SLVUCI2A March   2023  – May 2025 AM68 , AM68A , AM69 , AM69A , TDA4AH-Q1 , TDA4AL-Q1 , TDA4AP-Q1 , TDA4APE-Q1 , TDA4VE-Q1 , TDA4VH-Q1 , TDA4VL-Q1 , TDA4VP-Q1 , TDA4VPE-Q1 , TPS6594-Q1

 

  1.   1
  2.   TPS6594133A-Q1 PMIC User Guide for Jacinto J784S4 or J721S2, PDN-3A, PDN-3B, PDN-3F
  3.   Trademarks
  4. 1Introduction
  5. 2Processor Connections
    1. 2.1 Power Mapping
    2. 2.2 Control Mapping
  6. 3Supporting Functional Safety Systems
    1. 3.1 Achieving ASIL-B System Requirements
    2. 3.2 Achieving up to ASIL-D System Requirements
  7. 4Static NVM Settings
    1. 4.1  Application-Based Configuration Settings
    2. 4.2  Device Identification Settings
    3. 4.3  BUCK Settings
    4. 4.4  LDO Settings
    5. 4.5  VCCA Settings
    6. 4.6  GPIO Settings
    7. 4.7  Finite State Machine (FSM) Settings
    8. 4.8  Interrupt Settings
    9. 4.9  POWERGOOD Settings
    10. 4.10 Miscellaneous Settings
    11. 4.11 Interface Settings
    12. 4.12 Multi-Device Settings
    13. 4.13 Watchdog Settings
  8. 5Pre-Configurable Finite State Machine (PFSM) Settings
    1. 5.1 Configured States
    2. 5.2 PFSM Triggers
    3. 5.3 Power Sequences
      1. 5.3.1 TO_SAFE_SEVERE and TO_SAFE
      2. 5.3.2 TO_SAFE_ORDERLY and TO_STANDBY
      3. 5.3.3 ACTIVE_TO_WARM
      4. 5.3.4 ESM_SOC_ERROR
      5. 5.3.5 PWR_SOC_ERROR
      6. 5.3.6 MCU_TO_WARM
      7. 5.3.7 TO_MCU
      8. 5.3.8 TO_ACTIVE
      9. 5.3.9 TO_RETENTION
  9. 6Application Examples
    1. 6.1 Initialization
    2. 6.2 Moving Between States; ACTIVE, MCU ONLY and RETENTION
      1. 6.2.1 ACTIVE
      2. 6.2.2 MCU ONLY
      3. 6.2.3 RETENTION
    3. 6.3 Entering and Exiting Standby
    4. 6.4 Entering and Existing LP_STANDBY
  10. 7Impact of NVM Changes
  11. 8References
  12. 9Revision History

Power Mapping

The PDN-3x base power resources are the TPS6594133A-Q1 PMIC, two High-Current Power Stages (HCPS-A & HCPS-B), two TPS389006004-Q1 Safety Voltage Supervisors, two TPS74501P-Q1 LDOs and one TPS622965-Q1 load switch. The processor CPU and CORE power rails are powered by HCPS-A and HCPS-B respectively. Each HCPS consists of one or multiple, stackable TPS6287xY1-Q1 buck converters. For recommended HCPS configurations based upon JS84S4 or J721S2 processor type, see Table 2-1. The PMIC has built-in input supply voltage level detection, which enables it to use either a 3.3V or 5V system input voltage. If a system does use a 5V input, then the load switches used to supply the processor with 3.3V for IO signaling need to be replaced with either a buck converter or LDO depending upon overall system needs.

Table 2-1 CPU and CORE Power Resources
Processor HCPS - A (CPU Power) HCPS - B (CORE Power)
J784S4 3 x TPS62873Y1 - Q1 2 x TPS62873Y1 - Q1
J721S2 1 x TPS62873Y1 - Q1 2 x TPS62871Y1 - Q1

For Functional Safety applications, the PMIC provides majority of all key requirements, see TPS6594 Data Sheet. In addition, there is a protection FET before VCCA that connects to the OVPGDRV pin of the PMIC, allowing voltage monitoring of the input supply. Two TPS389006004-Q1 Safety Voltage Supervisors (SVS) are used for OV/UV monitoring on all discrete power resource voltages as required for functional safety systems that are ASIL-B/D capable.

Figure 2-1 shows PDN-3A power map for supplying a J784S4 or J721S2 processor platform (SoC, Flaxh & LPDDR4 memories, power resources) with base features plus all optional features that includes three processor low power modes (MCU Only, GPIO Retention and DDR Retention) and three optional functions (UHS-I SD card, USB2.0 interface and HS eFuse programming). PDN - 3A.I Power Connections - Full Features, Industrial Application is the same as the PDN-3A but intended for industrial applications and uses a slightly different voltage monitoring strategy. Figure 2-3 depicts the PDN-3F power map using only the PDN-3x base power resources to support the base feature set (ASIL-D safety capable system, MCU and Main supply isolation, MCU Safety Island, MCU Only low power mode, dual voltage 1.8/3.3V IO signaling, four LPDDR4 memories, OSPI boot Flash & eMMC storage Flash).

