TIDUF82B August   2024  – May 2025 DRV8162 , INA241A , ISOM8710

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Reference Design Overview
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Hardware Design
        1. 2.2.1.1 Power Stage Gate Driver
          1. 2.2.1.1.1 Gate Driver
          2. 2.2.1.1.2 Protection Features
          3. 2.2.1.1.3 VGVDD Definition
          4. 2.2.1.1.4 Strap Functions
        2. 2.2.1.2 Power Stage FETs
          1. 2.2.1.2.1 VGS versus RDS(ON)
        3. 2.2.1.3 Phase Current and Voltage Sensing
          1. 2.2.1.3.1 Phase A and Phase B Current Sensing
          2. 2.2.1.3.2 Phase C Current Sensing
          3. 2.2.1.3.3 Voltage Sensing
        4. 2.2.1.4 Host Processor Interface
        5. 2.2.1.5 Gate Drive Shutdown Path
        6. 2.2.1.6 System Diagnostic Measurements
          1. 2.2.1.6.1 Temperature Measurement
        7. 2.2.1.7 System Power Supply
          1. 2.2.1.7.1 12V Rail
          2. 2.2.1.7.2 3.3V Rail
      2. 2.2.2 Software Design
    3. 2.3 Highlighted Products
      1. 2.3.1 DRV8162L
      2. 2.3.2 INA241A
      3. 2.3.3 AMC0106M05
      4. 2.3.4 TPSM861253
      5. 2.3.5 LMR38010
      6. 2.3.6 TMP6131
      7. 2.3.7 ISOM8710
  9. 3Hardware, Software Test Requirements and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 PCB Overview
      2. 3.1.2 Hardware Configuration
        1. 3.1.2.1 Prerequisites
        2. 3.1.2.2 Default Resistor and Jumper Configuration
        3. 3.1.2.3 Connector
          1. 3.1.2.3.1 Host Processor Interface
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Power Management
        1. 3.3.1.1 Power Up
        2. 3.3.1.2 Power Down
      2. 3.3.2 Gate Voltage and Phase Voltage
        1. 3.3.2.1 20 VDC
        2. 3.3.2.2 48 VDC
        3. 3.3.2.3 60 VDC
      3. 3.3.3 Digital PWM and Gate Voltage
      4. 3.3.4 Phase-Current Measurements
      5. 3.3.5 System Test Results
        1. 3.3.5.1 Thermal Analysis
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Authors
  12. 6Revision History

1.2 Key System Specifications

Table 1-1 TIDA-010956 Specifications
PARAMETERVALUE (TYPICAL)COMMENT
DC input voltage24V to 60VAbsolute maximum 80V DC.
Output phase current85ARMSContinuous current. A heat sink is possibly needed and airflow for the FETs is important.
In-phase current sense range±165A (Phase A and B)Phase A and B scaled to 0V to 3.3V range, inverted, with a 1.65V bias
±167A (Phase C) Phase C scaled to ±50mV range
In-phase current sense shunt0.2mΩ (Phase A and B)Phase A and B use two pieces of differential, non-isolated amplifier INA241A3, with enhanced pulse-width modulation (PWM) rejection
0.3mΩ (Phase C) Phase C uses a functional isolated delta-sigma modulator AMC0106M05
PWM switching frequency16kHzUp to 40kHz
PWM dead timeUser definedDefault 370ns with the hardware RDT setting
Temperature range–40°C to 85°CPossibly need a proper heat sink and airflow for thermal dissipation of the FETs
ProtectionsShort-circuit protectionWith the default RVDSLVL setting. See also Table 2-1
Shoot-through protectionAutomatic dead-time insertion handshake
Temperature protectionTemperature sensor mounted on PCB to indicate overtemperature
UVLOIntegrated at 4.8V
PCB temperature sense range and accuracy–40°C to 150°CUsing a TMP6131, ±1%, 10kΩ linear thermistor
Controller interface signals3.3V I/O for PWM, I-V sensing, PWM buffer and gate driver enables, faultTI BoosterPack™ Plug-in Module compatible; supporting 3.3V signal levels. See pin assignments in Section 3.1.2.
Indicator LEDsPower rails and user-defined3.3V, 12V, VIN input and one for user software control.
PCB layer stackEight-layer, 70μm copper2oz copper
Form Factor80mm × 98mm3150mil × 3860mil