LMH0302
- Supports ST 424 (3G), 292 (HD), and 259 (SD)
- Data Rates up to 2.97 Gbps
- Supports DVB-ASI at 270 Mbps
- 100-Ω Differential Input
- 75-Ω Single-Ended Outputs
- Selectable Slew Rate
- Output Driver Power-Down Control
- Single 3.3-V Supply Operation
- Industrial Temperature Range: –40°C to 85°C
- Typical Power Consumption: 125 mW in SD Mode
and 165 mW in HD Mode - 16-Pin WQFN Package
- Footprint Compatible With the LMH0002SQ
- Replaces the Gennum GS2978
The LMH0302 3-Gbps HD/SD SDI cable driver is designed for use in ST 424, ST 292, ST 344,
and ST 259 serial digital video applications. The LMH0302 drives 75-Ω transmission lines (Belden
1694A, Belden 8281, or equivalent) at data rates up to
2.97 Gbps.
The LMH0302 provides two selectable slew rates for ST 259 and ST 424 or 292 compliance. The output driver may be powered down through the output driver enable pin.
The LMH0302 is powered from a single 3.3-V supply. Power consumption is typically 125 mW in SD mode and 165 mW in HD mode. The LMH0302 is available in a 16-pin WQFN package.
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
參考設計
TIDA-00424 — 視訊同步與視訊時鐘產生和分配參考設計
A video clock sub-system designed to perform video sync separation and derives synchronous video clocks for video and audio sub-systems.
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RUM) | 16 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。