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CC2564C

ACTIVO

Transceptor Bluetooth® de modo dual calificado conforme a Bluetooth Core 5.1

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CC2564C

ACTIVO
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Detalles del producto

CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² (8 mm × 8 mm)
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 2/12/2020
Nota sobre la aplicación QFN and SON PCB Attachment (Rev. C) PDF | HTML 6/12/2023
Guía del usuario CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 8/08/2023
Guía del usuario CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 8/08/2023
Guía del usuario TI Bluetooth Stack HIDDemo App PDF | HTML 4/08/2023
Guía de selección CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13/05/2022
Guía de selección Wireless Connectivity Technology Selection Guide (Rev. B) 14/02/2022
Más documentación Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 20/12/2021
Guía del usuario CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 20/12/2021
Guía del usuario CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 2/12/2021
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 1/12/2021
Guía del usuario CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 1/12/2021
Guía del usuario Bluetopia Stack Build Guide for Linux PDF | HTML 15/01/2021
Guía del usuario CC2564x Demo Applications User's Guide PDF | HTML 17/12/2020
Asesoramiento en ciberseguridad Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17/07/2020
Asesoramiento en ciberseguridad Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18/05/2020
Asesoramiento en ciberseguridad Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18/05/2020
Nota sobre la aplicación Capturing Bluetooth Host Controller Interface (HCI) Logs 7/01/2019
Informe Which TI Bluetooth® solution should I choose? 5/05/2017
Informe White Paper: Why Classic Bluetooth® (BR/EDR)? 4/05/2017
Artículo técnico Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 13/12/2016
Nota sobre la aplicación Application Notes for CC2564C Bluetooth® 4.1 and 4.2 1/11/2016

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

CC256XCQFN-EM — Módulo de evaluación de controlador Bluetooth® de modo dual CC2564C

El dispositivo Bluetooth® CC256xC TI es una solución de velocidad básica (BR), velocidad de datos mejorada (EDR) e interfaz de controlador de host (HCI) LE que reduce el esfuerzo de diseño y agiliza la comercialización. Basado en el núcleo de séptima generación de TI, el módulo es una solución de (...)

Guía del usuario: PDF | HTML
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Placa de evaluación

PIDEU-3P-PAN13X6C — Módulos de radiofrecuencia (RF) Bluetooth Panasonic Industry PAN13x6C

La serie PAN1326C2/PAN1316C de Panasonic es un módulo Bluetooth® de radiofrecuencia (RF) de interfaz controlada por host (HCI) que acerca el circuito integrado de núcleo Bluetooth de séptima generación CC2564C de Texas Instruments™ a un formato de módulo fácil de usar. Los PAN1326C2/PAN1316C son (...)

Desde: Panasonic Industrial Devices Europe GmbH
Productos y hardware compatibles
Tarjeta secundaria

BDE-3P-BD2564CX — Módulos inalámbricos BDE BD2564Cx

Los módulos BDE-3P-BD2564Cx son módulos transceptores de modo dual Bluetooth 5.1 de velocidad básica (BR), tasa de datos mejorada (EDR) y baja energía (LE) basados en el CC2564C de TI. Estos módulos ofrecen el mejor rendimiento de radiofrecuencia (RF) de su clase con una energía de transmisión de (...)

Desde: BDE Technology Inc.
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Tarjeta secundaria

BDE-3P-BDM209B — BDE BDM209B dual-mode Bluetooth® module

BDE-BDM209B is a Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE) Dual-Mode module.

The module offers Bluetooth Classic and Bluetooth LE radio (CC2564C) from Texas Instruments (TI) and an ultra-low-power Arm® Cortex®-M4 32-bit MCU (STM32L431). It integrates all required (...)

Desde: BDE Technology Inc.
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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Controlador o biblioteca

CC2564CMSP432BTBLESW — Pila Bluetooth® de modo doble CC2564C de TI en MCU MSP432

El software CC2564C para pila Bluetooth® de modo doble en MCU MSP432 de TI para Bluetooth + Bluetooth baja energía habilita la MCU MSP432 y se compone de ofertas de modo único y modo doble que implementan la especificación Bluetooth 5.1. La pila Bluetooth está totalmente calificada (QDID172096 y (...)

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Controlador o biblioteca

CC2564CSTBTBLESW — Pila Bluetooth® de modo doble CC2564C de TI en MCU STM32F4

La pila Bluetooth® de modo doble CC2564C de TI en el software de MCU STM32F4 para Bluetooth + Bluetooth baja energía habilita la MCU STM32 ARM Cortex M4 y se compone de ofertas de modo simple y modo doble que implementan la especificación Bluetooth 5.1. La pila Bluetooth está totalmente calificada (...)

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Controlador o biblioteca

CC256XC-BT-SP — Paquete de servicio Bluetooth® para CC256xC

El paquete de servicio (SP) Bluetooth CC256xC contiene los scripts de inicialización obligatorios (archivos BTS) que tienen configuraciones específicas de la plataforma y correcciones de errores.

Además, el paquete de servicio Bluetooth también contiene archivos complementarios para el dispositivo (...)

lock = Requiere aprobación de exportación (1 minuto)
Productos y hardware compatibles
Controlador o biblioteca

TI-BT-STACK-LINUX-ADDON — Complemento de TI Bluetooth Linux para AM335x EVM, AM437x EVM y BeagleBone con WL18xx y CC256x

Este encapsulado contiene el encapsulado de instalación, el objeto precompilado y el código fuente de la pila Bluetooth de TI y el gestor de plataforma para actualizar fácilmente el binario LINUX EZSDK predeterminado en un AM437x EVM, AM335x EVM o BeagleBone. El software se creó con Linaro GCC 4.7 (...)

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Certificación

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

¿Está buscando soporte para la certificación del módulo CC256x? CC256x-CERTIFCATION proporciona información relevante y soporte para la certificación exitosa de su producto. En esta página encontrará los informes de certificación más recientes de nuestros módulos, así como de nuestras placas de (...)
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Herramienta de diseño

DUALMODE-BT-DESIGN-REVIEWS — Revisiones de diseño de hardware para dispositivos CC256x

Para comenzar con el proceso de revisión del diseño de hardware Bluetooth® de modo doble:

  • Paso 1: Antes de solicitar una revisión, es importante que revise la documentación técnica y los recursos de diseño y desarrollo disponibles en la página del producto correspondiente (consulte los enlaces de la (...)
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Pedidos y calidad

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Soporte y capacitación

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