SCPS299A May   2025  – September 2025 TXE8116-Q1 , TXE8124-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 SPI Bus Timing Requirements
    8. 5.8 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 I/O Port
      2. 7.3.2 Interrupt Output (INT)
      3. 7.3.3 Reset Input (RESET)
      4. 7.3.4 Fail-safe Mode
      5. 7.3.5 Software Reset Call
      6. 7.3.6 Burst Mode
      7. 7.3.7 Daisy Chain
      8. 7.3.8 Multi Port
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 SPI Interface
      2. 7.5.2 SPI Data Format
      3. 7.5.3 Writes
      4. 7.5.4 Reads
    6. 7.6 Register Maps
      1. 7.6.1 Control Register: Read/Write and Feature Address (B23 - B16)
      2. 7.6.2 Control Register: Port Selection and Multi Port (B15 - B8)
      3. 7.6.3 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Power Supply Recommendations
      1. 8.2.1 Power-On Reset Requirements
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) Package UNIT
 DGS (VSSOP) DGS (VSSOP) RHB (VQFN) RGE (VQFN)
32 PINS 24 PINS 32 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 80.1 86.5 44.1 43.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.4 34.5 35.6 39.9 °C/W
RθJB Junction-to-board thermal resistance 44.1 48.2 25.0 21.0 °C/W
ΨJT Junction-to-top characterization parameter 2.0 1.4 2.7 2.2 °C/W
ΨJB Junction-to-board characterization parameter 43.7 47.8 24.9 21.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 14.2 13.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.