SNVR487 — TPSM53602 EVM Design Files
支援產品和硬體
產品
電源模組 (整合式電感器)
- TPSM53602 — 採用小型 5.5 x 5 x 4-mm 增強型 HotRod™ QFN 且具有簡單元件封裝的 36-V、2-A 降壓電源模組
硬體開發
開發板
- TPSM53602EVM — 採用小型封裝的 3.8-V 至 36-V、2-A 降壓電源模組評估板
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. B) | PDF | HTML | 2021年 9月 30日 |
| Functional safety information | TPSM53602 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2021年 8月 24日 | |
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020年 3月 5日 | ||
| White paper | Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging | 2019年 11月 19日 |
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| B3QFN (RDA) | 15 | Ultra Librarian |
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。