Packaging information
| Package | Pins VQFN (RHL) | 20 |
| Operating temperature range (°C) -55 to 125 |
| Package qty | Carrier 3,000 | LARGE T&R |
Features for the TPS75003-EP
- Two 95% Efficient, 3-A Buck Controllers and One 300-mA LDO
- Tested and Endorsed by Xilinx for Powering the Spartan-3, Spartan-3E, and Spartan-3L FPGAs
- Adjustable (1.2 V to 6.5 V for Bucks, 1 V to 6.5 V for LDO) Output Voltages on All Channels
- Input Voltage Range: 2.2 V to 6.5 V
- Independent Soft-Start for Each Supply
- Independent Enable for Each Supply for Flexible Sequencing
- LDO Stable with 2.2-µF Ceramic Output Capicitor
- Small, Low-Profile 4,5 mm × 3,5 mm × 0,9 mm QFN Package
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- APPLICATIONS
- FPGA/DSP/ASIC Supplies
- Set-Top Boxes
- DSL Modems
- Plasma TV Display Panels
(1) Additional temperature ranges available - contact factory
Spartan is a trademark of Xilinx, Inc.
Description for the TPS75003-EP
The TPS75003 is a complete power management solution for FPGA, DSP and other multi-supply applications. The device has been tested with and meets all of the Xilinx Spartan-3, Spartan-3E, and Spartan-3L start-up profile requirements, including monotonic voltage ramp and minimum voltage rail rise time. Independent Enables for each output allow sequencing to minimize demand on the power supply at start-up. Soft-start on each supply limits inrush current during start-up. Two integrated buck controllers allow efficient, cost-effective voltage conversion for both low and high current supplies such as core and I/O. A 300-mA LDO is integrated to provide an auxiliary rail such as VCCAUX on the Xilinx Spartan-3 FPGA. All three supply voltages are offered in user-programmable options for maximum flexibility.
The TPS75003 is fully specified from –55°C to +125°C and is offered in a QFN package, yielding a highly compact total solution size with high power dissipation capability.