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TDA4VH-Q1

AKTIV

SoC für die Automobilindustrie zur Sensorfusion, L2-, L3-Domänen-Controller mit Grafik, KI und Video

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TDA4VH-Q1

AKTIV
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Produktdetails

Arm CPU 8 Arm Cortex-A72 Arm (max) (MHz) 2000 Coprocessors MCU Island of 2 Arm Cortex-R5F (lockstep opt), SoC main of 6 Arm Corex-R5F (lockstep opt) CPU 64-bit Graphics acceleration 1 3D Display type 1 EDP, 2 DSI, MIPI DPI Ethernet MAC 8-Port 1Gb switch PCIe 2 PCIe Gen 3 Hardware accelerators 1 depth and motion accelerator, 2 video encode/decode accelerator, 2 vision pre-processing accelerators, 4 deep learning accelerators Operating system Linux, QNX, RTOS Security Cryptography, Debug security, Device identity, Isolation firewalls, Secure boot, Secure storage & programming, Software IP protection, Trusted execution environment Rating Automotive Power supply solution TPS6594-Q1 Operating temperature range (°C) -40 to 125
Arm CPU 8 Arm Cortex-A72 Arm (max) (MHz) 2000 Coprocessors MCU Island of 2 Arm Cortex-R5F (lockstep opt), SoC main of 6 Arm Corex-R5F (lockstep opt) CPU 64-bit Graphics acceleration 1 3D Display type 1 EDP, 2 DSI, MIPI DPI Ethernet MAC 8-Port 1Gb switch PCIe 2 PCIe Gen 3 Hardware accelerators 1 depth and motion accelerator, 2 video encode/decode accelerator, 2 vision pre-processing accelerators, 4 deep learning accelerators Operating system Linux, QNX, RTOS Security Cryptography, Debug security, Device identity, Isolation firewalls, Secure boot, Secure storage & programming, Software IP protection, Trusted execution environment Rating Automotive Power supply solution TPS6594-Q1 Operating temperature range (°C) -40 to 125
FCBGA (ALY) 1414 961 mm² 31 x 31

Processor cores:

  • Up to Four C7x floating point, vector DSP, up to 1.0 GHz, 320 GFLOPS, 1024 GOPS
  • Up to Four Deep-learning matrix multiply accelerator (MMAv2), up to 32 TOPS (8b) at 1.0 GHz
  • Two Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Eight Arm Cortex-A72 microprocessor subsystem at up to 2.0 GHz
    • 2MB shared L2 cache per quad-core Cortex-A72 cluster
    • 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 core
  • Eight Arm Cortex-R5F MCUs at up to 1.0 GHz
    • 16K I-Cache, 16K D-Cache, 64K L2 TCM
    • Two Arm Cortex-R5F MCUs in isolated MCU subsystem
    • Six Arm Cortex-R5F MCUs in general compute partition
  • GPU IMG BXS-4-64, 256kB Cache, up to 800 MHz, 50 GFLOPS, 4 GTexels/s
  • Custom-designed interconnect fabric supporting near max processing entitlement

    Memory subsystem:

  • Up to 8MB of on-chip L3 RAM with ECC and coherency
    • ECC error protection
    • Shared coherent cache
    • Supports internal DMA engine
  • Up to Four External Memory Interface (EMIF) module with ECC
    • Supports LPDDR4 memory types
    • Supports speeds up to 4266 MT/s
    • Up to 4x32-b bus with inline ECC up to 68 GB/s
  • General-Purpose Memory Controller (GPMC)
  • 3x512KB on-chip SRAM in MAIN domain, protected by ECC

    Functional Safety:

  • Functional Safety-Compliant targeted (on select part numbers)
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 functional safety system design up to ASIL-D/SIL-3 targeted
    • Systematic capability up to ASIL-D/SIL-3 targeted
    • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
    • Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
    • Hardware integrity up to ASIL-D/SIL-3 targeted for Extended MCU (EMCU) portion of the Main Domain
    • Safety-related certification
      • ISO 26262 planned
  • AEC-Q100 qualilfied on part number variants ending in Q1

