SBOSA39A April   2025  – October 2025 THS3470

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics ±VS = ±30V
    6. 5.6 Electrical Characteristics ±VS = ±20V
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Current Limit
      2. 6.3.2 Output Current Enable
      3. 6.3.3 Over Temperature Flag
      4. 6.3.4 Output Current Flags
      5. 6.3.5 Output Current Monitoring
      6. 6.3.6 Die Temperature Monitoring
      7. 6.3.7 External Compensation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Modes
      2. 6.4.2 Choosing a Feedback Resistor
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 High-Voltage, High-Precision, Composite Amplifier
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 120V Bootstrap Amplifier
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Performance Plots
    3. 7.3 Short Circuit Protection
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Thermal Considerations
        1. 7.5.1.1 Top-Side Cooling Benefits
        2. 7.5.1.2 THS3470 Safe Operating Area
      2. 7.5.2 Layout Guidelines
      3. 7.5.3 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 TAPE AND REEL INFORMATION

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • REB|42
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Power Supply Recommendations

The THS3470 is designed to operate on power supplies ranging from ±6V to ±30V (single-ended supplies of 12V to 60V). Use a power-supply accuracy of 5% or better. Power supplies must be designed for the expected maximum output current from VOUT for both resistive and capacitive loads. The THS3470 current limit circuitry does not limit the current for rapid transient currents, so adequate bypass capacitance on the VCC and VEE pins is mandatory. Place a 22μF tantalum or electrolytic capacitor and a 10μF X7R capacitor near the supply sources for VCC and VEE to provide bulk decoupling. VCC (pins 8–10, 25–27, 38–39), VEE (pins 15, 20, 29, 36, 41), VMID (pins 1–2), and VDD (pin 32) pins all require 100nF C0G or NP0 capacitors per pin grouping as shown in Section 7.5.3. Place the 100nF C0G or NP0 capacitors as close as possible to the THS3470 pins. In addition, shorten the current return path of the bypass capacitor ground connections as much as possible to minimize loop inductance. Ensure that all capacitors are rated for the correct voltages.