SCAS928D May   2012  – April 2019 CDCUN1208LP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Pin Configuration Overview
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Digital Input Electrical Characteristics – OE (SCL), INSEL, ITTP, OTTP, Divide (SDA/MOSI), ERC(ADDR/CS), Mode
    6. 6.6  Universal Input (IN1, IN2) Characteristics
    7. 6.7  Clock Output Buffer Characteristics (Output Mode = LVDS)
    8. 6.8  Clock Output Buffer Characteristics (Output Mode = HCSL)
    9. 6.9  Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS)
    10. 6.10 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    11. 6.11 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Configurations
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Device Control Using Configuration Pins
        1. 8.3.1.1 Configuration of Output Type (OTTP)
        2. 8.3.1.2 Configuration of Edge Rate Control (ERC)
        3. 8.3.1.3 Control of Output Enable (OE)
      2. 8.3.2 Input Ports (IN1, IN2)
        1. 8.3.2.1 Configuration of the Input Type (ITTP)
        2. 8.3.2.2 Configuration of the IN2 Divider (INDIV)
      3. 8.3.3 Smart Input Multiplexer (INMUX)
        1. 8.3.3.1 Pin Configuration of the Smart Input Multiplexer (INMUX)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Control Using the Host Interface
        1. 8.4.1.1 OE and INSEL in Host Configuration Mode
    5. 8.5 Programming
      1. 8.5.1 Host Interface Hardware Information
        1. 8.5.1.1 SPI Communication
          1. 8.5.1.1.1 CDCUN1208LP SPI Addressing
          2. 8.5.1.1.2 Writing to the CDCUN1208LP
          3. 8.5.1.1.3 Reading From the CDCUN1208LP
          4. 8.5.1.1.4 Block Write/Read Operation
        2. 8.5.1.2 I2C Communication
          1. 8.5.1.2.1 Message Transmission
            1. 8.5.1.2.1.1 Data and Address Bits
            2. 8.5.1.2.1.2 Special Symbols – Start (S) and Stop (P)
            3. 8.5.1.2.1.3 Special Symbols – Acknowledge (ACK)
            4. 8.5.1.2.1.4 Generic Message Frame
            5. 8.5.1.2.1.5 CDCUN1208LP Message Format
            6. 8.5.1.2.1.6 CDCUN1208LP Device Addressing (I2C Address)
            7. 8.5.1.2.1.7 CDCUN1208LP Device Addressing (Register Address)
          2. 8.5.1.2.2 I2C Master and Slave Handshaking
          3. 8.5.1.2.3 Block Read/Write
          4. 8.5.1.2.4 I2C Timing
    6. 8.6 Register Maps
      1. 8.6.1 Device Registers
        1. 8.6.1.1 Device Registers: Register 00-07
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 PCI Express Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
  10. 10Power Supply Recommendations
    1. 10.1 CDCUN1208LP Power Consumption
    2. 10.2 Device Power Supply Connections and Sequencing
    3. 10.3 Device Inputs (IN1, IN2)
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Test Configurations

CDCUN1208LP test_setup_cas928.gifFigure 15. CDCUN1208LP LVDS Output - Test Setup
CDCUN1208LP skew_setup_cas928.gifFigure 16. CDCUN1208LP LVDS Output - Propagation Delay/Skew Measurement Setup
CDCUN1208LP noise_jitt_stup_cas928.gifFigure 17. CDCUN1208LP LVDS Output - Phase Noise/Jitter Measurement Setup

Figure 18 shows the configuration used to measure the HCSL buffer characteristics. Either single-ended probes with math or differential probes can be used for differential measurements. The 50-Ω differential trace length is up to 15 inches.

CDCUN1208LP load_conf_cas928.gifFigure 18. CDCUN1208LP HCSL Output – Measurement Configuration With Load
CDCUN1208LP prop_dly_skew_cas928.gifFigure 19. CDCUN1208LP HCSL Output – Propagation Delay/Skew Measurement
CDCUN1208LP phs_noise_conf_cas928.gifFigure 20. CDCUN1208LP HCSL Output – Phase Noise/Jitter Measurement Configuration
CDCUN1208LP LVCMOS_conf_cas928.gifFigure 21. CDCUN1208LP LVCMOS Output – Measurement Configuration
CDCUN1208LP LVCMOS_noise_jitt_stup_cas928.gifFigure 22. CDCUN1208LP LVCMOS Output – Phase Noise/Jitter Measurement Setup
CDCUN1208LP universal_setup_cas928.gifFigure 23. CDCUN1208LP Universal Input - Differential Mode Measurement Setup
CDCUN1208LP single_ended_setup_cas928.gifFigure 24. CDCUN1208LP Universal Input - Single-Ended Mode Measurement Setup
CDCUN1208LP pwr_consum_setup_cas928.gifFigure 25. CDCUN1208LP Power Consumption Measurement Setup