    Device security (on select part numbers):

  • Secure boot with secure runtime support
  • Customer programmable root key, up to RSA-4K or ECC-512
  • Embedded hardware security module
  • Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

    High speed serial interfaces:

  • Integrated ethernet switch supporting up to 8 (TDA4xH) or 4 (TDA4xP) external ports
    • Two ports support 5Gb, 10Gb USXGMII/XFI
    • All ports support 1Gb, 2.5Gb SGMII
    • All ports can support QSGMII. A maximum of 2 (TDA4xH) or 1 (TDA4xP) QSGMII can be enabled and uses all 8 or 4 internal lanes
  • Up to 4x2-L/2x4L (TDA4xH) or 2x2L/1x4L (TDA4xP) PCI-Express (PCIe) Gen3 controllers
    • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
  • One USB 3.0 dual-role device (DRD) subsystem
    • Enhanced SuperSpeed Gen1 Port
    • Supports Type-C switching
    • Independently configurable as USB host, USB peripheral, or USB DRD
  • Three CSI2.0 4L RX plus Two CSI2.0 4L TX

    Ethernet:

  • Two RGMII/RMII interfaces

    Automotive interfaces:

  • Twenty Modular Controller Area Network (MCAN) modules with full CAN-FD support

    Display subsystem:

  • Two DSI 4L TX (up to 2.5k)
  • One eDP/DP interface with Multi-Display Support (MST)
  • One DPI

    Audio interfaces:

  • Five Multichannel Audio Serial Port (MCASP) modules

    Video acceleration:

  • H.264/H.265 Encode/Decode, up to 960MP/s (TDA4xH) or 480MP/s (TDA4xP)

    Flash memory interfaces:

  • Embedded MultiMediaCard Interface ( eMMC™ 5.1)
  • One Secure Digital 3.0 / Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0
  • Universal Flash Storage (UFS 2.1) interface with two lanes
  • Two independent flash interfaces configured as
    • One OSPI or HyperBus™ or QSPI flash interfaces, and
    • One QSPI flash interface

    System-on-Chip (SoC) architecture:

  • 16-nm FinFET technology
  • 31 mm × 31 mm, 0.8-mm pitch, 1414-pin FCBGA (ALY), enables IPC class 3 PCB routing

    TPS6594-Q1 Companion Power Management ICs (PMIC):

  • Functional Safety support up to ASIL-D
  • Flexible mapping to support different use cases

Processor cores:

  • Up to Four C7x floating point, vector DSP, up to 1.0 GHz, 320 GFLOPS, 1024 GOPS
  • Up to Four Deep-learning matrix multiply accelerator (MMAv2), up to 32 TOPS (8b) at 1.0 GHz
  • Two Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Eight Arm Cortex-A72 microprocessor subsystem at up to 2.0 GHz
    • 2MB shared L2 cache per quad-core Cortex-A72 cluster
    • 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 core
  • Eight Arm Cortex-R5F MCUs at up to 1.0 GHz
    • 16K I-Cache, 16K D-Cache, 64K L2 TCM
    • Two Arm Cortex-R5F MCUs in isolated MCU subsystem
    • Six Arm Cortex-R5F MCUs in general compute partition
  • GPU IMG BXS-4-64, 256kB Cache, up to 800 MHz, 50 GFLOPS, 4 GTexels/s
  • Custom-designed interconnect fabric supporting near max processing entitlement

    Memory subsystem:

  • Up to 8MB of on-chip L3 RAM with ECC and coherency
    • ECC error protection
    • Shared coherent cache
    • Supports internal DMA engine
  • Up to Four External Memory Interface (EMIF) module with ECC
    • Supports LPDDR4 memory types
    • Supports speeds up to 4266 MT/s
    • Up to 4x32-b bus with inline ECC up to 68 GB/s
  • General-Purpose Memory Controller (GPMC)
  • 3x512KB on-chip SRAM in MAIN domain, protected by ECC

    Functional Safety:

