DS90CF564
- 20 to 65 MHz Shift Clk Support
- Up to 171 Mbytes/s Bandwidth
- Cable Size is Reduced to Save Cost
- 290 mV Swing LVDS Devices for Low EMI
- Low Power CMOS Design (< 550 mW typ)
- Power-down Mode Saves Power (< 0.25 mW)
- PLL Requires No External Components
- Low Profile 48-Lead TSSOP Package
- Falling Edge Data Strobe
- Compatible with TIA/EIA-644 LVDS Standard
- Single Pixel Per Clock XGA (1024 x 768)
- Supports VGA, SVGA, XGA and Higher
- 1.3 Gbps Throughput
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The DS90CF563 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. The DS90CF564 receiver converts the LVDS data streams back into 21 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 18 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 171 Mbytes per second. These devices are offered with falling edge data strobes for convenient interface with a variety of graphics and LCD panel controllers.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | DS90CF563/DS90CF564 LVDS 18-Bit Color Flat Panel Display(FPD) Link - 65 MHz datasheet (Rev. E) | 2013/4/17 | |||
| 應用說明 | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018/11/9 | ||||
| 應用說明 | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018/6/29 | ||||
| 應用說明 | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017/8/8 | ||||
| 應用說明 | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004/5/15 | ||||
| 應用說明 | AN-1056 STN Application Using FPD-Link | 2004/5/14 | ||||
| 應用說明 | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004/5/14 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 48 | Ultra Librarian |