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CC2564C

ACTIVO

Bluetooth® 5.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), baja energía (LE)

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CC2564C

ACTIVO
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Detalles del producto

Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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Documentación técnica

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Tipo Título Fecha
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 02 dic 2020
Cybersecurity advisory CC2564C: BT (BR/EDR) SIG Errata 11838 - LMP Encryption Key Minimum Size Change PDF | HTML 20 dic 2023
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 dic 2023
Cybersecurity advisory CC2564C: CC256x and WL18xx Bluetooth Low Energy - LE scan vulnerability PDF | HTML 12 nov 2023
User guide CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 08 ago 2023
User guide CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 08 ago 2023
User guide TI Bluetooth Stack HIDDemo App PDF | HTML 04 ago 2023
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13 may 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 feb 2022
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 20 dic 2021
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 20 dic 2021
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 02 dic 2021
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 01 dic 2021
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 01 dic 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 ene 2021
User guide CC2564x Demo Applications User's Guide PDF | HTML 17 dic 2020
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17 jul 2020
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 may 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 may 2020
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 ene 2019
White paper Which TI Bluetooth® solution should I choose? 05 may 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 04 may 2017
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 13 dic 2016
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 01 nov 2016

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

CC256XCQFN-EM — Módulo de evaluación de controlador Bluetooth® de modo dual CC2564C

El dispositivo Bluetooth® CC256xC TI es una solución de velocidad básica (BR), velocidad de datos mejorada (EDR) e interfaz de controlador de host (HCI) LE que reduce el esfuerzo de diseño y agiliza la comercialización. Basado en el núcleo de séptima generación de TI, el módulo es una solución de (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

PIDEU-3P-PAN13X6C — Módulos de radiofrecuencia (RF) Bluetooth Panasonic Industry PAN13x6C

La serie PAN1326C2/PAN1316C de Panasonic es un módulo Bluetooth® de radiofrecuencia (RF) de interfaz controlada por host (HCI) que acerca el circuito integrado de núcleo Bluetooth de séptima generación CC2564C de Texas Instruments™ a un formato de módulo fácil de usar. Los PAN1326C2/PAN1316C son (...)

Desde: Panasonic Industrial Devices Europe GmbH
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Tarjeta secundaria

BDE-3P-BD2564CX — Módulos inalámbricos BDE BD2564Cx

Los módulos BDE-3P-BD2564Cx son módulos transceptores de modo dual Bluetooth 5.1 de velocidad básica (BR), tasa de datos mejorada (EDR) y baja energía (LE) basados en el CC2564C de TI. Estos módulos ofrecen el mejor rendimiento de radiofrecuencia (RF) de su clase con una energía de transmisión de (...)

Desde: BDE Technology Inc.
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Controlador o biblioteca

CC2564CMSP432BTBLESW — Pila Bluetooth® de modo doble CC2564C de TI en MCU MSP432

El software CC2564C para pila Bluetooth® de modo doble en MCU MSP432 de TI para Bluetooth + Bluetooth baja energía habilita la MCU MSP432 y se compone de ofertas de modo único y modo doble que implementan la especificación Bluetooth 5.1. La pila Bluetooth está totalmente calificada (QDID172096 y (...)
Guía del usuario: PDF | HTML
Guía del usuario: PDF | HTML
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Controlador o biblioteca

CC2564CSTBTBLESW — Pila Bluetooth® de modo doble CC2564C de TI en MCU STM32F4

La pila Bluetooth® de modo doble CC2564C de TI en el software de MCU STM32F4 para Bluetooth + Bluetooth baja energía habilita la MCU STM32 ARM Cortex M4 y se compone de ofertas de modo simple y modo doble que implementan la especificación Bluetooth 5.1. La pila Bluetooth está totalmente calificada (...)
Guía del usuario: PDF | HTML
Guía del usuario: PDF | HTML
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Controlador o biblioteca

CC256XC-BT-SP — Paquete de servicio Bluetooth® para CC256xC

El paquete de servicio (SP) Bluetooth CC256xC contiene los scripts de inicialización obligatorios (archivos BTS) que tienen configuraciones específicas de la plataforma y correcciones de errores.

Además, el paquete de servicio Bluetooth también contiene archivos complementarios para el dispositivo (...)

Guía del usuario: PDF | HTML
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Controlador o biblioteca

TI-BT-STACK-LINUX-ADDON — Complemento de TI Bluetooth Linux para AM335x EVM, AM437x EVM y BeagleBone con WL18xx y CC256x

Este encapsulado contiene el encapsulado de instalación, el objeto precompilado y el código fuente de la pila Bluetooth de TI y el gestor de plataforma para actualizar fácilmente el binario LINUX EZSDK predeterminado en un AM437x EVM, AM335x EVM o BeagleBone. El software se creó con Linaro GCC 4.7 (...)
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
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Certificación

CC2564MODN-DESIGN-FILES — CC2564MODN Design Information for Regulatory Compliance

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Productos Wi-Fi
CC2564C — Bluetooth® 5.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), baja energía (LE)
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Certificación

CC256X-CERTIFICATION — Certificación de radio para Bluetooth de modo dual

¿Está buscando soporte para la certificación del módulo CC256x? CC256x-CERTIFCATION proporciona información relevante y soporte para la certificación exitosa de su producto. En esta página encontrará los informes de certificación más recientes de nuestros módulos, así como de nuestras placas de (...)
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Certificación

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Productos Wi-Fi
CC2564 — Bluetooth® 4.0 con velocidad de datos mejorada (EDR), baja energía (LE) y ANT CC2564C — Bluetooth® 5.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), baja energía (LE) CC2564MODA — Bluetooth® 4.1 con velocidad básica, velocidad de datos mejorada, módulo de baja energía (LE) con an CC2564MODN — Bluetooth® 4.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), módulo de baja energía
Desarrollo de hardware
Placa de evaluación
BOOST-CC2564MODA — Módulo enchufable BoosterPack™ de encadenamiento con sensores de temperatura TMP107 CC2564MODAEM — Módulo Bluetooth® CC2564 de modo dual con placa de evaluación de antena integrada CC2564MODNEM — Placa de evaluación de módulo Bluetooth® de modo dual CC2564 CC256XCQFN-EM — Módulo de evaluación de controlador Bluetooth® de modo dual CC2564C
Opciones de descarga
Herramienta de diseño

DUALMODE-BT-DESIGN-REVIEWS — Revisiones de diseño de hardware para dispositivos CC256x

Para comenzar con el proceso de revisión del diseño de hardware Bluetooth® de modo doble:
  • Paso 1: Antes de solicitar una revisión, es importante que revise la documentación técnica y los recursos de diseño y desarrollo disponibles en la página del producto correspondiente (consulte los enlaces de la (...)
Guía del usuario: PDF
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Archivo Gerber

CC256XCQFN-EM Design Files

SWRC329.ZIP (1375 KB)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFNP-MR (RVM) 76 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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