  • Functional Safety-Compliant targeted (on select part numbers)
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 functional safety system design up to ASIL-D/SIL-3 targeted
    • Systematic capability up to ASIL-D/SIL-3 targeted
    • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
    • Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
    • Hardware integrity up to ASIL-D/SIL-3 targeted for Extended MCU (EMCU) portion of the Main Domain
    • Safety-related certification
      • ISO 26262 planned
  • AEC-Q100 qualilfied on part number variants ending in Q1

    Device security (on select part numbers):

  • Secure boot with secure runtime support
  • Customer programmable root key, up to RSA-4K or ECC-512
  • Embedded hardware security module
  • Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

    High speed serial interfaces:

  • Integrated ethernet switch supporting up to 8 (TDA4xH) or 4 (TDA4xP) external ports
    • Two ports support 5Gb, 10Gb USXGMII/XFI
    • All ports support 1Gb, 2.5Gb SGMII
    • All ports can support QSGMII. A maximum of 2 (TDA4xH) or 1 (TDA4xP) QSGMII can be enabled and uses all 8 or 4 internal lanes
  • Up to 4x2-L/2x4L (TDA4xH) or 2x2L/1x4L (TDA4xP) PCI-Express (PCIe) Gen3 controllers
    • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
  • One USB 3.0 dual-role device (DRD) subsystem
    • Enhanced SuperSpeed Gen1 Port
    • Supports Type-C switching
    • Independently configurable as USB host, USB peripheral, or USB DRD
  • Three CSI2.0 4L RX plus Two CSI2.0 4L TX

    Ethernet:

  • Two RGMII/RMII interfaces

    Automotive interfaces:

  • Twenty Modular Controller Area Network (MCAN) modules with full CAN-FD support

    Display subsystem:

  • Two DSI 4L TX (up to 2.5k)
  • One eDP/DP interface with Multi-Display Support (MST)
  • One DPI

    Audio interfaces:

  • Five Multichannel Audio Serial Port (MCASP) modules

    Video acceleration:

  • H.264/H.265 Encode/Decode, up to 960MP/s (TDA4xH) or 480MP/s (TDA4xP)

    Flash memory interfaces:

  • Embedded MultiMediaCard Interface ( eMMC™ 5.1)
  • One Secure Digital 3.0 / Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0
  • Universal Flash Storage (UFS 2.1) interface with two lanes
  • Two independent flash interfaces configured as
    • One OSPI or HyperBus™ or QSPI flash interfaces, and
    • One QSPI flash interface

    System-on-Chip (SoC) architecture:

  • 16-nm FinFET technology
  • 31 mm × 31 mm, 0.8-mm pitch, 1414-pin FCBGA (ALY), enables IPC class 3 PCB routing

    TPS6594-Q1 Companion Power Management ICs (PMIC):

  • Functional Safety support up to ASIL-D
  • Flexible mapping to support different use cases

The TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal and image processing in an functional safety compliant targeted architecture make the TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 devices a great fit for several imaging, vision, radar, sensor fusion and AI applications such as: Robotics, Mobile machineries, Off-highway vehicle controller, Machine Vision, AI BOX, Gateways, Retail automation, Medical Imaging, and so on. The TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 provides high performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in centralized ECUs or stand-alone sensors. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by automotive grade safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. A single instance of the new “MMAv2” deep learning accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide vision pre-processing plus distance and motion processing with no impact on system performance.

General Compute Cores and Integration Overview

Separate eight core cluster configuration of Arm Cortex-A72 facilitates multi-OS applications with minimal need for a software hypervisor. Eight Arm® Cortex®-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm® Cortex®-A72’s unencumbered for applications. The integrated IMG BXS-4-64 GPU offers up to 50 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 family also includes an MCU island eliminating the need for an external system microcontroller.

The TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal and image processing in an functional safety compliant targeted architecture make the TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 devices a great fit for several imaging, vision, radar, sensor fusion and AI applications such as: Robotics, Mobile machineries, Off-highway vehicle controller, Machine Vision, AI BOX, Gateways, Retail automation, Medical Imaging, and so on. The TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 provides high performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in centralized ECUs or stand-alone sensors. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by automotive grade safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. A single instance of the new “MMAv2” deep learning accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide vision pre-processing plus distance and motion processing with no impact on system performance.

