SN65HVD37
- Low-Current Standby Mode: <1 µA Typical
- Operational Quiescent Current < 1 mA
- High Receiver Hysteresis for Noise Immunity (60 mV Typical)
- 1/8 Unit-Load (Up to 256 Nodes on the Bus)
- Bus-pin ESD Protection Exceeds 15 kV HBM
- Driver Output Transition Times Optimized for Signaling Rate up to 20 Mbps
- Glitch-Free Power-Up and Power-Down Protection for Hot-Plugging Applications
- 5V-Tolerant Logic Inputs
- Bus Idle, Open, and Short-Circuit Failsafe
- Driver Current Limiting and Thermal Shutdown
- Fully Meets All TIA-485-A Specifications
The SN65HVD37 combines a robust differential driver and a receiver with high noise immunity for demanding industrial applications. The driver differential outputs and the receiver differential inputs are separate pins, to form a bus port for full-duplex (four-wire) communications. The driver and receiver can be independently enabled, and feature a wide common-mode voltage range, making this device suitable for multi-point applications over long cable runs. The SN65HVD37 is characterized over the temperature range of 40ºC to 85 ºC.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Low-Power 3.3V-Supply Full-Duplex RS-485 Driver/Receiver datasheet (Rev. A) | 2011年 11月 29日 | |
| Application note | Comparison of Differential-Mode Noise Immunity of RS-485 Recvrs W/3.3-V Supply | 2011年 11月 29日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
RS485-FL-DPLX-EVM — RS-485 全雙工評估模組
The RS-485 full-duplex evaluation module (EVM) helps designers evaluate device performance, supporting fast development and analysis of data transmission systems using any of the SN65HVD147x, SN65HVD179x, SN65HVD3x, SN65HVD5x and SN65HVD7x full-duplex transceivers in a 14-pin D package. The (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。