TLE2144AM
- Low noise
- 10Hz . . . 15nV/√ Hz
- 1kHz . . . 10.5nV/√ Hz
- Load capability: 10000pF
- Short-circuit output current: 20mA (minimum)
- Slew rate: 27V/µs (minimum)
- High gain-bandwidth product: 5.9MHz
- Low VIO: 500µV maximum at 25°C
- Single or split supply: 4V to 44V
- Fast settling time:
- 340ns to 0.1%
- 400ns to 0.01%
- Saturation recovery: 150ns
- Large output swing:
- VCC− + 0.1V to VCC+ − 1V
The TLE214x and TLE214xA devices are high-performance, internally compensated operational amplifiers built using Texas Instruments complementary bipolar Excalibur process. The TLE214xA is a tighter offset voltage grade of the TLE214x. Both are pin-compatible upgrades to standard industry products.
The design incorporates an input stage that simultaneously achieves low audio-band noise of 10.5nV/√ Hz with a 10Hz 1/f corner and symmetrical 40V/µs slew rate typically with loads up to 800pF. The resulting low distortion and high power bandwidth are important in high-fidelity audio applications. A fast settling time of 430ns to 0.1% of a 10V step with a 2kΩ/100pF load is useful in fast actuator/positioning drivers. Under similar test conditions, settling time to 0.01% is 640ns.
Both versions can also be used as comparators. Differential inputs of VCC± can be maintained without damage to the device. Open-loop propagation delay with TTL supply levels is typically 200ns. This gives a good indication as to output stage saturation recovery when the device is driven beyond the limits of recommended output swing.
Both the TLE214x and TLE214xA are available in a wide variety of packages, including both the industry-standard 8-pin small-outline version and chip form for high-density system applications. The C-suffix devices are characterized for operation from 0°C to 70°C, I-suffix devices from −40°C to 105°C, and M-suffix devices over the full military temperature range of −55°C to 125°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Excalibur Low-Noise High-Speed Precision Operational Amplifiers datasheet (Rev. E) | PDF | HTML | 2025/07/11 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치