DS25MB100
- 2:1 Multiplexer and 1:2 Buffer
- 0.25-Gbps to 2.5-Gbps Fully Differential Data Paths
- Fixed Input Equalization
- Programmable Output Pre-Emphasis
- Independent Pre-Emphasis Controls
- Programmable Loopback Modes
- On-Chip Terminations
- ESD Rating of 6-kV HBM
- 3.3-V Supply
- Low power, 0.45 W Typical
- Lead-Less WQFN-36 Package
- –40°C to +85°C Operating Temperature Range
The DS25MB100 device is a signal conditioning 2:1 multiplexer and 1:2 fan-out buffer designed for use in backplane-redundancy or cable driving applications. Signal conditioning features include continuous time linear equalization (CTLE) and programmable output pre-emphasis that enable data communication in FR4 backplane up to 2.5 Gbps. Each input stage has a fixed equalizer to reduce ISI distortion from board traces.
All output drivers have four selectable levels of pre-emphasis to compensate for transmission losses from long FR4 backplane or cable attenuation reducing deterministic jitter. The pre-emphasis levels can be independently controlled for the line-side and switch-side drivers. The internal loopback paths from switch-side input to switch-side output enable at-speed system testing. All receiver inputs are internally terminated with 100-Ω differential terminating resistors. All driver outputs are internally terminated with 50-Ω terminating resistors to VCC.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS25MB100 2.5 Gbps 2:1/1:2 CML Mux/Buffer With Transmit Pre-Emphasis and Receive Equalization datasheet (Rev. H) | PDF | HTML | 2016年 3月 31日 |
Application note | AN-1821 CPRI Repeater System (Rev. A) | 2013年 4月 26日 | ||
EVM User's guide | DS25MB100-EVK Signal Conditioning Mux-Buffer Demo Board User Guide | 2012年 2月 20日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (NJK) | 36 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。