 device is a quad single-pole double-throw (SPDT) analog switch that is designed to operate from 1.8 V to 3.6 V. This device can handle digital and analog signals, and signals up to V+ can be transmitted in either direction.

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Exact equivalent in functionality and parametrics to the compared device:
TMUX1574 ACTIVE 5-V, 2:1 (SPDT), 4-channel analog switch with powered-off protection & 1.8-V input logic Upgraded 2-GHz bandwidth, 2-Ω RON, and 1.8-V logic support

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 8
Type Title Date
* Datasheet TS3A5018 10-Ω Quad SPDT Analog Switch datasheet (Rev. H) May 30, 2018
* Errata Datasheet Errata for TS3A5018 Device Type Aug. 04, 2008
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes 1.8 V Logic for Muxes and Signal May 16, 2018
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
299
Description

The AWR1243 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip AWR1243 mmWave sensing device, with direct connectivity to the TI MCU LaunchPad™ development-kit ecosystem.

AWR1243BOOST contains everything required to start developing on a low-power Arm® (...)

Features
  • Onboard antenna enables field testing
  • XDS110-based JTAG with serial port interface for flash programming
  • UART-to-USB interface for control, configuration, and data visualization
  • TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
  • CAN connector enables direct interface to car units
View details
EVALUATION BOARDS Download
document-generic User guide
299
Description

The AWR1443 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip AWR1443 mmWave sensing device, with direct connectivity to the TI MCU LaunchPad™ development-kit ecosystem.

AWR1443BOOST contains everything required to start developing on a low-power Arm® (...)

Features
  • Onboard antenna enables field testing
  • XDS110-based JTAG with serial-port interface for flash programming
  • UART-to-USB interface for control, configuration, and data visualization
  • TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
  • CAN connector enables direct interface to car units
View details
EVALUATION BOARDS Download
document-generic User guide
299
Description

The AWR1843 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip AWR1843 mmWave sensing device, with direct connectivity to the TI MCU LaunchPad™ development-kit ecosystem.

AWR1843BOOST contains everything required to start developing an application on a low-power (...)

Features
  • Onboard antenna enables field testing
  • XDS110-based JTAG with serial-port interface for flash programming
  • UART-to-USB interface for control, configuration, and data visualization
  • TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
  • CAN connector enables direct interfact to car units
View details
EVALUATION BOARDS Download
document-generic User guide
349
Description

The AWR2243 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip AWR2243 mmWave sensing device.

AWR2243BOOST contains everything required to start developing using the MMWAVE-STUDIO environment and the DCA1000 real-time data capture adapter.

The standard 20-pin BoosterPack (...)

Features
  • Onboard antenna enables field testing
  • Standard interface for DCA1000 connectivity and MMWAVE-STUDIO for raw data capture
  • TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
View details
EVALUATION BOARDS Download
document-generic User guide
Description

The IWR1443 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip IWR1443 mmWave sensing device, with direct connectivity to the TI MCU LaunchPad™ development-kit ecosystem.

IWR1443BOOST contains everything required to start developing on a low-power Arm® (...)

Features
  • Onboard antenna enables field testing
  • XDS110-based JTAG with serial-port interface for flash programming
  • UART-to-USB interface for control, configuration, and data visualization
  • TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
  • CAN connector enables direct interface to car units
View details
EVALUATION BOARDS Download
document-generic User guide
299
Description

The IWR1843 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip IWR1843 mmWave sensing device, with direct connectivity to the TI MCU LaunchPad™ development-kit ecosystem.

IWR1843BOOST contains everything required to start developing on a low-power Arm® (...)

Features
  • Onboard antenna enables field testing
  • XDS110-based JTAG with serial-port interface for flash programming
  • UART-to-USB interface for control, configuration, and data visualization
  • TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
  • CAN connector enables direct interfact to car units
View details
EVALUATION BOARDS Download
document-generic User guide
199
Description

MMWAVEICBOOST carrier card platform enables rapid evaluation of an mmWave sensor by providing modular interface to various sensor and antenna kits. This carrier card enables debug, emulation, and direct interface to mmWave tools through USB connectivity. Raw analog-to-digital (...)

Features
  • Modular connectivity to mmWave antenna plug-in module
  • BoosterPack™ plug-in module interface
  • Debug and emulation through onboard XDS110
  • DCA1000EVM interface for raw ADC data capture
  • Compatible with mmWave studio (MMWAVE-STUDIO) tools, including mmWave demo visualizer (MMWAVE-DEMO-VISUALIZER)
View details
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


View details
INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
View details

Design tools & simulation

SIMULATION MODELS Download
SCDM103.ZIP (44 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Vehicle occupant detection reference design
TIDEP-01001 — This reference design demonstrates the use of the AWR6843 60GHz single-chip mmWave sensor with integrated DSP, as a Vehicle Occupant Detection (VOD) and Child Presence Detection (CPD) Sensor enabling the detection of life forms in a vehicle. This design provides a reference software processing chain (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Beamsteering for corner radar reference design
TIDEP-01021 — This reference design provides a foundation for blind-spot detection (BSD), cross-traffic alert (CTA), lane-change assist (LCA), and traffic-jam assist (TJA) applications using the AWR1843BOOST evaluation module (EVM). This design allows the estimation (in the azimuthal and elevation plane (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Automated parking system reference design using 77-GHz mmWave sensor
TIDEP-01011 — This reference design demonstrates the use of AWR1843, a 77-GHz single-chip mmWave sensor with integrated DSP, MCU, and hardware accelerator as an automated parking sensor, which enables robust detection of objects around a car in challenging parking and environmental conditions. With a range (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Obstacle detection reference design using 77-GHz mmWave sensor
TIDEP-0104 — This reference design demonstrates the use of the AWR1642 single-chip mmWave sensor with integrated DSP as an obstacle-detection sensor for the car door and trunk, enabling applications like automatic car door openers and intelligent car doors that can accurately detect obstacles/objects in a (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
UQFN (RSV) 16 View options
VQFN (RGY) 16 View options

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