Startseite Schnittstelle LVDS-, M-LVDS- und PECL-ICs

DS90LV019

AKTIV

3,3-V oder 5-V LVDS-Treiber und ‑Empfänger

Produktdetails

Function Transceiver Protocols LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3, 5 Signaling rate (MBits) 100 Input signal CMOS, LVDS, LVTTL, TTL Output signal LVDS, LVTTL, TTL Rating Catalog Operating temperature range (°C) -40 to 85
Function Transceiver Protocols LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3, 5 Signaling rate (MBits) 100 Input signal CMOS, LVDS, LVTTL, TTL Output signal LVDS, LVTTL, TTL Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 14 51.9 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4
  • LVDS Signaling
  • 3.3V or 5.0V operation
  • Low power CMOS design
  • Balanced Output Impedance
  • Glitch free power up/down (Driver disabled)
  • High Signaling Rate Capacity (above 100 Mbps)
  • Ultra Low Power Dissipation
  • ±1V Common-Mode Range
  • ±100 mV Receiver Sensitivity
  • Product offered in SOIC and TSSOP packages
  • Flow-Through Pin Out
  • Industrial Temperature Range Operation

TRI-STATE® is a registered trademark of National Semiconductor Corporation.

  • LVDS Signaling
  • 3.3V or 5.0V operation
  • Low power CMOS design
  • Balanced Output Impedance
  • Glitch free power up/down (Driver disabled)
  • High Signaling Rate Capacity (above 100 Mbps)
  • Ultra Low Power Dissipation
  • ±1V Common-Mode Range
  • ±100 mV Receiver Sensitivity
  • Product offered in SOIC and TSSOP packages
  • Flow-Through Pin Out
  • Industrial Temperature Range Operation

TRI-STATE® is a registered trademark of National Semiconductor Corporation.

The DS90LV019 is a Driver/Receiver designed specifically for the high speed low power point-to-point interconnect applications. The device operates from a single 3.3V or 5.0V power supply and includes one differential line driver and one receiver. The DS90LV019 features an independent driver and receiver with TTL/CMOS compatibility (DIN and ROUT). The logic interface provides maximum flexibility as 4 separate lines are provided (DIN, DE, RE#, and ROUT). The device also features a flow-through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver has 3.5 mA output loop current.

The driver translates between TTL levels (single-ended) to Low Voltage Differential Signaling levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition, the differential signaling provides common-mode noise rejection.

The receiver threshold is ±100 mV over a ±1V common-mode range and translates the low swing differential levels to standard (TTL/CMOS) levels.


The DS90LV019 is a Driver/Receiver designed specifically for the high speed low power point-to-point interconnect applications. The device operates from a single 3.3V or 5.0V power supply and includes one differential line driver and one receiver. The DS90LV019 features an independent driver and receiver with TTL/CMOS compatibility (DIN and ROUT). The logic interface provides maximum flexibility as 4 separate lines are provided (DIN, DE, RE#, and ROUT). The device also features a flow-through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver has 3.5 mA output loop current.

The driver translates between TTL levels (single-ended) to Low Voltage Differential Signaling levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition, the differential signaling provides common-mode noise rejection.

The receiver threshold is ±100 mV over a ±1V common-mode range and translates the low swing differential levels to standard (TTL/CMOS) levels.


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Technische Dokumentation

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Typ Titel Datum
* Data sheet DS90LV019 3.3V or 5V LVDS Driver/Receiver datasheet (Rev. B) 14 Mai 2004
More literature Die D/S DS90LV019 MDC 3.3V Or 5V Lvds Driver/Receiver 07 Sep 2012
Application note An Overview of LVDS Technology 05 Okt 1998

Design und Entwicklung

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Evaluierungsplatine

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Benutzerhandbuch: PDF
Simulationsmodell

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Benutzerhandbuch: PDF
Gehäuse Pins Herunterladen
SOIC (D) 14 Optionen anzeigen
TSSOP (PW) 14 Optionen anzeigen

Bestellen & Qualität

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  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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  • Werksstandort
  • Montagestandort

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