SBOSA39A April   2025  – October 2025 THS3470

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics ±VS = ±30V
    6. 5.6 Electrical Characteristics ±VS = ±20V
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Current Limit
      2. 6.3.2 Output Current Enable
      3. 6.3.3 Over Temperature Flag
      4. 6.3.4 Output Current Flags
      5. 6.3.5 Output Current Monitoring
      6. 6.3.6 Die Temperature Monitoring
      7. 6.3.7 External Compensation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Modes
      2. 6.4.2 Choosing a Feedback Resistor
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 High-Voltage, High-Precision, Composite Amplifier
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 120V Bootstrap Amplifier
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Performance Plots
    3. 7.3 Short Circuit Protection
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Thermal Considerations
        1. 7.5.1.1 Top-Side Cooling Benefits
        2. 7.5.1.2 THS3470 Safe Operating Area
      2. 7.5.2 Layout Guidelines
      3. 7.5.3 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 TAPE AND REEL INFORMATION

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • REB|42
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.7 External Compensation

The THS3470 COMP pin can be used to limit the bandwidth or slew rate of the amplifier by connecting an external capacitor between the COMP pin and the VOUT pin. Figure 6-8 shows a conceptual block diagram of how the COMP pin acts as an external output compensation network for the device. Using the COMP pin is a context dependent situation, as shown by Figure 6-9 and Figure 6-10, and is typically used in high capacitive load applications needing lower isolation resistances to help properly damp the control loop of the amplifier.

Note: If the compensation pin is not being used, system designers must leave the pin floating and remove the ground plane around and under the pin on the PCB. Parasitic capacitance on the COMP pin can create an undesired reduction in the device's bandwidth and slew rate.
THS3470 THS3470 COMP Pin Conceptual Block Diagram Figure 6-8 THS3470 COMP Pin Conceptual Block Diagram
THS3470 THS3470 Small-Signal Bandwidth vs CCOMP (RS = 0Ω, CLOAD = 1nF)Figure 6-9 THS3470 Small-Signal Bandwidth vs CCOMP (RS = 0Ω, CLOAD = 1nF)
THS3470 THS3470 Large Signal Step vs CCOMP (RS = 0Ω, CLOAD = 1nF)Figure 6-10 THS3470 Large Signal Step vs CCOMP (RS = 0Ω, CLOAD = 1nF)