SLVSIL5A May 2025 – September 2025 UCC25661-Q1
PRODUCTION DATA
During LF burst off period, power consumed by the high-side gate driver from the HB pin from the CBOOT and causes the bootstrap capacitor voltage to decay. At the start of the next burst period establish sufficient voltage remaining on CBOOT to power the high-side gate driver (HO) until the conduction period of the low-side gate driver (LO) allows it to replenish from the CVCCP. The power consumed by the high-side driver during this burst off period directly impacts the size and cost of capacitors that connect to HB and VCCP.
Assume the system has a maximum burst off period of 150ms and the bootstrap diode has a forward voltage drop of 1V. Target a minimum bootstrap voltage of 8V to avoid UVLO fault. The maximum allowable voltage drop on the boot capacitor is:
Size the boot capacitor using Equation 88:
Choose a low leakage, low-ESR ceramic capacitor. Consider derating of ceramic capacitors with DC-bias voltage using the manufacturer data sheet while selecting the capacitors.