SBASAE3 December   2025 ADS125H18

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 SFDR Measurement
    12. 6.12 Noise Performance
    13. 6.13 TUE (Total Unadjusted Error) Measurement
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Divider and Input Multiplexer
      2. 7.3.2  Input Range
      3. 7.3.3  ADC Reference Voltage
      4. 7.3.4  Power Supplies
        1. 7.3.4.1 AVDD and AVSS
        2. 7.3.4.2 IOVDD
        3. 7.3.4.3 CAPA and CAPD
        4. 7.3.4.4 Power-On Reset (POR)
      5. 7.3.5  Clock Operation
        1. 7.3.5.1 Internal Oscillator
        2. 7.3.5.2 External Clock
      6. 7.3.6  Modulator
      7. 7.3.7  Digital Filter
        1. 7.3.7.1 Digital Filter Latency
        2. 7.3.7.2 Sinc3 and Sinc4 Filters
        3. 7.3.7.3 Sinc4 + Sinc1 Cascade Filter
        4. 7.3.7.4 50/60Hz Notch Filters
      8. 7.3.8  FIFO Buffer
        1. 7.3.8.1 FIFO Buffer Read and Write
        2. 7.3.8.2 FIFO Overflow and Underflow
        3. 7.3.8.3 FIFO Depth Indicator
        4. 7.3.8.4 FIFO Enable and Flush
        5. 7.3.8.5 FIFO Thresholds
      9. 7.3.9  Channel Auto-Sequencer
        1. 7.3.9.1 Auto-Sequencer: Basic Operation
        2. 7.3.9.2 Sequencer Modes
          1. 7.3.9.2.1 Single-Shot Mode
          2. 7.3.9.2.2 Single Step Continuous Conversion Mode
          3. 7.3.9.2.3 Single Sequence Mode
          4. 7.3.9.2.4 Continuous Sequence Mode
        3. 7.3.9.3 Configuring the Auto-Sequencer
        4. 7.3.9.4 Starting and Stopping the Sequencer
        5. 7.3.9.5 Auto-Sequencer and DRDY Behavior
      10. 7.3.10 Offset and Gain Calibration
      11. 7.3.11 Digital PGA
      12. 7.3.12 General Purpose IOs (GPIOs)
        1. 7.3.12.1 DRDY Output
        2. 7.3.12.2 FAULT Output
      13. 7.3.13 Open Wire Current Source (OWCS)
      14. 7.3.14 Open Wire Detection with ADC 0-code output
      15. 7.3.15 System Monitors
        1. 7.3.15.1 Internal Short (Offset Calibration)
        2. 7.3.15.2 Internal Temperature Sensor
        3. 7.3.15.3 External Reference Voltage Readback
        4. 7.3.15.4 Power-Supply Readback
        5. 7.3.15.5 Resistor Divider Supply Readback
      16. 7.3.16 Monitor Flags, Indicators and Counters
        1. 7.3.16.1  Reset (RESETn flag)
        2. 7.3.16.2  AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.16.3  Reference Undervoltage Monitor (REV_UVn flag)
        4. 7.3.16.4  Modulator Overrange Monitor (MOD_OVR_FAULTn flag)
        5. 7.3.16.5  Register Map CRC (REG_MAP_CRC_FAULTn flag)
        6. 7.3.16.6  Memory Map CRC (MEM_INTERNAL_FAULTn flag)
        7. 7.3.16.7  FIFO Overflow (FIFO_OFn flag) and FIFO Underflow (FIFO_UFn flag)
        8. 7.3.16.8  FIFO CRC Fault (FIFO_CRC_FAULTn flag)
        9. 7.3.16.9  GPIO Readback
        10. 7.3.16.10 SPI CRC Fault (SPI_CRC_FAULTn flag)
        11. 7.3.16.11 Register Write Fault (REG_WRITE_FAULTn flag)
        12. 7.3.16.12 DRDY Indicator (DRDY bit)
        13. 7.3.16.13 Sequencer Active Indicator (SEQ_ACTIVE bit)
        14. 7.3.16.14 Sequence Step Indicator (STEP_INDICATOR[4:0])
        15. 7.3.16.15 ADC Conversion Counter (CONV_COUNT[3:0])
        16. 7.3.16.16 FIFO Depth Indicator (FIFO_DEPTH[8:0])
        17. 7.3.16.17 Completed Sequence Counter (SEQ_COUNT[3:0])
      17. 7.3.17 Test DAC (TDAC)
      18. 7.3.18 Parallel Post Filters