General Compute Cores and Integration Overview

Separate eight core cluster configuration of Arm Cortex-A72 facilitates multi-OS applications with minimal need for a software hypervisor. Eight Arm® Cortex®-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm® Cortex®-A72’s unencumbered for applications. The integrated IMG BXS-4-64 GPU offers up to 50 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the TDA4VH-Q1 TDA4AH-Q1 TDA4VP-Q1 TDA4AP-Q1 family also includes an MCU island eliminating the need for an external system microcontroller.
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Technische Dokumentation

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Typ Titel Datum
* Data sheet TDA4VH-Q1, TDA4AH-Q1, TDA4VP-Q1, TDA4AP-Q1 Jacinto™ Processors datasheet (Rev. B) PDF | HTML 15 Dez 2023
* Errata J784S4, TDA4AP, TDA4VP, TDA4AH, TDA4VH, AM69A Processors Silicon Revision 1.0 (Rev. B) PDF | HTML 24 Jul 2024
Application note Jacinto 7 LPDDR4 Board Design and Layout Guidelines (Rev. F) PDF | HTML 05 Aug 2024
User guide J784S4/TDA4AP/TDA4VP/TDA4AH/TDA4VH/AM69A Processors Technical Reference Manual (Rev. D) 24 Jul 2024
Application note Debugging GPU Driver Issues on TDA4x and AM6x Devices PDF | HTML 20 Jun 2024
Application note Jacinto7 AM6x, TDA4x, and DRA8x High-Speed Interface Design Guidelines (Rev. A) PDF | HTML 04 Jun 2024
Application note Jacinto7 AM6x/TDA4x/DRA8x Schematic Checklist (Rev. B) PDF | HTML 04 Apr 2024
Technical article How highly integrated embedded processors are advancing industrial robotics PDF | HTML 18 Mär 2024
User guide SK-AM69 Processor Start Kit User's Guide (Rev. A) PDF | HTML 18 Mär 2024
Technical article Building multicamera vision perception systems for ADAS domain controllers with integrated processors PDF | HTML 05 Jan 2024
Technical article How to deliver current beyond 100 A to an ADAS processor PDF | HTML 04 Jan 2024
Functional safety information J721E, J721S2, J7200, J784S4 MCAL TUV Certification 22 Dez 2023
User guide J784S4, TDA4VH, TDA4AH, TDA4VP, TDA4AP, AM69 Power Estimation Tool User’s Guide PDF | HTML 07 Dez 2023
Application note Jacinto7 HS Device Customer Return Process PDF | HTML 16 Nov 2023
Functional safety information TÜV SÜD Certificate for Functional Safety Software Development Process (Rev. C) 11 Sep 2023
Functional safety information J721E, J721S2, J7200, J784S4 SDL TUV Certification 06 Sep 2023
White paper Advanced AI Vision Processing Using AM69A for Smart Camera Applications PDF | HTML 05 Jun 2023
White paper Designing an Efficient Edge AI System with Highly Integrated Processors (Rev. A) PDF | HTML 13 Mär 2023
User guide Powering Jacinto 7 SoC For Isolated Power Groups With TPS6594133A-Q1 + Dual HCPS PDF | HTML 01 Mär 2023
Application note UART Log Debug System on Jacinto 7 SoC PDF | HTML 09 Jan 2023
User guide Jacinto Processors TDA4AP/TDA4VP/TDA4AH/TDA4VH EVM Users Guide PDF | HTML 02 Dez 2022
Functional safety information Jacinto™ 7 Safety Product Overview PDF | HTML 15 Aug 2022
Application note Dual-TDA4x System Solution PDF | HTML 29 Apr 2022
Application note SPI Enablement & Validation on TDA4 Family PDF | HTML 05 Apr 2022
Technical article How are sensors and processors creating more intelligent and autonomous robots? PDF | HTML 29 Mär 2022
Technical article How to simplify your embedded edge AI application development PDF | HTML 28 Jan 2022
Application note Jacinto7 HS Device Development PDF | HTML 13 Jan 2022
Application note Enabling MAC2MAC Feature on Jacinto7 Soc 10 Jan 2022
Application note Jacinto7 HS Device Flashing Solution PDF | HTML 09 Dez 2021
Functional safety information Leverage Jacinto 7 Processors Functional Safety Features for Automotive Designs (Rev. A) PDF | HTML 13 Okt 2021
Application note TDA4 Flashing Techniques PDF | HTML 08 Jul 2021
White paper Differenzierungsmöglichkeit durch MCU-Integration Prozessoren der Reihe Jacinto™ 22 Okt 2020
Application note OSPI Tuning Procedure PDF | HTML 08 Jul 2020