TPS6594-Q1 PDN-3A Power Connections - Full
          Features Figure 2-1 PDN-3A Power Connections - Full Features
TPS6594-Q1 PDN - 3A.I Power Connections - Full
          Features, Industrial Application Figure 2-2 PDN - 3A.I Power Connections - Full Features, Industrial Application
TPS6594-Q1 PDN-3F Power Connections - Reduced
          Features Figure 2-3 PDN-3F Power Connections - Reduced Features

Table 2-2 identifies the required power resources and rails needed to support PDN-3A full featured system. If a feature is not desired, the power resource and rail can be removed but the processor input supply must be connected to another power rail of like voltage and type since all supplies need to be energized for full active operations. Table 2-3 gives guidance on grouping of processor input supplies into base power rails if any of the three low power modes or optional functions are not desired. Applying this guidance to the full featured PDN-3A scheme enables other PDN-3x variants (x = B/C/D/E/ F) that support end products with different feature sets in between PDN-3A and PDN-3F.

Table 2-2 PDN-3A Power Map vs. System Features
Power Mapping System Features(1)
Device Power Resource Power Rails Processor and Memory Domains Active SoC MCU Only DDR Ret GPIO Ret SD Card EFUSE USB
TPS6594133A-Q1 BUCK12 VDD_DDR_1V1 VDDS_DDR, VDDS_DDR_C3:0 R R
Mem: VDD2, VDDQ
BUCK3 VDD_RAM_0V85 VDDAR_CORE, VDDAR_CPU R
BUCK4 VDD_IO_1V8

VDDS_MMC0

R
BUCK5 VDD_MCU_0V85 VDD_MCU, VDDAR_MCU R R
LDO1 VDD_MCUIO_1V8 VDDSHV1_MCU R R
LDO2 VDD_MCUIO_3V3 VDDSHV2_MCU R R
LDO3 VDA_DLL_0V8 VDDA_0P8_PLL_DDR3:0, VDDA_0P8_DLL_MMC0 R
LDO4 VDA_MCU_1V8 VDDA_MCU_PLLGRP0, VDDAMCU_TEMP, VDDA_POR_WKUP, VDDA_WKUP, VDDA_ADC1:0 R R
TPS22965-Q1 Load Switch-A VDD_IO_3V3 VDDSHV0, VDDSHV2 R
TPS22965-Q1 Load Switch-B VDD_MCU_GPIORET_3V3 VDDSHV0_MCU R R R
CPU PWR HCPS-A HCPS-A VDD_CPU_AVS VDD_CPU R
CORE PWR HCPS-B HCPS-B VDD_CORE_0V8 VDD_CORE, VDD_WAKE0, VDDA_0p8_CSIRX, VDDA_0P8_DSITX, VDDA_0P8_DSITX_C, VDDA_0P8_SERDES, VDDA_0P8_SERDES_C, VDDA_0P8_USB, VDDA_0P8_UFS R
TLV73318P-Q1 LDO-G VPP_EFUSE_1V8 VPP_x(EFUSE) R
TLV3333-Q1 LDO-F VDD_USB_3V3 VDDA_3P3_USB R R
TLV7103318-Q1 LDO-E VDD_SD_DV VDDSHV5 (3.3V or 1.8V) R R
TPS74501P-Q1 LDO-D VDD1_DDR_1V8 Mem: VDD1 R R
TPS74501P-Q1 LDO-C VDD_MCU_GPIORET_0V8 VDD_MCU_WAKE1 R R R
TPS74501P-Q1 LDO-B VDA_PHY_1V8 VDDA_1P8_CSI_RX, VDDA_1P8_DSITX, VDDA_1P8_SERDES, VDDA_1P8_USB, VDDA_1P8_UFS R
TPS74501P-Q1 LDO-A VDA_PLL_1V8 VDDA_OSC1, VDDA_PLLGRP13:0, VDDA_TEMP4:0 R
'R' is required.
Table 2-3 Power Resource Adjustments for Feature Removal
Feature Removal Power Resource and Power Rail Removal New Supply Mappings
HS SoC EFUSE Programming Discrete LDO-G: VPP_EFUSE_1V8 SoC: VPPs → No Connect
Compliant, USB 2.0 Data Eye Discrete LDO-F: VDA_USB_3V3 SoC: VDDA_3P3_USB → Filtered VDD_IO_3V3
Compliant, High-Speed SD Card Discrete LDO-E: VDD_SD_DV SoC: VDDSHV5 → VDD_IO_3V3 or VDD_IO_1V8
DDR Retention Low Power Mode Discrete LDO-D: VDD1_DDR_1V8 LPDDR4: VDD1 → VDD_IO_1V8
MCU GPIO Retention Low Power Mode Discrete LDO-C: VDD_MCU_GPIORET_0V8 SoC: VDD_MCU_WAKE1 → VDD_MCU_0V85
Discrete LDSW-B: VDD_MCU_GPIORET_3V3 SoC: VDDSHV0_MCU → VDD_MCUIO_3V3 or VDD_MCUIO_1V8
Discrete SVS PMIC: GPIO10 pulled up to VCCA_3V3