        1. 7.3.18.1 Configuring the Parallel Post Filters
        2. 7.3.18.2 Frequency Response of the Parallel Post Filters
        3. 7.3.18.3 Settling Times and DRDY Behavior When Using the Post Filters
        4. 7.3.18.4 Examples of Recommended Post Filter Settings
      19. 7.3.19 Chip Select Forwarding
        1. 7.3.19.1 Configuring the CS forward feature
        2. 7.3.19.2 CS Forward Timeout
        3. 7.3.19.3 CS Forward Header, Frame, and State Diagram
        4. 7.3.19.4 Disabling the CS-FWD mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Scalable Speed Modes
      2. 7.4.2 Sequencer Functional Modes
      3. 7.4.3 Idle Mode and Standby Mode
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Reset
        1. 7.4.5.1 RESET Pin
        2. 7.4.5.2 Reset by SPI Register Write
        3. 7.4.5.3 Reset by SPI Input Pattern
      6. 7.4.6 Synchronization
      7. 7.4.7 Conversion-Start Delay Time
    5. 7.5 Programming
      1. 7.5.1  Serial Interface (SPI)
      2. 7.5.2  Serial Interface Signals
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.2.5 Data Ready (DRDY) Pin
      3. 7.5.3  Serial Interface Communication Structure
        1. 7.5.3.1 SPI Frame
        2. 7.5.3.2 STATUS Header
        3. 7.5.3.3 SPI CRC
      4. 7.5.4  Device Commands
        1. 7.5.4.1 No-Operation
        2. 7.5.4.2 Read Conversion Data
        3. 7.5.4.3 Read Register Command
        4. 7.5.4.4 Write Register Command
        5. 7.5.4.5 Read FIFO Buffer Command
      5. 7.5.5  Continuous Read Mode
        1. 7.5.5.1 Read Conversion Data in Continuous Read Mode
        2. 7.5.5.2 Read Registers in Continuous Read Mode
        3. 7.5.5.3 Read FIFO Buffer in Continuous Read Mode
      6. 7.5.6  SPI communication after POR or Reset
      7. 7.5.7  DRDY Pin Behavior
      8. 7.5.8  Daisy-Chain Operation
      9. 7.5.9  3-Wire SPI Mode
        1. 7.5.9.1 3-Wire SPI Mode Frame Re-Align
      10. 7.5.10 Conversion Data
      11. 7.5.11 Data Ready
        1. 7.5.11.1 DRDY Pin and SDO/DRDY Pin
        2. 7.5.11.2 DRDY Bit
        3. 7.5.11.3 Clock Counting
    6. 7.6 Register Map
      1. 7.6.1 ADS125H18 Status and General Configuration Page
      2. 7.6.2 ADS125H18 Step Configuration Page
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Serial Interface Connections
      2. 8.1.2 Interfacing with Multiple Devices
      3. 8.1.3 Unused Inputs and Outputs
      4. 8.1.4 Device Initialization
    2. 8.2 Typical Applications
      1. 8.2.1 2-Terminal V/I PLC Analog Input Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots - Crosstalk
      2. 8.2.2 3-Terminal V/I PLC Analog Input Module
      3. 8.2.3 2 -Terminal V/I PLC Analog Input Module With Solid State Switch
      4. 8.2.4 2-Terminal, single ended V/I PLC Analog Input Module
      5. 8.2.5 2-Terminal, I-Input PLC Analog Input Module
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supplies
      2. 8.3.2 Power-Supply Sequencing
      3. 8.3.3 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Test DAC (TDAC)

The ADS125H18 includes a test voltage digital-to-analog converter (TDAC) intended for ADC self-testing and verification. The 5-bit TDAC is capable of providing single-ended test voltages. The minimum TDAC output is 1/32 of the auxiliary voltage reference. The maximum TDAC output is equal to the auxiliary voltage reference.