Design und Entwicklung

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Evaluierungsplatine

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Das J721EXENETXPANEVM erweitert den Funktionsumfang eines Evaluierungsmoduls (EVM) um eine vierfache Ethernet-Erweiterungskarte zur Evaluierung von Jacinto™ 7 System-on-a-Chip (SoCs) in Netzwerkanwendungen für die Automobilindustrie und Industriemärkte. Das Ethernet-EVM mit vier Ports ist (...)

Benutzerhandbuch: PDF | HTML
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Evaluierungsplatine

J784S4XEVM — Evaluierungsmodul TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 und TDA4VH-Q1 für SoC-Fernfeldanalysesysteme

Das J784S4-Evaluierungsmodul (EVM) ist eine Plattform zur Evaluierung der Prozessoren TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 und TDA4VH-Q1 für Sichtanalytik- und Netzwerkanwendungen in Automobil- und Industrieanwendungen. Diese Prozessoren eignen sich besonders gut für Anwendungen zur Domänensteuerung mit (...)

Benutzerhandbuch: PDF | HTML
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Debug-Tastkopf

TMDSEMU110-U — XDS110 JTAG-Debug-Tastkopf

Der XDS110 von Texas Instruments ist eine neue Klasse von Debug-Tastkopf (Emulator) für Embedded-Prozessoren von TI. Der XDS110 ersetzt die XDS100-Familie und unterstützt eine größere Anzahl von Standards (IEEE1149.1, IEEE1149.7, SWD) in einem einzigen Pod. Alle XDS-Debug-Tastköpfe unterstützen (...)

Benutzerhandbuch: PDF
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Debug-Tastkopf

TMDSEMU560V2STM-U — XDS560v2 System-Trace-USB-Debug-Tastkopf

Der XDS560v2 ist die leistungsstärkste Debug-Sonde aus der XDS560™ Familie von Debug-Sonden und unterstützt sowohl den traditionellen JTAG-Standard (IEEE1149.1) als auch cJTAG (IEEE1149.7).  Bitte beachten: Diese Lösung unterstützt kein Serial Wire Debug (SWD).

Alle XDS-Debug-Tastköpfe unterstützen (...)

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Software-Entwicklungskit (SDK)

PROCESSOR-SDK-LINUX-J784S4 — Linux® SDK for TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1

The J784S4 processor software development kit (SDK) real-time operating system (RTOS) can be used together with either processor SDK Linux® or processor SDK QNX® to form a multiprocessor software development platform for TTDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1 system-on-a-chip (SoCs) (...)

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Hardware-Entwicklung
Evaluierungsplatine
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Software-Entwicklungskit (SDK)

PROCESSOR-SDK-QNX-J784S4 — QNX SDK for TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1

The J784S4 processor software development kit (SDK) real-time operating system (RTOS) can be used together with either processor SDK Linux® or processor SDK QNX® to form a multiprocessor software development platform for TTDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1 system-on-a-chip (SoCs) (...)

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Hardware-Entwicklung
Evaluierungsplatine
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Software-Entwicklungskit (SDK)

PROCESSOR-SDK-RTOS-J784S4 — RTOS SDK for TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1

The J784S4 processor software development kit (SDK) real-time operating system (RTOS) can be used together with either processor SDK Linux® or processor SDK QNX® to form a multiprocessor software development platform for TTDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1 system-on-a-chip (SoCs) (...)

