DS92001

現行

3.3V B/LVDS-Blvds 緩衝器

產品詳細資料

Function Buffer Protocols BLVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 400 Input signal LVDS, LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Buffer Protocols BLVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 400 Input signal LVDS, LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 8 29.4 mm² 4.9 x 6 WSON (NGK) 8 9 mm² 3 x 3
  • Single +3.3 V Supply
  • Receiver Inputs Accept LVDS/CML/LVPECL Signals
  • TRI-STATE Outputs
  • Receiver Input Threshold < ±100 mV
  • Fast Propagation Delay of 1.4 ns (typ)
  • Low Jitter 400 Mbps Fully Differential Data Path
  • Compatible with BLVDS 10-bit SerDes (40MHz)
  • Compatible with ANSI/TIA/EIA-644-A LVDS Standard
  • Available in SOIC and Space Saving WSON Package
  • Industrial Temperature Range

All trademarks are the property of their respective owners.

  • Single +3.3 V Supply
  • Receiver Inputs Accept LVDS/CML/LVPECL Signals
  • TRI-STATE Outputs
  • Receiver Input Threshold < ±100 mV
  • Fast Propagation Delay of 1.4 ns (typ)
  • Low Jitter 400 Mbps Fully Differential Data Path
  • Compatible with BLVDS 10-bit SerDes (40MHz)
  • Compatible with ANSI/TIA/EIA-644-A LVDS Standard
  • Available in SOIC and Space Saving WSON Package
  • Industrial Temperature Range

All trademarks are the property of their respective owners.

The DS92001 B/LVDS-BLVDS Buffer takes a BLVDS input signal and provides a BLVDS output signal. In many large systems, signals are distributed across backplanes. One of the limiting factors for system speed is the "stub length" or the distance between the transmission line and the unterminated receivers on individual cards. Although it is generally recognized that this distance should be as short as possible to maximize system performance, real-world packaging concerns often make it difficult to make the stubs as short as the designer would like.

The DS92001 has edge transitions optimized for multidrop backplanes where the switching frequency is in the 200 MHz range or less. The output edge rate is critical in some systems where long stubs may be present, and utilizing a slow transition allows for longer stub lengths.

The DS92001, available in the WSON package, will allow the receiver inputs to be placed very close to the main transmission line, thus improving system performance.

A wide input dynamic range allows the DS92001 to receive differential signals from LVPECL, CML as well as LVDS sources. This will allow the device to also fill the role of an LVPECL-BLVDS or CML-BLVDS translator.

The DS92001 B/LVDS-BLVDS Buffer takes a BLVDS input signal and provides a BLVDS output signal. In many large systems, signals are distributed across backplanes. One of the limiting factors for system speed is the "stub length" or the distance between the transmission line and the unterminated receivers on individual cards. Although it is generally recognized that this distance should be as short as possible to maximize system performance, real-world packaging concerns often make it difficult to make the stubs as short as the designer would like.

The DS92001 has edge transitions optimized for multidrop backplanes where the switching frequency is in the 200 MHz range or less. The output edge rate is critical in some systems where long stubs may be present, and utilizing a slow transition allows for longer stub lengths.

The DS92001, available in the WSON package, will allow the receiver inputs to be placed very close to the main transmission line, thus improving system performance.

A wide input dynamic range allows the DS92001 to receive differential signals from LVPECL, CML as well as LVDS sources. This will allow the device to also fill the role of an LVPECL-BLVDS or CML-BLVDS translator.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
類型 標題 日期
* Data sheet DS92001 3.3V B/LVDS-BLVDS Buffer datasheet (Rev. F) 2013年 4月 22日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SOIC (D) 8 Ultra Librarian
WSON (NGK) 8 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片