SN55LVDS33-SP
- 400-Mbps Signaling Rate and 200-Mxfr/s Data Transfer Rate The signaling rate
of a line is the number of voltage transitions that are made per second expressed
in the units bps (bits per second). - Operates With a Single 3.3-V Supply
- –4 V to 5 V Common-Mode Input Voltage Range
- Differential Input Thresholds < ±50 mV With 50 mV of Hysteresis Over Entire
Common-Mode Input Voltage Range - Complies With TIA/EIA-644 (LVDS)
- Active Failsafe Assures a High-Level Output With No Input
- Bus-Pin ESD Protection Exceeds 15-kV HBM
- Input Remains High-Impedance On Power Down
- TTL Inputs Are 5-V Tolerant
- QML-V Qualified, SMD 5962-07248
- Military Temperature Range (–55°C to 125°C)
These LVDS data line receivers offers the widest common-mode input voltage range in the industry. These receivers provide an input voltage range specification compatible with a 5-V PECL signal as well as an overall increased ground-noise tolerance. They are in industry standard footprints with integrated termination as an option.
Precise control of the differential input voltage thresholds allows for inclusion of 50 mV of input voltage hysteresis to improve noise rejection on slowly changing input signals. The input thresholds are still no more than +50 mV over the full input common-mode voltage range.
The receivers can withstand ±15-kV Human-Body Model (HBM) and ±600-V Machine Model (MM) electrostatic discharges to the receiver input pins with respect to ground without damage. This provides reliability in cabled and other connections where potentially damaging noise is always a threat.
The receivers also include a (patent pending) failsafe circuit that provides a high-level output within 600 ns after loss of the input signal. The most common causes of signal loss are disconnected cables, shorted lines, or powered-down transmitters. The failsafe circuit prevents noise from being received as valid data under these fault conditions. This feature may also be used for wired-OR bus signaling. See The Active Failsafe Feature of the SN65LVDS32B application note.
The intended application and signaling technique of these devices is point-to-point baseband data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
The SN55LVDS33 is characterized for operation from –55°C to 125°C.
您可能會感興趣的類似產品
功能與所比較的裝置相似
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | High-Speed Differential Receiver datasheet (Rev. C) | 2012年 3月 1日 | |
| * | SMD | SN55LVDS33-SP SMD 5962-07248 | 2016年 7月 8日 | |
| * | Radiation & reliability report | SN55LVDS33-SP 50-krad and 100-krad TID Report | 2015年 3月 31日 | |
| * | Radiation & reliability report | SN55LVDS33-SP SEE Report | 2015年 3月 31日 | |
| Selection guide | TI Space Products (Rev. L) | 2026年 3月 27日 | ||
| Application brief | DLA Approved Optimizations for QML Products (Rev. C) | PDF | HTML | 2025年 6月 17日 | |
| Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. B) | PDF | HTML | 2025年 6月 10日 | |
| More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) | 2025年 2月 20日 | ||
| Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022年 10月 19日 | |
| Application brief | Space-Grade, 100-krad, Isolated Serial Peripheral Interface (SPI) LVDS Circuit | PDF | HTML | 2021年 6月 29日 | |
| E-book | Radiation Handbook for Electronics (Rev. A) | 2019年 5月 21日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| CFP (W) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。