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Produkte
ARM-basierte Prozessoren
TDA4AH-Q1 — SoC für die Automobilanalyse zur Sensorfusion, L2-, L3-Domänen-Controller mit AI und Video-Encoder TDA4VH-Q1 — SoC für die Automobilindustrie zur Sensorfusion, L2-, L3-Domänen-Controller mit Grafik, KI und Video TDA4AP-Q1 — Automobil-Analytik-SoC für L2, L3-Domänen-Controller mit Arm® Cortex®-A72, AI und Video-Encoder TDA4VP-Q1 — Automobil-SoC für L2, L3 Domänencontroller mit Arm® Cortex®-A72, Grafik, KI, Video-Coprozessor
Hardware-Entwicklung
Evaluierungsplatine
J784S4XEVM — Evaluierungsmodul TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 und TDA4VH-Q1 für SoC-Fernfeldanalysesysteme
Download-Optionen
Anwendungssoftware und Frameworks

SV-3P-MULTIVISION — MultiVision – STRADVISION Software für die Fahrzeugwahrnehmung

MultiVision verwendet eine Kombination aus Front-, Rückfahr-, Seiten- und Rundumsicht- (Fischaugen)-Kameras, um eine umfassende Objekterkennung rund um das Fahrzeug sowohl auf öffentlichen Straßen als auch auf Parkplätzen zu ermöglichen. MultiVision unterstützt ADAS- und autonomes Fahren mit L2+ (...)
Von: Stradvision
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Anwendungssoftware und Frameworks

SV-3P-SURROUNDVISION — SurroundVision – STRADVISION Software für die Fahrzeugwahrnehmung

SurroundVision erkennt eine Vielzahl von Objekten in der Umgebung des Fahrzeugs, einschließlich Fahrzeugen, Fußgängern, Parklücken und Bordsteinen, aus den Bildern der Surround-View-Kamera als Eingabe. Mit seinen hochpräzisen Wahrnehmungsfähigkeiten ermöglicht es den Anwendern, (...)
Von: Stradvision
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IDE, Konfiguration, Compiler oder Debugger

C7000-CGT — C7000 Codegenerierungstools – Compiler

Die Compiler-Tools für TI C7000 C/C++ unterstützen die Entwicklung von Anwendungen für die digitalen Signalprozessorkerne TI C7000.

Code Composer Studio ist die integrierte Entwicklungsumgebung (IDE) für eingebettete TI-Bausteine.  Wenn Sie auf einem eingebetteten TI-Baustein entwickeln (...)
Benutzerhandbuch: PDF | HTML
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IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Diese Designressource unterstützt die meisten Produkte in diesen Kategorien.

Informationen zum Support sind der Seite mit den Produktdetails zu entnehmen.
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IDE, Konfiguration, Compiler oder Debugger

DDR-CONFIG-J784S4 — DDR Configuration Tool

This SysConfig based tool simplifies the process of configuring the DDR Subsystem Controller and PHY to interface to SDRAM devices. Based on the memory device, board design, and topology the tool outputs files to initialize and train the selected memory.
Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
ARM-basierte Prozessoren
TDA4AP-Q1 — Automobil-Analytik-SoC für L2, L3-Domänen-Controller mit Arm® Cortex®-A72, AI und Video-Encoder TDA4VP-Q1 — Automobil-SoC für L2, L3 Domänencontroller mit Arm® Cortex®-A72, Grafik, KI, Video-Coprozessor TDA4AH-Q1 — SoC für die Automobilanalyse zur Sensorfusion, L2-, L3-Domänen-Controller mit AI und Video-Encoder TDA4VH-Q1 — SoC für die Automobilindustrie zur Sensorfusion, L2-, L3-Domänen-Controller mit Grafik, KI und Video AM69 — Universelle Arm Cortex-A72, 8 Kerne, 64 Bit, mit Grafik, PCIe Gen 3, Ethernet, USB 3.0 AM69A — Autonome mobile Roboter, 32 TOPS Vision SoC für 1-12 Kameras, maschinelles Sehen, mobiler DVR, AI
Hardware-Entwicklung
Evaluierungsplatine
SK-AM69 — AM69- und AM69A-Starterkit für Vision AI und Allzweckprozessoren
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IDE, Konfiguration, Compiler oder Debugger

