SCAS928D May   2012  – April 2019 CDCUN1208LP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Pin Configuration Overview
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Digital Input Electrical Characteristics – OE (SCL), INSEL, ITTP, OTTP, Divide (SDA/MOSI), ERC(ADDR/CS), Mode
    6. 6.6  Universal Input (IN1, IN2) Characteristics
    7. 6.7  Clock Output Buffer Characteristics (Output Mode = LVDS)
    8. 6.8  Clock Output Buffer Characteristics (Output Mode = HCSL)
    9. 6.9  Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS)
    10. 6.10 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    11. 6.11 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Configurations
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Device Control Using Configuration Pins
        1. 8.3.1.1 Configuration of Output Type (OTTP)
        2. 8.3.1.2 Configuration of Edge Rate Control (ERC)
        3. 8.3.1.3 Control of Output Enable (OE)
      2. 8.3.2 Input Ports (IN1, IN2)
        1. 8.3.2.1 Configuration of the Input Type (ITTP)
        2. 8.3.2.2 Configuration of the IN2 Divider (INDIV)
      3. 8.3.3 Smart Input Multiplexer (INMUX)
        1. 8.3.3.1 Pin Configuration of the Smart Input Multiplexer (INMUX)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Control Using the Host Interface
        1. 8.4.1.1 OE and INSEL in Host Configuration Mode
    5. 8.5 Programming
      1. 8.5.1 Host Interface Hardware Information
        1. 8.5.1.1 SPI Communication
          1. 8.5.1.1.1 CDCUN1208LP SPI Addressing
          2. 8.5.1.1.2 Writing to the CDCUN1208LP
          3. 8.5.1.1.3 Reading From the CDCUN1208LP
          4. 8.5.1.1.4 Block Write/Read Operation
        2. 8.5.1.2 I2C Communication
          1. 8.5.1.2.1 Message Transmission
            1. 8.5.1.2.1.1 Data and Address Bits
            2. 8.5.1.2.1.2 Special Symbols – Start (S) and Stop (P)
            3. 8.5.1.2.1.3 Special Symbols – Acknowledge (ACK)
            4. 8.5.1.2.1.4 Generic Message Frame
            5. 8.5.1.2.1.5 CDCUN1208LP Message Format
            6. 8.5.1.2.1.6 CDCUN1208LP Device Addressing (I2C Address)
            7. 8.5.1.2.1.7 CDCUN1208LP Device Addressing (Register Address)
          2. 8.5.1.2.2 I2C Master and Slave Handshaking
          3. 8.5.1.2.3 Block Read/Write
          4. 8.5.1.2.4 I2C Timing
    6. 8.6 Register Maps
      1. 8.6.1 Device Registers
        1. 8.6.1.1 Device Registers: Register 00-07
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 PCI Express Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
  10. 10Power Supply Recommendations
    1. 10.1 CDCUN1208LP Power Consumption
    2. 10.2 Device Power Supply Connections and Sequencing
    3. 10.3 Device Inputs (IN1, IN2)
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

TA = –40°C TO 85°C
MIN NOM MAX UNIT
POWER SUPPLIES(1)(2)(3)
VDD DC power supply - core 1.8-V mode 1.7 1.8 1.9 V
VDDOx DC power supply - output 1.8-V mode 1.7 1.8 1.9 V
VDD DC power supply - core 2.5-V mode 2.375 2.5 2.625 V
VDDOx DC power supply - output 2.5-V mode 2.375 2.5 2.625 V
VDD DC power supply - core 3.3-V mode 2.97 3.3 3.63 V
VDDOx DC power supply - output 3.3-V mode 2.97 3.3 3.63 V
ΔV/ΔT2 Core power supply slew rate 0.4-V to 1.8-V × 0.8 (in all voltage modes) 6500 V/s
TEMPERATURE
TA Free- air temperature –40 85 °C
(1) For proper device operation, the core power supply voltage (pin 5) must be applied either before the application of any output power supply, or simultaneously with the application of the output power supplies. The application of an output power supply prior to the application of the core power supply could result in improper device behavior.
(2) A minimum VDD slew rate of 6500 V/s should be obtained to ensure proper device functionality in pin mode. If the ambient temperature of the device is > 0°C, the slew rate can be as slow as 5000 V/s. In host mode (I2C/SPI), the VDD slew rate is not limited, if the Reset bit gets toggled after VDD ramp.
(3) VDD and VDDOx can be operated from different supply voltages. Refer to Configuration of Output Type (OTTP)for more details.