As shown in the Functional Block Diagram, the unbuffered (and more accurate) TDAC output can also be directly connected to the high-impedance buffer inputs AINP and AINN. Set the STEPx_TDAC_SEL[4:0] to 00001b (positive input) or 00010b (negative input) to use this mode. The other input is connected to AVSS in each case. In this mode, the input multiplexer is forced open. If the user also selects a System Monitor using STEPx_SYS_MON[3:0] at the same time, the System Monitor has priority and the unbuffered TDAC is not used.

When using the buffered TDAC, a dedicated multiplexer routes the TDAC to the selected input as defined by the STEPx_TDAC_SEL[4:0] bits. The input multiplexer selection is unaffected. Set the STEPx_TDAC_SEL[4:0] to 10011b to route the buffered TDAC output to the REFP/TDACOUT pin. Note that the TDAC output is routed to the output of the resistor attenuator output of the selected input channel, which is the input node of the input multiplexer, as shown in the Functional Block Diagram.

Table 7-37 shows all available configurations of the TDAC multiplexer.

Table 7-37 TDAC Multiplexer Configurations

STEPx_TDAC_SEL[4:0]

(x = 0 to 31)

DESCRIPTION
00000b Mux open, TDAC not connected
00001b TDAC unbuffered to positive input; negative input is connected to AVSS
00010b TDAC unbuffered to negative input, positive input is connected to AVSS
00011b Buffered TDAC to AIN0 attenuator output
00100b Buffered TDAC to AIN1 attenuator output
00101b Buffered TDAC to AIN2 attenuator output
00110b Buffered TDAC to AIN3 attenuator output
00111b Buffered TDAC to AIN4 attenuator output
01000b Buffered TDAC to AIN5 attenuator output
01001b Buffered TDAC to AIN6 attenuator output
01010b Buffered TDAC to AIN7 attenuator output
01011b Buffered TDAC to AIN8 attenuator output
01100b Buffered TDAC to AIN9 attenuator output
01101b Buffered TDAC to AIN10 attenuator output
01110b Buffered TDAC to AIN11 attenuator output
01111b Buffered TDAC to AIN12 attenuator output
10000b Buffered TDAC to AIN13 attenuator output
10001b Buffered TDAC to AIN14 attenuator output
10010b Buffered TDAC to AIN15 attenuator output
10011b Buffered TDAC to REFP/TDACOUT pin
all other codes Mux open, TDAC not connected

Set the STEPx_TDAC_VAL[4:0] bits to select the TDAC output value. The auxiliary reference value is the same as the value selected for the ADC reference by the REF_VAL bit on the general configuration page (01b = 2.5V, and 1b = 4.096V). Table 7-38 shows the TDAC output voltages depending on the STEPx_TDAC_VAL[4:0] bits and REF_VAL values.

Table 7-38 TDAC Output Voltage

STEPx_TDAC_VAL[4:0]

(x = 0 to 31)

Value on TDAC

Value for

REF_VAL = 0b

(2.5V)

Value for

REF_VAL = 1b

(4.096V)

00000b (1 / 32) × Auxiliary Vref 0.078V 0.128V
00001b (2 / 32) × Auxiliary Vref 0.156V 0.256V
... ... ... ...
nnnnn ((nnnnn + 1) / 32) × Auxiliary Vref) ... ...
11110b (31 / 32) × Auxiliary Vref 2.422V 3.968V
11111b (32 / 32) × Auxiliary Vref 2.5V 4.096V