SLVSIF4 September   2026 TPS481HS04-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Requirements
    7. 5.7 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Driving Capacitive, Resistive and Inductive Loads
      2. 7.3.2 Protection Mechanisms
        1. 7.3.2.1 Overcurrent Protection
          1. 7.3.2.1.1 Inrush Period - Overcurrent Protection
          2. 7.3.2.1.2 Overcurrent Protection - Steady State Operation
          3. 7.3.2.1.3 Programmable Fuse Protection
          4. 7.3.2.1.4 Immediate Shutdown Overcurrent Protection (IOCP)
        2. 7.3.2.2 Output Disable Function (OUT_DIS)
        3. 7.3.2.3 Thermal Shutdown
        4. 7.3.2.4 Reverse Battery
      3. 7.3.3 Diagnostic Mechanisms
        1. 7.3.3.1 Integrated ADC
        2. 7.3.3.2 Analog and Digital Current Sense Output
        3. 7.3.3.3 Output Voltage Measurement
        4. 7.3.3.4 MOSFET Temperature Measurement
        5. 7.3.3.5 VBB Voltage Measurement
        6. 7.3.3.6 VOUT Short-to-Battery and Open-Load
          1. 7.3.3.6.1 Measurement With Channel Output (FET) Enabled
          2. 7.3.3.6.2 Detection With Channel Output Disabled
        7. 7.3.3.7 VOUT Short-to-Battery or FET Short Detection For Power at All Times (PAAT) Loads
      4. 7.3.4 Fault Indication (FLT / WAKE)
      5. 7.3.5 SPI Mode Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Diagram
      2. 7.4.2 Power Down
      3. 7.4.3 SLEEP
      4. 7.4.4 Low Power Mode (LPM)
      5. 7.4.5 CONFIG or ACTIVE Mode
      6. 7.4.6 LIMPHOME Mode
    5. 7.5 TPS481HS04-Q1 Pre-production Silicon Limitations
      1. 7.5.1 SDO Pin Tristate Discrete Workaround (Only for parallel SPI configuration not for daisy chain)
  9. 8 Register Maps
    1. 8.1 TPS481HS04-Q1 Registers
    2. 8.2 EEPROM (NVM) Overview
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Mechanical Data

7.5.1 SDO Pin Tristate Discrete Workaround (Only for parallel SPI configuration not for daisy chain)

Figure 7-22 shows discrete NPN-PNP based circuit needed on SDO pin of each slave device when mutiple TPS481HS04-Q1 devices are used in parallel SPI configuration.

  • CS goes low, Q1 turns on to connect master MCU with respective slave device SDO pin
  • CS goes high, Q1 turns off disconnecting SDO pin of slave device from master MCU and SDO pins of other slave devices
TPS481HS04-Q1 SDO Tri-State Discrete Workaround Figure 7-22 SDO Tri-State Discrete Workaround