DS90C401
- Ultra Low Power Dissipation
- Operates Above 155.5 Mbps
- Standard TIA/EIA-644
- 8 Lead SOIC Package Saves Space
- Low Differential Output Swing typical 340 mV
All trademarks are the property of their respective owners.
The DS90C401 is a dual driver device optimized for high data rate and low power applications. This device along with the DS90C402 provides a pair chip solution for a dual high speed point-to-point interface. The DS90C401 is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8 lead small outline package. The differential driver outputs provides low EMI with its low output swings typically 340 mV.
技術文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 4 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver datasheet (Rev. C) | 2013年 4月 17日 | |
| Application note | Capacitive Touch Design Flow for MSP430™ MCUs With CapTIvate™ Technology (Rev. B) | PDF | HTML | 2019年 8月 14日 | |
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
| Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOIC (D) | 8 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。