Packaging information
| Package | Pins HVSSOP (DGN) | 8 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 2,500 | LARGE T&R |
Features for the TPS798-Q1
- AEC-Q100 qualified for automotive applications:
- Temperature grade 1: −40°C to +125°C, TA
- Wide input voltage range: 3V to 50V
- Low quiescent current: 40µA (typical)
- Low dropout voltage: 300mV (typical)
- Output current: 50mA
- No input protection diodes needed
- Adjustable output: From 1.275V to 28V
- Quiescent current in shutdown: 1µA
- Stable with 1µF output capacitor
- Stable with aluminum, tantalum, or ceramic capacitors
- Reverse input-battery protection
- Reverse output current flow protection
- Thermal limiting
- Available in an 8-pin HVSSOP PowerPAD device package
Description for the TPS798-Q1
The TPS798-Q1 is the first device in a line of 50V high-voltage micropower low-dropout (LDO) linear regulators. This device is capable of supplying 50mA output current with a dropout voltage of only 300mV. Created for low quiescent current, high-voltage (50V) applications, the 40µA operating and 1µA quiescent current in shutdown makes the TPS798-Q1 designed for battery-powered or high-voltage systems. Quiescent current is also well-controlled in dropout.
Other features of the TPS798-Q1 include the ability to operate with low equivalent series resistance (ESR) ceramic output capacitors. This device is stable with only 1µF on the output; most older devices require from 10µF to 100µF tantalum capacitors for stability. Small ceramic capacitors can be used without the necessary addition of ESR, as is common with other regulators. Internal protection circuitry includes reverse input-battery protection, reverse output current protection, current limiting, and thermal limiting to protect the device in various fault conditions.
This device is available in a fixed output voltage of 5V (TPS79850) and with an adjustable output voltage with a 1.275V reference voltage (TPS79801). The TPS798-Q1 regulator is available in a 8-pin HVSSOP PowerPAD (DGN) package with an exposed pad for enhanced thermal management capability.