SAFETI_CQKIT — Safety-Compiler-Qualifizierungskit

Das Sicherheits-Compiler-Qualifizierungs-Kit möchte Kunden dabei unterstützen, den Einsatz des ARM C/C++-Compilers C6000, C7000 oder C2000/CLA von TI für funktionale Sicherheitsstandards wie beispielsweise IEC 61508 und ISO 26262 zu qualifizieren.

Das Sicherheits-Compiler-Qualifizierungs-Kit

  • ost (...)
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IDE, Konfiguration, Compiler oder Debugger

SYSCONFIG — System-Berechnungstool

Sysconfig ist ein Konfigurationstool, das die Hardware- und Softwarekonfiguration vereinfacht und die Softwareentwicklung beschleunigt.

Sysconfig ist als Teil von Code Composer Studio&Trade, einer integrierten Entwicklungsumgebung sowie einer eigenständigen Anwendung verfügbar. Darüber hinaus kann (...)

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Betriebssystem (BS)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

Das QNX Neutrino® Realtime Operating System (RTOS) ist ein voll ausgestattetes und robustes RTOS, das die nächste Generation von Produkten für eingebettete Systeme in den Bereichen Automobilindustrie, Medizintechnik, Transport, Militär und Industrie ermöglicht. Das Mikrokernel-Design und die (...)
Von: QNX Software Systems
Partner-Website besuchen
Support-Software

EXLFR-3P-ESYNC-OTA — Excelfore esync OTA Over-the-Air Updates für softwaredefinierte Fahrzeuge

Experience the future of the connected SDV starting with full vehicle OTA from Excelfore. The standardized and structured eSync pipeline securely scales to reach all the ECUs and smart sensors in the car, with the flexibility to cover any in-vehicle network topology or system architecture.
eSync (...)
Von: ExcelFore
Partner-Website besuchen
Support-Software

EXLFR-3P-TSN — Time Sensitive Network (TSN) von ExelFore für sicherheitskritische Kommunikation in der Automobil

Softwaredefinierte Fahrzeuge (Software Defined Vehicles, SDV) benötigen Hochleistungsnetzwerke, IP-Adressierung und Sicherheit, die mit Ethernet, aber nicht mit CAN verfügbar sind. Anwendungen in der Automobilindustrie erfordern außerdem garantierte Latenzen, Bandbreite und Redundanz für (...)
Von: ExcelFore
Partner-Website besuchen
Support-Software

PAI-3P-PHANTOMVISION — Phantom-KI-Bildverarbeitungssoftware auf Jacinto-Prozessoren für ADAS-Automobilanwendungen

PhantomVision™ is a scalable, flexible and reliable deep learning based computer vision solution that provides a comprehensive suite of Euro NCAP compliant ADAS features. It is a visual perception engine that enables a single or multiple cameras to autonomously recognize road objects and (...)
Von: Phantom AI
Partner-Website besuchen
Simulationsmodell

AM69 TDA4VH TDA4AH TDA4VP TDA4AP Thermal Model (Rev. A)

SPRM843A.ZIP (0 KB) - Thermal Model
Herunterladen
Simulationsmodell

AM69A,TDA4VH-Q1,TDA4AH-Q1,TDA4VP-Q1,TDA4AP-Q1 BSDL MODEL

SPRM840.ZIP (18 KB) - BSDL Model
Herunterladen
Simulationsmodell

IBIS Model for AM69 TDA4VH TDA4AH TDA4VP TDA4AP

SPRM836.ZIP (1497 KB) - IBIS Model
Herunterladen
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCBGA (ALY) 1414 Ultra Librarian
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