SCAS928D May   2012  – April 2019 CDCUN1208LP

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Pin Configuration Overview
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Digital Input Electrical Characteristics – OE (SCL), INSEL, ITTP, OTTP, Divide (SDA/MOSI), ERC(ADDR/CS), Mode
    6. 6.6  Universal Input (IN1, IN2) Characteristics
    7. 6.7  Clock Output Buffer Characteristics (Output Mode = LVDS)
    8. 6.8  Clock Output Buffer Characteristics (Output Mode = HCSL)
    9. 6.9  Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS)
    10. 6.10 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    11. 6.11 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Test Configurations
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Device Control Using Configuration Pins
        1. 8.3.1.1 Configuration of Output Type (OTTP)
        2. 8.3.1.2 Configuration of Edge Rate Control (ERC)
        3. 8.3.1.3 Control of Output Enable (OE)
      2. 8.3.2 Input Ports (IN1, IN2)
        1. 8.3.2.1 Configuration of the Input Type (ITTP)
        2. 8.3.2.2 Configuration of the IN2 Divider (INDIV)
      3. 8.3.3 Smart Input Multiplexer (INMUX)
        1. 8.3.3.1 Pin Configuration of the Smart Input Multiplexer (INMUX)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Control Using the Host Interface
        1. 8.4.1.1 OE and INSEL in Host Configuration Mode
    5. 8.5 Programming
      1. 8.5.1 Host Interface Hardware Information
        1. 8.5.1.1 SPI Communication
          1. 8.5.1.1.1 CDCUN1208LP SPI Addressing
          2. 8.5.1.1.2 Writing to the CDCUN1208LP
          3. 8.5.1.1.3 Reading From the CDCUN1208LP
          4. 8.5.1.1.4 Block Write/Read Operation
        2. 8.5.1.2 I2C Communication
          1. 8.5.1.2.1 Message Transmission
            1. 8.5.1.2.1.1 Data and Address Bits
            2. 8.5.1.2.1.2 Special Symbols – Start (S) and Stop (P)
            3. 8.5.1.2.1.3 Special Symbols – Acknowledge (ACK)
            4. 8.5.1.2.1.4 Generic Message Frame
            5. 8.5.1.2.1.5 CDCUN1208LP Message Format
            6. 8.5.1.2.1.6 CDCUN1208LP Device Addressing (I2C Address)
            7. 8.5.1.2.1.7 CDCUN1208LP Device Addressing (Register Address)
          2. 8.5.1.2.2 I2C Master and Slave Handshaking
          3. 8.5.1.2.3 Block Read/Write
          4. 8.5.1.2.4 I2C Timing
    6. 8.6 Register Maps
      1. 8.6.1 Device Registers
        1. 8.6.1.1 Device Registers: Register 00-07
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 PCI Express Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
  10. 10Power Supply Recommendations
    1. 10.1 CDCUN1208LP Power Consumption
    2. 10.2 Device Power Supply Connections and Sequencing
    3. 10.3 Device Inputs (IN1, IN2)
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Clock Output Buffer Characteristics (Output Mode = HCSL)

Unless otherwise noted, VDDOx = 1.8 V, 2.5 V, 3.3 V; TA = –40°C to 85°C. See Figure 18, Figure 19, and Figure 20.
Supporting PCIe Gen1, Gen2, Gen3.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fOUT Output frequency 0.008 400 MHz
Vmax Absolute maximum output voltage(1) See Figure 1 1.15 V
Vmin Absolute minimum output voltage(2) See Figure 1 –0.3 V
VOH Single-ended output voltage – high(3) RL = single ended to GND = 50 Ω, CL = 2 pF,
VDDOx = 2.5 V, 3.3 V See Figure 18
600 mV
RL = single ended to GND = 50 Ω, CL = 2 pF,
VDDOx = 1.8 V See Figure 18
550
VOL Single-ended output voltage – low(3) RL = single ended to GND = 50 Ω, CL = 2 pF,
See Figure 18
150 mV
VCROSS Output crossing point voltage(3) See Figure 1 250 550 mV
VCROSSΔ VCROSS Total variation(3) See Figure 2 140 mV
VRB Ring back voltage margin(3) See Figure 3 –100 100 mV
TSTABLE Time before VRB is Allowed(3),(4) See Figure 3 500 ps
VOS Output AC common mode VIN, DIFF, PP = 0.9 V, RL = single ended to GND = 50 Ω, 2 pF 75 125 mVP-P
TjitHCSL Additive jitter, input set to HCSL(5) fOUT = 100 MHz, 10k-20M integration bandwidth. Differential measurement 380 fs, rms
TjitLVDS Additive jitter, input set to LVDS(5) fOUT = 100 MHz, 10k-20M integration bandwidth. Differential measurement 280 fs, rms
tR/tF Output rise/fall time(6) Slow, +150-mV differential, see Figure 4, VDDOx = 3.3 V 300 ps
Slow, +150-mV differential, see Figure 4, VDDOx = 1.8 V 230
Med., +150-mV differential, see Figure 4, VDDOx = 3.3 V 240
Med., +150-mV differential, see Figure 4, VDDOx = 1.8 V 180
Fast, +150-mV differential, see Figure 4 140
TMRF Output rise/fall time matching See Figure 5 20%
ODC Output duty cycle(7) Differential measurement, see Figure 6 45% 55%
TDLYO Propagation delay ERC set to high rate. Input tr, tf > 0.6 V/ns, VDD = 2.5 V, 3.3 V 3.8 ns
ERC set to high rate. Input tr, tf > 0.6 V/ns, VDD = 1.8 V 4.3
tSKEW Skew between outputs(8) Differential Measurement, Input tr, tf > 0.6 V/ns 35 50 ps
tOE Output enable to stable clock output Pin mode, fout = 100 MHz, device in active mode with outputs disabled, OE asserted 2 µs
tPD PD de-asserted to stable clock output Host mode, fout = 100 MHz, device in power down mode, PD de-asserted 15 µs
tPU Time from power applied to stable clock output(9) Pin mode, fout = 100 MHz, OE asserted, measured from time VDD is valid to stable output 1 ms
Single-ended measurement includes overshoot. Measurement is taken at load capacitors CL (see Figure 18).
Single-ended measurement, includes undershoot. Measurement is taken at load capacitors CL (see Figure 18).
Measurement is taken at load capacitors CL (see Figure 18). If VDDOx = 1.8 V, the specified minimum VOH is 550 mV.
TSTABLE is the time the differential clock must maintain a minimum ±150 mV differential voltage after rising/falling edges, before it is allowed to return into the VRB ±100 mV differential range. See Figure 3.
tRfin = tFfin ≥ 0.6 V/ns.
Measured from –150 mV to +150 mV on the differential waveform. The signal must be monotonic through the measurement region for rise and fall time. The 300-mV measurement window is centered on the differential zero crossing. Slow is 0.53 V/ns, medium is 1.05 V/ns, and fast is 2.1 V/ns. The PCIe CEM spec. has a window of 0.6 V/ns to 4 V/ns.
Assumes input duty cycle = 50%.
Skew measured between identical output types with identical loads, identical output power supplies, and identical edge rate settings.
Parameter depends significantly on power supply design and supply voltage rise time.