Power management

DC/DC buck modules

The simplest and smallest option for step-down DC/DC voltage conversion

DC/DC buck modules integrate inductors, FETs, compensation, and other passive components into a single package to simplify the design process and speed customer time-to-market with a minimized power supply footprint. TI features the industry's most diverse portfolio of step-down modules, reaching 60VIN and 60A with a variety of packaging options to choose from.

simplify your DC/DC design


TI's integrated-inductor step-down power modules greatly simplify the process of DC/DC design compared to discrete converter and controller ICs

  • Optimal converter selected for the specification
  • Reduced component sourcing and qualification
  • Optimized layout for EMI and thermal performance
  • Fully characterized across the operating range
shrink your DC/DC design


DC/DC buck modules minimize power supply solution size to maximize power density and meet challenging PCB area constraints

  • Integrated controller, FETs, inductor, passives
  • IC package sizes as small as 2.3mm x 2.9mm
  • Up to 40% PCB area reduction compared to discrete

Select device by package type


Small solution size and high power density for space-constrained applications.

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QFN modules with leadless packaging provide a small footprint for high-current, high-density designs.

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Open frame

Non-isolated DC/DC converter power modules built on PC board substrates with SMD or through-hole interface pins.

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Robust, exposed-lead packaging with low pin-count represents the ultimate in ease-of-use DC/DC design.

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Browse by key design characteristics

Wide input voltage

Wide VIN devices feature a maximum input voltage of greater than 30V and are typically deployed in nominal 12V, 24V, and 48V systems where high input voltage transients are common.

Low quiescent current

Switching regulators with ultra-low standby quiescent current increase light-load efficiency and extend battery life in portable and battery-operated applications.

Ease of use

SIMPLE SWITCHER devices are designed for ease of use from the ground up. Common features include high integration, low component count, and packaging with visual inspection capability.

High power density

Highlighted by the SWIFT and Power Module portfolios, these highly-integrated regulators feature high output current capability in compact, thermally-enhanced packaging

FPGA and processor attach

Your digital core craves an efficient power supply. Find the latest and greatest switching converters, controllers, and modules to power every rail of your FPGA or processor.

Low EMI and noise

Mitigating EMI and noise in your switching regulator design may be a challenge, but TI is here to help with loads of training material and innovative ICs.

Featured products


4.5V to 15V input, 0.35V to 2.0V output, 35A power module


36-V, 1-A step-down DC-DC power module in 3.8-mm × 3-mm package


4.5V-28V input, 1.2V-6.0V output, 2.5-A power module


4-V to 36-V input, 1-V to 18-V output, 6-A power module in 10x16x4mm QFN package with frequency sync

Buck modules design resources

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