Startseite Schnittstelle LVDS-, M-LVDS- und PECL-ICs

SN65LVDT41-EP

AKTIV

Verbessertes Produkt, Memorystick™-Chipsatz für Verbindungserweiterung

Produktdetails

Function Transceiver Protocols LVDS Number of transmitters 4 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 125 Input signal LVDS, LVTTL Output signal LVDS, LVTTL Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
Function Transceiver Protocols LVDS Number of transmitters 4 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 125 Input signal LVDS, LVTTL Output signal LVDS, LVTTL Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Integrated 110- Nominal Receiver Line Termination Resistor
  • Operate From a Single 3.3-V Supply
  • Greater Than 125-Mbps Data Rate
  • Flow-Through Pinout
  • LVTTL-Compatible Logic I/Os
  • ESD Protection on Bus Pins Exceeds 12 kV
  • Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
  • 20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
  • APPLICATIONS
    • Memory Stick™ Interface Extensions With Long Interconnects Between Host and
      Memory Stick
    • Serial Peripheral Interface™ (SPI™) Interface Extension to Allow Long Interconnects
      Between Master and Slave
    • MultiMediaCard™ (MMC) Interface in SPI Mode
    • General-Purpose Asymmetric Bidirectional Communication

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
Serial Peripheral Interface, SPI are trademarks of Motorola.
MultiMediaCard is a trademark of MultiMediaCard Association.
Memory Stick is a trademark of Sony.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Integrated 110- Nominal Receiver Line Termination Resistor
  • Operate From a Single 3.3-V Supply
  • Greater Than 125-Mbps Data Rate
  • Flow-Through Pinout
  • LVTTL-Compatible Logic I/Os
  • ESD Protection on Bus Pins Exceeds 12 kV
  • Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
  • 20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
  • APPLICATIONS
    • Memory Stick™ Interface Extensions With Long Interconnects Between Host and
      Memory Stick
    • Serial Peripheral Interface™ (SPI™) Interface Extension to Allow Long Interconnects
      Between Master and Slave
    • MultiMediaCard™ (MMC) Interface in SPI Mode
    • General-Purpose Asymmetric Bidirectional Communication

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
Serial Peripheral Interface, SPI are trademarks of Motorola.
MultiMediaCard is a trademark of MultiMediaCard Association.
Memory Stick is a trademark of Sony.

The SN65LVDT14 combines one LVDS line driver with four terminated LVDS line receivers in one package. It is designed to be used at the Memory Stick™ end of an LVDS-based Memory Stick interface extension.

The SN65LVDT41 combines four LVDS line drivers with a single terminated LVDS line receiver in one package. It is designed to be used at the host end of an LVDS-based Memory Stick interface extension.

The SN65LVDT14 combines one LVDS line driver with four terminated LVDS line receivers in one package. It is designed to be used at the Memory Stick™ end of an LVDS-based Memory Stick interface extension.

The SN65LVDT41 combines four LVDS line drivers with a single terminated LVDS line receiver in one package. It is designed to be used at the host end of an LVDS-based Memory Stick interface extension.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 5
Typ Titel Datum
* Data sheet SN65LVDT14-EP, SN65LVDT41-EP datasheet 07 Jun 2005
* Radiation & reliability report SN65LVDT41QPWREP Reliability Report 06 Feb 2015
Application brief LVDS to Improve EMC in Motor Drives 27 Sep 2018
Application brief How Far, How Fast Can You Operate LVDS Drivers and Receivers? 03 Aug 2018
Application brief How to Terminate LVDS Connections with DC and AC Coupling 16 Mai 2018

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

SN65LVDT41 IBIS Model

SLLC120.ZIP (7 KB) - IBIS Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
TSSOP (PW) 20 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos