SBASAE3 December   2025 ADS125H18

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 SFDR Measurement
    12. 6.12 Noise Performance
    13. 6.13 TUE (Total Unadjusted Error) Measurement
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Divider and Input Multiplexer
      2. 7.3.2  Input Range
      3. 7.3.3  ADC Reference Voltage
      4. 7.3.4  Power Supplies
        1. 7.3.4.1 AVDD and AVSS
        2. 7.3.4.2 IOVDD
        3. 7.3.4.3 CAPA and CAPD
        4. 7.3.4.4 Power-On Reset (POR)
      5. 7.3.5  Clock Operation
        1. 7.3.5.1 Internal Oscillator
        2. 7.3.5.2 External Clock
      6. 7.3.6  Modulator
      7. 7.3.7  Digital Filter
        1. 7.3.7.1 Digital Filter Latency
        2. 7.3.7.2 Sinc3 and Sinc4 Filters
        3. 7.3.7.3 Sinc4 + Sinc1 Cascade Filter
        4. 7.3.7.4 50/60Hz Notch Filters
      8. 7.3.8  FIFO Buffer
        1. 7.3.8.1 FIFO Buffer Read and Write
        2. 7.3.8.2 FIFO Overflow and Underflow
        3. 7.3.8.3 FIFO Depth Indicator
        4. 7.3.8.4 FIFO Enable and Flush
        5. 7.3.8.5 FIFO Thresholds
      9. 7.3.9  Channel Auto-Sequencer
        1. 7.3.9.1 Auto-Sequencer: Basic Operation
        2. 7.3.9.2 Sequencer Modes
          1. 7.3.9.2.1 Single-Shot Mode
          2. 7.3.9.2.2 Single Step Continuous Conversion Mode
          3. 7.3.9.2.3 Single Sequence Mode
          4. 7.3.9.2.4 Continuous Sequence Mode
        3. 7.3.9.3 Configuring the Auto-Sequencer
        4. 7.3.9.4 Starting and Stopping the Sequencer
        5. 7.3.9.5 Auto-Sequencer and DRDY Behavior
      10. 7.3.10 Offset and Gain Calibration
      11. 7.3.11 Digital PGA
      12. 7.3.12 General Purpose IOs (GPIOs)
        1. 7.3.12.1 DRDY Output
        2. 7.3.12.2 FAULT Output
      13. 7.3.13 Open Wire Current Source (OWCS)
      14. 7.3.14 Open Wire Detection with ADC 0-code output
      15. 7.3.15 System Monitors
        1. 7.3.15.1 Internal Short (Offset Calibration)
        2. 7.3.15.2 Internal Temperature Sensor
        3. 7.3.15.3 External Reference Voltage Readback
        4. 7.3.15.4 Power-Supply Readback
        5. 7.3.15.5 Resistor Divider Supply Readback
      16. 7.3.16 Monitor Flags, Indicators and Counters
        1. 7.3.16.1  Reset (RESETn flag)
        2. 7.3.16.2  AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.16.3  Reference Undervoltage Monitor (REV_UVn flag)
        4. 7.3.16.4  Modulator Overrange Monitor (MOD_OVR_FAULTn flag)
        5. 7.3.16.5  Register Map CRC (REG_MAP_CRC_FAULTn flag)
        6. 7.3.16.6  Memory Map CRC (MEM_INTERNAL_FAULTn flag)
        7. 7.3.16.7  FIFO Overflow (FIFO_OFn flag) and FIFO Underflow (FIFO_UFn flag)
        8. 7.3.16.8  FIFO CRC Fault (FIFO_CRC_FAULTn flag)
        9. 7.3.16.9  GPIO Readback
        10. 7.3.16.10 SPI CRC Fault (SPI_CRC_FAULTn flag)
        11. 7.3.16.11 Register Write Fault (REG_WRITE_FAULTn flag)
        12. 7.3.16.12 DRDY Indicator (DRDY bit)
        13. 7.3.16.13 Sequencer Active Indicator (SEQ_ACTIVE bit)
        14. 7.3.16.14 Sequence Step Indicator (STEP_INDICATOR[4:0])
        15. 7.3.16.15 ADC Conversion Counter (CONV_COUNT[3:0])
        16. 7.3.16.16 FIFO Depth Indicator (FIFO_DEPTH[8:0])
        17. 7.3.16.17 Completed Sequence Counter (SEQ_COUNT[3:0])
      17. 7.3.17 Test DAC (TDAC)
      18. 7.3.18 Parallel Post Filters
        1. 7.3.18.1 Configuring the Parallel Post Filters
        2. 7.3.18.2 Frequency Response of the Parallel Post Filters
        3. 7.3.18.3 Settling Times and DRDY Behavior When Using the Post Filters
        4. 7.3.18.4 Examples of Recommended Post Filter Settings
      19. 7.3.19 Chip Select Forwarding
        1. 7.3.19.1 Configuring the CS forward feature
        2. 7.3.19.2 CS Forward Timeout
        3. 7.3.19.3 CS Forward Header, Frame, and State Diagram
        4. 7.3.19.4 Disabling the CS-FWD mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Scalable Speed Modes
      2. 7.4.2 Sequencer Functional Modes
      3. 7.4.3 Idle Mode and Standby Mode
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Reset
        1. 7.4.5.1 RESET Pin
        2. 7.4.5.2 Reset by SPI Register Write
        3. 7.4.5.3 Reset by SPI Input Pattern
      6. 7.4.6 Synchronization
      7. 7.4.7 Conversion-Start Delay Time
    5. 7.5 Programming
      1. 7.5.1  Serial Interface (SPI)
      2. 7.5.2  Serial Interface Signals
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.2.5 Data Ready (DRDY) Pin
      3. 7.5.3  Serial Interface Communication Structure
        1. 7.5.3.1 SPI Frame
        2. 7.5.3.2 STATUS Header
        3. 7.5.3.3 SPI CRC
      4. 7.5.4  Device Commands
        1. 7.5.4.1 No-Operation
        2. 7.5.4.2 Read Conversion Data
        3. 7.5.4.3 Read Register Command
        4. 7.5.4.4 Write Register Command
        5. 7.5.4.5 Read FIFO Buffer Command
      5. 7.5.5  Continuous Read Mode
        1. 7.5.5.1 Read Conversion Data in Continuous Read Mode
        2. 7.5.5.2 Read Registers in Continuous Read Mode
        3. 7.5.5.3 Read FIFO Buffer in Continuous Read Mode
      6. 7.5.6  SPI communication after POR or Reset
      7. 7.5.7  DRDY Pin Behavior
      8. 7.5.8  Daisy-Chain Operation
      9. 7.5.9  3-Wire SPI Mode
        1. 7.5.9.1 3-Wire SPI Mode Frame Re-Align
      10. 7.5.10 Conversion Data
      11. 7.5.11 Data Ready
        1. 7.5.11.1 DRDY Pin and SDO/DRDY Pin
        2. 7.5.11.2 DRDY Bit
        3. 7.5.11.3 Clock Counting
    6. 7.6 Register Map
      1. 7.6.1 ADS125H18 Status and General Configuration Page
      2. 7.6.2 ADS125H18 Step Configuration Page
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Serial Interface Connections
      2. 8.1.2 Interfacing with Multiple Devices
      3. 8.1.3 Unused Inputs and Outputs
      4. 8.1.4 Device Initialization
    2. 8.2 Typical Applications
      1. 8.2.1 2-Terminal V/I PLC Analog Input Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots - Crosstalk
      2. 8.2.2 3-Terminal V/I PLC Analog Input Module
      3. 8.2.3 2 -Terminal V/I PLC Analog Input Module With Solid State Switch
      4. 8.2.4 2-Terminal, single ended V/I PLC Analog Input Module
      5. 8.2.5 2-Terminal, I-Input PLC Analog Input Module
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supplies
      2. 8.3.2 Power-Supply Sequencing
      3. 8.3.3 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.5.8 Daisy-Chain Operation

In systems using multiple ADCs, the devices can be connected in a daisy-chain string to reduce the number of SPI connections. A daisy-chain connection links together the SPI output of one device to the SPI input of the next device so the devices in the chain appear as a single logical device to the host controller. There is no special programming required for daisy-chain operation, apply additional shift clocks to access all devices in the chain. For simplified operation, program the same SPI frame size for each device (for example, when enabling the CRC option of all devices, thus producing a 32 bit frame size).

Figure 7-71 shows four devices connected in a daisy-chain configuration. SDI of ADS125H18 (1) connects to the host SPI data output, and SDO/DRDY of ADS125H18 (4) connects to the host SPI data input. The shift operation is simultaneous for all devices in the chain. After each ADC shifts out the conversion data, the data of SDI appears on SDO/DRDY to drive the SDI of the next device in the chain. The shift operation continues until the last device in the chain is reached. The SPI frame ends when CS is taken high, at which time the data shifted into each device is interpreted. For daisy-chain operation, program the SDO/DRDY pin to data output only mode using the SDO_MODE bit.

ADS125H18 Daisy-Chain Connection Figure 7-71 Daisy-Chain Connection

Figure 7-71 shows a pull-up resistor at each data output pin. Use a 10kΩ pull-up resistor if the SDO/DRDY pin is used in dual-function mode for fast response times between SPI frames (this is especially important when using edge triggered interrupts). However, when only using the pin as an SDO, a weaker pull-up such as a 100kΩ resistor is sufficient.

Figure 7-72 shows the 24 bits frame size of each device used at initial communication after device power up.

ADS125H18 24 bit Data Input Sequence Figure 7-72 24 bit Data Input Sequence

To input data, the host first shifts in the data intended for the last device in the chain. The number of input bytes for each ADC is sized to match the output frame size. The default frame size is 24 bits, so initially each ADC requires three bytes by prefixing a pad byte in front of the two command bytes. The input data of ADC #4 is first, followed by the input data of ADC #3, and so forth.

Figure 7-73 shows the detailed input data sequence for the daisy-chain write register operation of Figure 7-71. 48 bit frames for each ADC are shown (24 bits of data, with the STATUS header and CRC byte enabled). Command operations can be different for each ADC. The read register operation requires a second frame operation to read out the register data.

ADS125H18 Write Register Data in Daisy-Chain Connection
A. Optional CRC byte. If CRC is disabled, the frame shortens by one byte.
B. Previous state of SDO/DRDY before SCLK is applied.
C. Optional STATUS header. If STATUS is disabled, the frame shortens by two bytes.
Figure 7-73 Write Register Data in Daisy-Chain Connection

Figure 7-74 shows the clock sequence to read conversion data from the device connection provided in Figure 7-71. This example illustrates a 32 bit output frame (24 bits of data, with the CRC byte enabled). The output data of ADC (4) is first in the sequence, followed by the data of ADC (3), and so on. The total number of clocks required to shift out the data is given by the number of bits per frame × the number of devices in the chain. In this example, 32 bit output frames × four devices result in 128 total clocks.

ADS125H18 Read Conversion Data in Daisy-Chain Connection
A. Optional CRC byte. If CRC is disabled, the frame shortens by one byte.
B. Previous state of SDO/DRDY before SCLK is applied.
Figure 7-74 Read Conversion Data in Daisy-Chain Connection

As shown in Equation 31, the maximum number of devices connected in daisy-chain configuration is limited by the SCLK signal frequency, data rate, and number of bits per frame.


Equation 31. Maximum devices in a chain = ⌊fSCLK / (fDATA × bits per frame)⌋

For example, if fSCLK = 20MHz, fDATA = 100 kSPS, and 32 bit frames are used, the maximum number of daisy-chain connected devices is the floor of: ⌊20MHz / (100kHz × 32)⌋ = 6.