開發模組 (EVM) 的 GUI
SN65HVD11-HT
- Operates With a 3.3-V Supply
- Bus-Pin ESD Protection Exceeds 16-kV Human-
Body Model (HBM) - 1/8 Unit-Load Option Available (up to 256 Nodes
on Bus) - Optional Driver Output Transition Times for
Signaling Rates(1) of 1 Mbps, 10 Mbps,
and 32 Mbps - Based on ANSI TIA/EIA-485-A
- Bus-Pin Short Circuit Protection From
–7 V to 12 V - Open-Circuit, Idle-Bus, and Shorted-Bus Fail-Safe
Receiver - Glitch-Free Power-Up and Power-Down Protection
for Hot-Plugging Applications - SN75176 Footprint
- Supports Extreme Temperature Applications:
- Controlled Baselines
- One Assembly and Test Sites
- One Fabrication Sites
- Available in Extreme (–55°C/210°C)
Temperature Range(2) - Extended Product Life Cycles
- Extended Product-Change Notifications
- Product Traceability
- Texas Instruments’ High Temperature
Products Use Highly Optimized Silicon (Die)
Solutions With Design and Process
Enhancements to Maximize Performance Over
Extended Temperatures.
The SN65HVD11-HT device combines a 3-state differential line driver and differential input line receiver that operates with a single 3.3-V power supply. It is designed for balanced transmission lines and meets or exceeds ANSI TIA/EIA-485-A and ISO 8482:1993, with the exception that the thermal shutdown is removed. This differential bus transceiver is a monolithic integrated circuit designed for bidirectional data communication on multipoint bus-transmission lines. The driver and receiver have active-high and active-low enables, respectively, that can be externally connected together to function as direction control.
The driver differential outputs and receiver differential inputs connect internally to form a differential input/ output (I/O) bus port that is designed to offer minimum loading to the bus when the driver is disabled or VCC = 0.
技術文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 5 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN65HVD11-HT 3.3-V RS-485 Transceiver datasheet (Rev. F) | PDF | HTML | 2015年 11月 30日 |
| * | Radiation & reliability report | SN65HVD11HKJ_HKQ Reliability Reports | 2012年 9月 20日 | |
| * | Radiation & reliability report | SN65HVD11JD Reliability Report | 2012年 9月 20日 | |
| * | Radiation & reliability report | SN65HVD11HD Reliability Report (Rev. A) | 2012年 8月 17日 | |
| EVM User's guide | Harsh Environment Acquisition Terminal (H.E.A.T.) System Evaluation Kit (Rev. D) | 2015年 7月 24日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
參考設計
TIDA-00002 — 適用於高溫應用的嚴苛環境採集終端 (HEAT) EVM 平台
The HEATEVM is a MCM intended to provide a high temperature platform for signal conditioning and processor evaluation. The module consists of a complete chain of components designed to withstand extreme operating temperatures up to 200 °C. The PCB is made with polymide material also suited for (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| CDIP_SB (JDJ) | 8 | Ultra Librarian |
| CFP (HKJ) | 8 | Ultra Librarian |
| CFP (HKQ) | 8 | Ultra Librarian |
| DIESALE (KGD) | — | |
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。