• High-Efficiency 32-Bit CPU (TMS320C28x)
  • 60 MHz (16.67-ns Cycle Time)
  • 16 × 16 and 32 × 32 MAC Operations
  • 16 × 16 Dual MAC
  • Harvard Bus Architecture
  • Atomic Operations
  • Fast Interrupt Response and Processing
  • Unified Memory Programming Model
  • Code-Efficient (in C/C++ and Assembly)
• Programmable Control Law Accelerator (CLA)
  • 32-Bit Floating-Point Math Accelerator
  • Executes Code Independently of the Main CPU
• Endianness: Little Endian
• JTAG Boundary Scan Support
  • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
• Low Cost for Both Device and System:
  • Single 3.3-V Supply
  • No Power Sequencing Requirement
  • Integrated Power-on Reset and Brown-out Reset
  • Low Power
  • No Analog Support Pins
• Clocking:
  • Two Internal Zero-Pin Oscillators
  • On-Chip Crystal Oscillator and External Clock Input
  • Watchdog Timer Module
  • Missing Clock Detection Circuitry
• Up to 45 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
• Peripheral Interrupt Expansion (PIE) Block That Supports All Peripheral Interrupts
• Three 32-Bit CPU Timers
• Independent 16-Bit Timer in Each Enhanced Pulse Width Modulator (ePWM)
• On-Chip Memory
  • Flash, SARAM, OTP, Boot ROM Available
• Code-Security Module
• 128-Bit Security Key and Lock
  • Protects Secure Memory Blocks
  • Prevents Firmware Reverse Engineering
• Serial Port Peripherals
  • One Serial Communications Interface (SCI) Universal Asynchronous Receiver/Transmitter (UART) Module
  • Two Serial Peripheral Interface (SPI) Modules
  • One Inter-Integrated-Circuit (I2C) Module
  • One Local Interconnect Network (LIN) Module
  • One Enhanced Controller Area Network (eCAN) Module
• Enhanced Control Peripherals
  • ePWM
  • High-Resolution PWM (HRPWM)
  • Enhanced Capture (eCAP) Module
  • High-Resolution Input Capture (HRCAP) Module
  • Enhanced Quadrature Encoder Pulse (eQEP) Module
  • Analog-to-Digital Converter (ADC)
  • On-Chip Temperature Sensor
  • Comparator
• Advanced Emulation Features
  • Analysis and Breakpoint Functions
  • Real-Time Debug Through Hardware
• Package Options
  • 56-Pin RSH Very Thin Quad Flatpack (No Lead) (VQFN)
  • 64-Pin PAG Thin Quad Flatpack (TQFP)
  • 80-Pin PN Low-Profile Quad Flatpack (LQFP)
• Temperature Options
  • T: –40°C to 105°C
  • S: –40°C to 125°C
  • Q: –40°C to 125°C
    (AEC Q100 Qualification for Automotive Applications)

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